1. Product Overview
This document details the specifications for a through-hole mounted LED indicator lamp. The device consists of a yellow-green AlInGaP LED chip housed within a black plastic right-angle holder, featuring a green diffused lens. This configuration is designed as a Circuit Board Indicator (CBI), offering ease of assembly and enhanced visual contrast against the board.
1.1 Core Features and Target Market
The primary advantages of this component include its design for simplified PCB assembly, low power consumption, high efficiency, and compliance with lead-free and RoHS standards. The black housing significantly improves the contrast ratio, making the indicator more visible. It is intended for a broad range of electronic applications, including computer peripherals, communication devices, consumer electronics, and industrial equipment.
2. Technical Parameter Analysis
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Key parameters include a maximum power dissipation of 52mW, a continuous forward current (IF) of 20mA, and a peak forward current of 60mA under pulsed conditions. The operating temperature range is specified from -30°C to +85°C. The derating factor for forward current is 0.27 mA/°C above 30°C ambient temperature. Lead soldering temperature must not exceed 260°C for a maximum of 5 seconds, with a minimum distance of 2.0mm from the LED body.
2.2 Electrical and Optical Characteristics
Measured at a standard test current of IF=10mA and TA=25°C, the device exhibits typical performance. The luminous intensity (Iv) has a typical value of 19 mcd, with a minimum of 8.7 mcd and a maximum of 50 mcd, classified into specific bins. The forward voltage (VF) is typically 2.5V, with a maximum of 2.5V. The dominant wavelength (λd) is typically 569 nm, defining the yellow-green color, with a spectral half-width of 15 nm. The viewing angle (2θ1/2) is a wide 100 degrees, characteristic of a diffused lens.
3. Bin Table Specification
The product is sorted into bins based on key optical parameters to ensure consistency in application.
3.1 Luminous Intensity Binning
Luminous intensity is categorized into four bin codes (L3, L2, L1, M1) with defined minimum and maximum values ranging from 8.7 mcd to 50 mcd at IF=10mA. A tolerance of ±15% is applied to each bin limit.
3.2 Dominant Wavelength Binning
The hue or color is controlled through dominant wavelength bins. Codes H06 through H09 cover a range from 566.0 nm to 574.0 nm, with a tight tolerance of ±1 nm for each bin limit, ensuring precise color matching.
4. Performance Curve Analysis
While specific graphical data is referenced in the document, typical curves for such devices would illustrate the relationship between forward current and luminous intensity, forward voltage versus temperature, and the spectral power distribution peaking around 572 nm. These curves are essential for designers to understand the device's behavior under different operating conditions and to optimize drive circuits for consistent performance across temperature variations.
5. Mechanical and Packaging Information
5.1 Outline Dimensions
The device uses a standard T-1 (3.0mm diameter) LED package mounted in a right-angle black plastic holder. Critical dimensions include pin spacing and the distance from the board to the lens. All dimensional tolerances are ±0.25mm unless otherwise specified. The holder material is noted as black plastic.
5.2 Packaging Specification
The components are supplied on 13-inch reels for automated assembly. Each reel contains 350 pieces. The carrier tape is made of black conductive polystyrene alloy with a thickness of 0.50 mm ±0.06 mm. Detailed reel and carrier tape dimensions are provided for compatibility with standard pick-and-place equipment.
6. Soldering and Assembly Guidelines
6.1 Storage and Handling
LEDs should be stored in an environment not exceeding 30°C and 70% relative humidity. If removed from the original moisture-barrier packaging, they should be used within three months or stored in a controlled dry environment (e.g., with desiccant or nitrogen).
6.2 Lead Forming
If required, leads must be bent at a point at least 3mm from the base of the LED lens. The bend must not use the LED body as a fulcrum. This operation must be performed at room temperature and before the soldering process.
6.3 Soldering Process
Clear guidelines are provided for both hand and wave soldering. A minimum distance of 2mm must be maintained between the solder point and the base of the lens/holder. The lens must never be immersed in solder.
- Hand Soldering: Iron temperature maximum 350°C for no more than 3 seconds per lead.
