5630 Warm White LED Datasheet - Package 5.6x3.0mm - Voltage 2.9V - Luminous Flux 27lm - English Technical Document

1. Product Overview

This document details the specifications for a high-performance Warm White Light Emitting Diode (LED) in the industry-standard 5630 surface-mount device (SMD) package. The component is engineered for reliability and consistent performance, targeting applications requiring stable, high-quality white light in compact form factors. Its core advantages include a high typical luminous flux output, a wide 120-degree viewing angle for excellent light dispersion, and robust construction qualified for demanding environments.

The primary target market is automotive interior lighting systems, including dashboard illumination, switch backlighting, reading lamps, and infotainment system indicators. Furthermore, its characteristics make it suitable for general backlighting applications such as LCD panels, mobile devices, illuminated advertising, and various optical indicator uses where consistent color and brightness are critical.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The LED's performance is defined under a standard test condition of a 65mA forward current (IF). At this current, the typical luminous flux (Φv) is 27 lumens (lm), with a minimum guaranteed value of 24 lm and a maximum of 40 lm, accounting for production tolerances. The correlated luminous intensity is typically 9100 millicandelas (mcd). The forward voltage (VF) typically measures 2.9 volts, operating within a range of 2.5V to 3.5V. The wide viewing angle (φ) of 120 degrees ensures uniform light distribution. The chromaticity coordinates for the warm white emission are typically at CIE x=0.4337 and CIE y=0.4019, with a tight tolerance of ±0.005, ensuring color consistency. The Color Rendering Index (Ra) is a minimum of 80, indicating good color reproduction of illuminated objects.

2.2 Absolute Maximum Ratings and Thermal Management

Critical limits must not be exceeded to ensure device longevity. The absolute maximum power dissipation (Pd) is 630 mW. The forward current (IF) can be operated from 20 mA to 180 mA, with a non-repetitive surge current (IFM) rating of 1500 mA. The device is not designed for reverse bias operation. The maximum allowable junction temperature (TJ) is 125°C, with an operating temperature (Topr) and storage temperature (Tstg) range of -40°C to +110°C. The component offers Electrostatic Discharge (ESD) protection up to 8 kV (Human Body Model). For assembly, it can withstand a reflow soldering peak temperature of 260°C for 30 seconds.

Thermal management is crucial for performance and lifetime. The thermal resistance from the junction to the solder point is characterized by two values: a real thermal resistance (Rth JS real) of typically 30 K/W and an electrical thermal resistance (Rth JS el) of typically 15 K/W. Proper PCB layout and heat sinking are necessary to maintain the junction temperature within safe limits, especially when operating at higher currents.

3. Binning System Explanation

The product utilizes a binning system to categorize units based on their luminous flux output. This ensures designers receive LEDs with performance within a specified range. The bins are defined by alphanumeric codes (e.g., Z1, B4, C5) corresponding to minimum and maximum luminous flux and luminous intensity values. For this specific part, the available bin is highlighted, corresponding to a luminous flux range of 24 lm to 27 lm (B4 bin) and an intensity range of 7920 mcd to 8910 mcd. This binning allows for precise selection based on the brightness requirements of the application, promoting consistency in the final product's appearance.

4. Performance Curve Analysis

4.1 Spectral and Current-Voltage Relationship

The relative spectral distribution graph shows a broad emission spectrum characteristic of phosphor-converted white LEDs, with a peak in the blue region (from the LED chip) and a broad secondary peak in the yellow/red region (from the phosphor), combining to produce warm white light. The Forward Current vs. Forward Voltage (IV) curve demonstrates the diode's exponential characteristic. The Relative Luminous Flux vs. Forward Current curve shows that light output increases with current but will eventually saturate and can degrade efficiency at very high currents.

4.2 Temperature Dependence

The performance of an LED is significantly influenced by its junction temperature. The Relative Luminous Flux vs. Junction Temperature graph indicates that light output generally decreases as temperature increases. The Relative Forward Voltage vs. Junction Temperature curve shows a negative temperature coefficient, meaning forward voltage drops as temperature rises, which can be used for temperature monitoring. The Chromaticity Coordinates Shift vs. Junction Temperature graph is critical for color-critical applications, showing how the white point may shift with temperature.

4.3 Derating and Pulsed Operation

The Forward Current Derating Curve is essential for reliable design. It defines the maximum allowable continuous forward current based on the temperature of the solder pad. For example, at a pad temperature of 75°C, the maximum current is 180 mA, but at 110°C, it derates to 90 mA. The Permissible Pulse Handling Capability chart provides guidance for driving the LED with pulsed currents higher than the DC maximum, defining safe combinations of pulse amplitude (IFA), pulse width (tp), and duty cycle (D).

5. Mechanical and Package Information

The component uses the 5630 package footprint, with nominal dimensions of 5.6mm in length and 3.0mm in width. The mechanical dimension drawing provides exact tolerances for the package body, lens, and lead positions. A recommended soldering pad layout is supplied to ensure reliable solder joint formation and optimal thermal transfer from the device's thermal pad to the printed circuit board (PCB). Correct polarity is indicated by a marking on the device or an asymmetric pad design; connecting the device in reverse can cause immediate failure.

