T3C Series 3030 Warm White LED Datasheet - Size 3.0x3.0mm - Voltage 56-58V - Power 1.45W - English Technical Document

1. Product Overview

The T3C series represents a high-performance, top-view warm white LED housed in a compact 3030 (3.0mm x 3.0mm) package. This product is engineered for general lighting applications, offering a balance of high luminous output, thermal efficiency, and reliability. Its thermally enhanced package design allows for effective heat dissipation, which is critical for maintaining performance and longevity in demanding lighting fixtures.

The core advantages of this LED include its high current capability, wide viewing angle of 120 degrees, and compatibility with standard Pb-free reflow soldering processes. It is designed to be RoHS compliant, ensuring adherence to environmental regulations. The primary target markets for this component are interior lighting, retrofit solutions for existing fixtures, general illumination, and architectural or decorative lighting where consistent warm white light quality is desired.

2. In-Depth Technical Parameter Analysis

2.1 Electro-Optical Characteristics

The electro-optical performance is specified at a standard test condition of a forward current (IF) of 25mA and a junction temperature (Tj) of 25°C. The luminous flux varies with Correlated Color Temperature (CCT). For the 2700K and 3000K warm white variants, the typical luminous flux is 150lm and 154lm respectively, with a minimum guaranteed value of 139lm. For CCTs from 4000K to 6500K, the typical flux is 163lm with a 148lm minimum. All variants feature a minimum Color Rendering Index (Ra) of 80. Tolerances are ±7% for luminous flux and ±2 for Ra measurement.

2.2 Electrical and Thermal Parameters

The absolute maximum ratings define the operational limits. The maximum continuous forward current is 25mA, with a pulsed current (IFP) of 40mA allowed under specific conditions (pulse width ≤100μs, duty cycle ≤1/10). The maximum power dissipation is 1450mW. The device can operate in ambient temperatures from -40°C to +105°C.

Under typical operating conditions (IF=25mA, Tj=25°C), the forward voltage (VF) ranges from 56V to 58V (typical 58V). The thermal resistance from the junction to the solder point (Rth j-sp) is typically 9°C/W, indicating good thermal conduction from the chip to the board. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

3. Binning System Explanation

3.1 Luminous Flux Binning

The LEDs are sorted into luminous flux bins to ensure consistency. Each CCT has specific bin codes with defined minimum and maximum flux ranges. For example, 2700K LEDs are available in bins 2G (139-148lm), 2H (148-156lm), and 2J (156-164lm). Higher CCTs like 4000K-6500K use bins 2H, 2J, and 2K (164-172lm). This allows designers to select components that meet precise brightness requirements for their application.

3.2 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design for current regulation. The available bins are 6W (52-54V), 6X (54-56V), and 6Y (56-58V). Selecting LEDs from a tighter voltage bin can lead to more uniform performance and simplified driver design.

3.3 Chromaticity Binning

The color consistency is controlled using a 5-step MacAdam ellipse system within the CIE chromaticity diagram. Each CCT (e.g., 27 for 2700K, 30 for 3000K) has a defined center coordinate at both 25°C and 85°C junction temperature, along with ellipse parameters (a, b, φ). This ensures that the perceived color difference between LEDs from the same bin is minimal, which is crucial for applications requiring uniform appearance.

4. Performance Curve Analysis

The datasheet includes several key graphs for design analysis. The Forward Current vs. Relative Intensity curve shows how light output scales with current. The Forward Current vs. Forward Voltage (IV) curve is essential for designing the driving circuitry. The Ambient Temperature vs. Relative Luminous Flux graph illustrates the expected light output drop as the operating temperature increases, highlighting the importance of thermal management. The Ambient Temperature vs. Relative Forward Voltage curve shows the negative temperature coefficient of VF. The Viewing Angle Distribution plot confirms the Lambertian-like emission pattern with a 120-degree half-angle. The Color Spectrum graph displays the spectral power distribution, typical of a phosphor-converted white LED, with a peak in the blue region from the chip and a broad phosphor emission in the yellow/red region.

5. Mechanical and Package Information

The LED uses a surface-mount device (SMD) package with dimensions of 3.00mm x 3.00mm. The package height is 2.50mm with a lens height of 2.20mm. The soldering pad pattern is clearly defined, with separate anode and cathode pads. Polarity is marked on the package bottom view, with the cathode typically indicated. The dimensional tolerance is ±0.1mm unless otherwise specified. This compact and standardized footprint allows for easy integration into automated PCB assembly lines.

6. Soldering and Assembly Guidelines

The component is suitable for lead-free reflow soldering. A detailed reflow profile is provided: The ramp-up rate from liquidus to peak temperature should not exceed 3°C/second. The liquidous temperature (TL) is 217°C, and the time above TL (tL) should be 60-150 seconds. The peak package body temperature (Tp) must not exceed 260°C, and the time within 5°C of this peak (tp) should be a maximum of 30 seconds. The ramp-down rate should be a maximum of 6°C/second. The total time from 25°C to peak temperature should be 8 minutes or less. Adhering to this profile is critical to prevent thermal damage to the LED die, phosphor, or plastic package.

7. Packaging and Ordering Information

The LEDs are supplied on tape and reel for automated placement. Each reel can contain a maximum of 5000 pieces. The tape has specific dimensions, including pocket pitch and cumulative tolerance. The part numbering system is detailed: It starts with the type code (3C for 3030), followed by CCT code (e.g., 27 for 2700K), color rendering index (8 for Ra80), codes for serial/parallel chip configuration, a component code, and a color code (e.g., R for 85°C ANSI binning). This alphanumeric system allows precise identification of the LED's performance characteristics.

8. Application Recommendations

Typical Application Scenarios: This LED is ideal for indoor lighting fixtures such as downlights, panel lights, and tube lights. It is also suitable for retrofitting older fluorescent or incandescent fixtures with LED technology. In architectural lighting, it can be used for coves, shelves, and accent lighting where warm white tones are preferred.

Design Considerations: 1) Thermal Management: Given a typical thermal resistance of 9°C/W, proper heat sinking is mandatory when operating at or near maximum ratings to prevent premature lumen depreciation and color shift. 2) Current Driving: A constant current driver is recommended to ensure stable light output and color. The driver should be chosen based on the forward voltage bin and the required operating current. 3) Optical Design: The wide 120-degree viewing angle makes it suitable for applications requiring broad illumination without secondary optics, though lenses or reflectors can be used for beam control.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, the T3C 3030 package offers a higher power dissipation capability (1.45W max) and higher forward voltage, often indicating a multi-chip design within the package for higher lumen output. The provision of detailed binning for flux, voltage, and color within a 5-step MacAdam ellipse offers superior color consistency compared to parts with looser binning. The thermally enhanced package design differentiates it from basic packages by offering a lower thermal resistance path, which is a key factor for long-term reliability in high-power applications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What driver voltage is needed for this LED?
A: The LED requires a driver that can supply the necessary voltage to overcome the forward voltage (VF) of the LED string. With a VF of 56-58V at 25mA, a driver with an output voltage capability above 58V is recommended, accounting for tolerances and temperature effects.

Q: How does temperature affect performance?
A: As shown in the performance curves, luminous flux decreases as ambient/junction temperature increases. The forward voltage also decreases with temperature. Effective thermal management is crucial to maintain stated performance.

Q: What is the meaning of the 5-step MacAdam ellipse?
A: It defines the area on the color chart where LEDs are considered a color match. A 5-step ellipse is a standard for good color consistency in general lighting, meaning the color difference between two LEDs from the same bin is barely perceptible to most observers.

11. Practical Design and Usage Case

Case: Designing a retrofit LED tube light. A designer is replacing a traditional T8 fluorescent tube with an LED version. They select the 4000K, Ra80 variant of this LED for a neutral white light suitable for office environments. They plan to connect 20 LEDs in series to achieve the desired length and light output. Using the typical VF of 58V per LED, the total string voltage is approximately 1160V. This necessitates a driver capable of handling this high voltage or suggests a different series-parallel configuration is needed to match available, safe driver voltages. The designer must also design an aluminum PCB or heat sink structure to manage the heat from 20 LEDs dissipating up to 1.45W each, ensuring the junction temperature stays within safe limits to achieve the claimed lifetime.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core is a semiconductor chip (likely based on InGaN) that emits blue light when electrical current passes through it in the forward direction (electroluminescence). This blue light is partially absorbed by a yellow (and often red) phosphor coating deposited on or around the chip. The phosphor re-emits light at longer wavelengths. The combination of the remaining blue light and the broad-spectrum yellow/red light from the phosphor results in the perception of white light. The specific blend of phosphors determines the Correlated Color Temperature (CCT) and Color Rendering Index (Ra) of the emitted white light.

13. Technology Trends and Context

The LED industry continues to evolve towards higher efficacy (more lumens per watt), improved color quality (higher Ra and R9 values), and greater reliability. Packages like the 3030 are part of a trend towards standardized, compact, high-power SMD formats that enable modular and scalable lighting designs. There is also a strong focus on enhancing thermal management at the package level to allow for higher drive currents and power densities without compromising lifetime. Furthermore, the push for "human-centric" lighting is driving demand for LEDs with tunable CCT and spectral features, though the part described here is a fixed-CCT solution aimed at the mainstream general lighting market.