- Wave Soldering: Pre-heat to a maximum of 120°C for up to 100 seconds, followed by a solder wave at a maximum of 260°C for no more than 5 seconds.
6.4 Cleaning
Isopropyl alcohol or similar alcohol-based solvents are recommended for cleaning if necessary.
7. Application and Design Recommendations
7.1 Drive Circuit Design
LEDs are current-driven devices. To ensure uniform brightness when using multiple LEDs, it is strongly recommended to use a individual current-limiting resistor in series with each LED (Circuit Model A). Connecting LEDs directly in parallel without individual resistors (Circuit Model B) is discouraged, as slight variations in the forward voltage (Vf) characteristic of each LED will cause significant differences in current sharing and, consequently, brightness.
7.2 Electrostatic Discharge (ESD) Protection
The LED is susceptible to damage from electrostatic discharge. Proper ESD controls must be implemented during handling and assembly. This includes the use of grounded wrist straps, anti-static mats, grounded workstations, and ionizers to neutralize static charge that may accumulate on the plastic lens.
7.3 Typical Application Scenarios
This indicator lamp is suitable for a wide array of applications including status indicators on computer motherboards or peripherals, signal lights in networking equipment, power/function indicators in consumer appliances, and panel lights in industrial control systems. The right-angle form factor is particularly useful when the indicator needs to be visible from the front or side of an enclosure while being mounted perpendicularly on the PCB.
8. Technical Comparison and Design Considerations
Compared to non-diffused or narrow-viewing-angle LEDs, this device offers a wider, softer light emission ideal for status indication. The black holder provides superior contrast in both bright and dim ambient lighting conditions. Designers must carefully consider the current-limiting resistor value based on the supply voltage and the desired forward current (typically 10-20mA), while also accounting for power dissipation in the resistor. Thermal management on the PCB is generally not a concern for a single indicator at these power levels, but layout should still avoid placing heat-generating components directly adjacent to the LED.
9. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λP) is the wavelength at which the spectral output is maximum (572 nm typical). Dominant wavelength (λd) is derived from the color perception by the human eye (CIE chart) and is the single wavelength that best represents the perceived color (569 nm typical). For color definition, λd is more relevant.
Q: Can I drive this LED at 20mA continuously?
A: Yes, 20mA is the maximum continuous DC forward current rating. However, for longest lifetime and reliability, operating at or below the typical test current of 10mA is advisable if the application's brightness requirements allow it.
Q: How do I interpret the luminous intensity bin code?
A> The bin code (e.g., L2) printed on the packaging indicates the guaranteed range of light output for that batch of LEDs. For example, bin L2 guarantees an Iv between 12.6 and 19 mcd at 10mA. Selecting a specific bin ensures consistency in brightness across multiple units in your product.
10. Practical Design Case Study
Consider designing a front-panel status indicator for a router. The PCB is mounted vertically inside the chassis. Using this right-angle LED allows it to be soldered directly onto the vertical PCB, with its lens pointing sideways through a window in the case. The designer selects a current-limiting resistor for a 5V supply to achieve approximately 15mA forward current, resulting in a bright, clear indicator. The wide 100-degree viewing angle ensures the light is visible from a broad range in front of the device. The green diffused lens provides a pleasant, non-glaring light suitable for indoor environments.
11. Operating Principle
The device operates on the principle of electroluminescence in a semiconductor. When a forward bias voltage is applied across the AlInGaP (Aluminum Indium Gallium Phosphide) chip, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific composition of the semiconductor materials determines the bandgap energy, which defines the color of the emitted light—in this case, yellow-green. The diffused epoxy lens scatters the light, creating a wider and more uniform viewing angle.
12. Technology Trends
The use of AlInGaP materials for amber, yellow, and green LEDs represents a mature and highly efficient technology. Ongoing developments in the broader LED industry focus on increasing efficiency (lumens per watt), improving color rendering, and enabling higher power densities. For indicator-type LEDs, trends include further miniaturization, the integration of built-in resistors or ICs for simplified driving, and the development of ever-wider viewing angles and more precise color consistency through advanced binning and manufacturing processes. The right-angle through-hole package remains popular for its mechanical robustness and ease of manual or automated assembly in a wide variety of electronic products.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |