Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. In-Depth Technical Parameter Analysis
- 2.1 Electro-Optical Characteristics
- 2.2 Electrical and Thermal Parameters
- 3. Binning System Explanation
- 3.1 Luminous Flux and Forward Voltage Binning
- 3.2 Chromaticity Binning
- 4. Performance Curve Analysis
- 4.1 Spectral and Angular Distribution
- 4.2 Electrical and Thermal Dependencies
- 5. Mechanical and Package Information
- 5.1 Dimensions and Polarity
- 6. Soldering and Assembly Guidelines
- 7. Model Numbering System and Ordering Information
- 8. Application Recommendations
- 8.1 Typical Application Scenarios
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 11. Design and Usage Case Study
- 12. Operating Principle Introduction
- 13. Technology Trends
1. Product Overview
The T3C series represents a high-performance, top-view white LED designed for general lighting applications. This 3030 package (3.0mm x 3.0mm) is engineered to deliver high luminous flux output while maintaining a compact form factor suitable for modern, space-constrained lighting designs. Its thermally enhanced package design is a key feature, allowing for better heat dissipation and enabling reliable operation at higher drive currents, which contributes to its high current capability. The device is compatible with lead-free reflow soldering processes and is designed to remain compliant with RoHS directives, making it suitable for global markets with stringent environmental regulations.
1.1 Core Advantages and Target Market
The primary advantages of this LED include its high luminous efficacy, robust thermal performance, and wide 120-degree viewing angle, which ensures uniform light distribution. These characteristics make it an ideal choice for retrofit applications where it can replace traditional light sources, general ambient lighting, and both indoor and outdoor sign board backlighting. Its performance also suits architectural and decorative lighting projects where consistent color and high output are required.
2. In-Depth Technical Parameter Analysis
This section provides a detailed, objective interpretation of the key performance parameters specified in the datasheet, crucial for design engineers.
2.1 Electro-Optical Characteristics
The luminous flux output is specified at a test current of 120mA and a junction temperature (Tj) of 25°C. The typical values vary significantly with Correlated Color Temperature (CCT) and Color Rendering Index (CRI). For instance, a 4000K LED with a CRI of 70 (Ra70) has a typical luminous flux of 114 lumens, while the same CCT with a CRI of 90 (Ra90) drops to 91 lumens. This inverse relationship between CRI and light output is a fundamental trade-off in LED design. All luminous flux measurements have a stated tolerance of ±7%, and CRI measurements have a tolerance of ±2.
2.2 Electrical and Thermal Parameters
The absolute maximum ratings define the operational limits. The maximum continuous forward current (IF) is 200mA, with a pulsed forward current (IFP) of 300mA under specific conditions (pulse width ≤100μs, duty cycle ≤1/10). The maximum power dissipation (PD) is 1280mW. The forward voltage (VF) typically measures 6.0V at 120mA, with a range from 5.6V to 6.4V. A critical parameter for thermal management is the thermal resistance from the junction to the solder point (Rth j-sp), which is specified as 17°C/W. This value indicates how effectively heat is transferred from the LED chip to the printed circuit board, directly impacting the LED's lifetime and performance stability.
3. Binning System Explanation
The product is classified into bins to ensure consistency in key parameters, which is vital for applications requiring uniform light output and color.
3.1 Luminous Flux and Forward Voltage Binning
The luminous flux binning structure is complex, defined by CCT, CRI, and a flux code (e.g., 5D, 5E). For example, a 3000K, Ra80 LED can be binned as 5D (95-100 lm), 5E (100-105 lm), 5F (105-110 lm), or 5G (110-115 lm). Similarly, forward voltage is binned into four codes: Z3 (5.6-5.8V), A4 (5.8-6.0V), B4 (6.0-6.2V), and C4 (6.2-6.4V). This allows designers to select LEDs that match their driver circuit requirements for optimal efficiency.
3.2 Chromaticity Binning
The color consistency is controlled within a 5-step MacAdam ellipse on the CIE chromaticity diagram for each CCT bin (e.g., 27R5 for 2700K). The datasheet provides the center coordinates at both 25°C and 85°C, along with ellipse parameters (a, b, Φ). This tight binning, aligned with standards like Energy Star for 2600K-7000K, ensures minimal visible color difference between LEDs in the same batch, which is critical for multi-LED fixtures.
4. Performance Curve Analysis
Graphical data provides insight into the LED's behavior under different operating conditions.
4.1 Spectral and Angular Distribution
The color spectrum graphs (for Ra70, Ra80, Ra90) show the relative spectral power distribution. Higher CRI LEDs exhibit a more filled-out spectrum, particularly in the red region, leading to better color rendering but slightly lower overall efficacy. The viewing angle distribution graph confirms the wide 120-degree beam pattern, characterized by a Lambertian or near-Lambertian distribution.
4.2 Electrical and Thermal Dependencies
The Forward Current vs. Relative Intensity curve shows the super-linear relationship between drive current and light output. The Forward Current vs. Forward Voltage curve illustrates the diode's exponential IV characteristic. Perhaps most importantly, the Ambient Temperature vs. Relative Luminous Flux graph demonstrates the negative impact of rising temperature on light output. Similarly, the Ambient Temperature vs. Relative Forward Voltage graph shows the forward voltage's negative temperature coefficient, a key consideration for constant-current drivers.