6. Soldering and Assembly Guidelines

A reflow soldering profile is recommended for assembly. The profile specifies the critical parameters: preheat, soak, reflow, and cooling phases, with a peak temperature not exceeding 260°C for a maximum of 30 seconds. This profile is designed to minimize thermal stress on the LED package and internal materials. General precautions include using ESD-safe handling procedures, avoiding mechanical stress on the lens, and ensuring the soldering process does not contaminate the optical surface. Components should be stored in their original moisture-barrier bags under controlled humidity conditions, especially as they are rated MSL (Moisture Sensitivity Level) 2.

7. Packaging and Ordering Information

The LEDs are typically supplied on tape and reel for automated assembly. The packaging information specifies the reel dimensions, tape width, pocket spacing, and orientation of the components on the reel. The part number itself encodes key attributes. Ordering information clarifies how to specify the desired bin or other variants to ensure the correct product is supplied for the application.

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is ideally suited for:
• Automotive Interior Lighting: Dashboard illumination, button backlighting, footwell lights, and reading lamps due to its AEC-Q101 qualification.
• Backlighting: Edge-lit or direct-lit backlighting for small to medium LCD displays, icon backlighting, and light guides.
• General Indicator & Decorative Lighting: Status indicators, accent lighting, and signage where warm white light and reliability are required.

8.2 Design Considerations

• Current Drive: Always use a constant current driver, not a constant voltage source, to ensure stable light output and prevent thermal runaway. A series resistor can be used for simple, low-current applications.
• Thermal Design: Implement adequate PCB copper area (thermal pad) and consider the operating environment temperature to stay within the derating curve limits.
• Optical Design: The 120-degree viewing angle may require diffusers or lenses to achieve specific beam patterns. Consider the potential for color shift over temperature and drive current in color-sensitive applications.

9. Technical Comparison and Differentiation

Compared to standard 5630 white LEDs, this component differentiates itself through its formal AEC-Q101 qualification for automotive use, which involves rigorous testing for temperature cycling, humidity, and operational life under stress. The guaranteed minimum Color Rendering Index (Ra) of 80 is higher than many basic white LEDs, providing better color quality. The inclusion of detailed thermal resistance data (both real and electrical) and comprehensive derating curves provides designers with the necessary information for robust, high-reliability system design, which is often lacking in datasheets for commercial-grade components.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED directly from a 3.3V or 5V supply?
A: Not directly. The forward voltage is approximately 2.9V, but it varies. You must use a current-limiting circuit. For a 3.3V supply, a series resistor can be calculated. For a 5V supply, a resistor or, preferably, a constant-current driver is essential to avoid exceeding the maximum current rating.

Q: What does MSL 2 mean for storage?
A: Moisture Sensitivity Level 2 indicates that the component can be exposed to factory floor conditions (≤ 60% Relative Humidity) for up to one year before it requires baking prior to reflow soldering. They should be stored in their sealed, moisture-barrier bags with desiccant.

Q: How is the luminous flux of 27lm achieved?
A: This is the typical value measured at the standard test condition of 65mA forward current with the thermal pad stabilized at 25°C. In a real application, the actual flux will be lower due to higher operating junction temperature.

Q: Is a heatsink required?
A> It depends on the drive current and ambient conditions. At the full rated current of 180mA and in a warm environment, significant PCB copper area or an external heatsink is likely necessary to keep the junction temperature below 125°C. Refer to the derating curve for guidance.

11. Practical Design Case Study

Scenario: Designing an automotive dashboard switch backlight.
Requirements: Uniform warm white illumination, operation from a 12V vehicle battery, stable brightness over a -40°C to +85°C ambient range.
Implementation: Three LEDs are placed behind a diffuser. They are connected in series, resulting in a total forward voltage of ~8.7V (3 * 2.9V). A constant-current buck driver IC is selected to provide a stable 65mA from the 12V input, ensuring consistent brightness regardless of battery voltage fluctuations. The PCB is designed with a large copper pour connected to the LED thermal pads to dissipate heat into the metal chassis of the switch assembly. The driver includes PWM dimming capability controlled by the vehicle's CAN bus.

12. Operating Principle Introduction

A white LED operates on the principle of electroluminescence in a semiconductor material, combined with phosphor conversion. Electrical current flowing through a semiconductor chip (typically made of indium gallium nitride - InGaN) causes it to emit photons, primarily in the blue or ultraviolet spectrum. This chip is coated with a layer of phosphor material (often yttrium aluminum garnet - YAG doped with cerium). The high-energy blue photons from the chip excite the phosphor, which then re-emits photons across a broader spectrum in the yellow and red regions. The combination of the remaining blue light and the phosphor's yellow/red light is perceived by the human eye as white light. The exact ratio of chip emission to phosphor emission determines the correlated color temperature (CCT), resulting in cool, neutral, or warm white light.

13. Technology Trends and Context

The 5630 package represents a mature and cost-effective platform in LED technology. Current industry trends relevant to such components include:
• Increased Efficiency (lm/W): Ongoing improvements in chip epitaxy and phosphor technology continue to push higher luminous efficacy, allowing for lower power consumption or higher light output from the same package.
• Improved Color Quality and Consistency: Tighter binning tolerances for chromaticity coordinates and higher minimum CRI values are becoming standard, driven by applications in retail lighting and automotive interiors.
• Enhanced Reliability and Robustness: Demands from automotive, industrial, and outdoor applications are pushing for higher maximum junction temperatures, better resistance to thermal cycling, and improved resistance to humidity and sulfur-containing atmospheres.
• Integration: While discrete LEDs like this remain vital, there is a parallel trend towards integrated modules that combine multiple LED chips, drivers, and optics into a single system-level component, simplifying end-product design.