5. Mechanical and Package Information
5.1 Dimensions and Polarity
The package is a standard 3030 footprint with dimensions of 3.00mm x 3.00mm and a height of 0.69mm. The bottom view diagram clearly shows the solder pad layout and polarity identification. The anode and cathode are marked, with the cathode typically indicated by a distinctive feature such as a notch or a green marking on the package itself. The soldering pattern is designed for reliable surface-mount assembly.
6. Soldering and Assembly Guidelines
The LED is rated for lead-free reflow soldering. The absolute maximum rating for soldering temperature (Tsld) is specified as 230°C or 260°C for a maximum of 10 seconds. This refers to the peak temperature measured at the LED solder pads during the reflow profile. It is critical to follow a recommended reflow profile that ramps up and cools down at controlled rates to prevent thermal shock, which can cause package cracking or solder joint failures. The operating temperature range is -40°C to +105°C, and the storage temperature range is -40°C to +85°C.
7. Model Numbering System and Ordering Information
The part number follows the structure: T3C***21A-*****. The specific codes within this structure define critical attributes:
- X1 (Type Code): '3C' for the 3030 package.
- X2 (CCT Code): e.g., '27' for 2700K, '40' for 4000K.
- X3 (Color Rendering): '7' for Ra70, '8' for Ra80, '9' for Ra90.
- X4 & X5 (Chip Configuration): Indicate the number of serial and parallel chips (1-Z).
- X6 (Component Code): Internal designation (A-Z).
- X7 (Color Code): Defines the chromaticity bin standard (e.g., 'R' for 85°C ANSI).
8. Application Recommendations
8.1 Typical Application Scenarios
This LED is well-suited for:
- Retrofit Lamps: Direct replacement for incandescent, halogen, or CFL bulbs in downlights, bulbs, and tubes.
- General Lighting: Linear fixtures, panel lights, and high-bay lighting where high flux and good uniformity are needed.
- Signage Backlighting: Edge-lit or direct-lit indoor/outdoor signs requiring consistent white light.
- Architectural Lighting: Cove lighting, facade lighting, and other decorative applications.
8.2 Design Considerations
Key design factors include:
- Thermal Management: The 17°C/W Rth j-sp necessitates an effective heatsink. Maintaining a low junction temperature is paramount for achieving rated lifetime and maintaining light output and color stability.
- Drive Current: While capable of up to 200mA, operating at or below the test current of 120mA often provides a better balance of efficacy, lifetime, and thermal load.
- Optics: The wide viewing angle may require secondary optics (lenses, reflectors) for applications needing a more focused beam.
- Binning Selection: For multi-LED designs, specifying tight bins for flux, voltage, and chromaticity is essential to avoid visible inconsistencies (color shift, brightness variation).
9. Technical Comparison and Differentiation
Compared to earlier packages like 3528 or 5050, the 3030 format offers a higher lumen density in a moderately sized package. Its thermally enhanced design typically gives it an advantage over standard 3030 packages in terms of maximum drive current and sustained light output at elevated temperatures. The availability of high CRI (Ra90) options within the same package provides designers with flexibility for applications where color quality is critical without needing to change the mechanical footprint.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the actual power consumption at the typical operating point?
A: At the test condition of IF=120mA and VF=6.0V, the electrical power is 0.72W (120mA * 6.0V = 720mW).
Q: How does temperature affect the light output?
A: As shown in Fig. 7, relative luminous flux decreases as ambient (and consequently junction) temperature increases. Proper heatsinking is required to minimize this drop.
Q: What driver topology is recommended?
A> A constant-current driver is mandatory for LEDs. The driver's output current should be set based on the desired light output and thermal design, not exceeding 200mA. The driver must also account for the forward voltage bin range (5.6V-6.4V).
Q: Can multiple LEDs be connected in series?
A: Yes, but the total series forward voltage must be within the driver's compliance voltage range. The variation in forward voltage bin should be considered to ensure uniform current sharing, especially in parallel strings.
11. Design and Usage Case Study
Scenario: Designing a 1200mm LED Tube Light for Office Retrofit.
A designer might use 120 pieces of the 4000K, Ra80, 5G bin (110-115 lm) LEDs arranged in a linear array. At 120mA per LED, the total system flux would be approximately 13,200-13,800 lumens. Using a constant-current driver rated for 120mA and a compliance voltage high enough to cover 120 LEDs in series (120 * ~6V = 720V) or a combination of series-parallel strings. An aluminum channel acts as both the structure and the heatsink, designed to keep the LED junction temperature below 85°C to maintain >90% of initial lumen output over the target lifespan. The wide viewing angle ensures good illumination of the work surface without excessive glare.
12. Operating Principle Introduction
A white LED typically uses a blue light-emitting indium gallium nitride (InGaN) semiconductor chip. Part of this blue light is converted to longer wavelengths (yellow, red) by a phosphor layer coating the chip. The mixture of the remaining blue light and the phosphor-converted light results in the perception of white light. The specific blend of phosphors determines the CCT (warm white, cool white) and CRI. The electrical principle is that of a semiconductor diode: when a forward voltage exceeding its bandgap is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (light).
13. Technology Trends
The general trend in mid-power LEDs like the 3030 is toward higher efficacy (more lumens per watt), improved color consistency (tighter binning), and higher reliability at elevated temperatures. There is also a growing demand for LEDs with high CRI and specific spectral tuning (e.g., for human-centric lighting) without significant efficacy penalties. Packaging technology continues to evolve to improve thermal performance, allowing for higher drive currents and power densities from the same footprint. Furthermore, the integration of photometric and colorimetric testing data directly into traceable part numbers or digital product passports is becoming more common to aid automated manufacturing and quality control.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |