White LED 3030 SMD Datasheet - Size 3.0x3.0x0.66mm - Voltage 5.9V - Power 0.71W - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, top-view white LED in a compact 3030 surface-mount device (SMD) package. Designed for general lighting applications, this component offers a combination of high luminous output, robust thermal management, and reliable operation under demanding conditions. Its primary target markets include retrofit lighting solutions, general illumination, and both indoor and outdoor signage backlighting.

The core advantages of this LED series stem from its thermally enhanced package design, which facilitates efficient heat dissipation from the semiconductor junction. This design is critical for maintaining performance and longevity, especially when operating at high drive currents. The package offers a wide viewing angle of 120 degrees, ensuring uniform light distribution. Furthermore, it is compliant with RoHS directives and is suitable for lead-free reflow soldering processes, aligning with modern manufacturing and environmental standards.

2. Technical Parameter Deep-Dive

The performance of this LED is characterized under specific test conditions, typically at a junction temperature (Tj) of 25°C and a forward current (IF) of 120mA. It is crucial to understand that real-world performance will vary with operating temperature and drive current.

2.1 Electro-Optical Characteristics

The luminous flux output is directly correlated with the Correlated Color Temperature (CCT) and Color Rendering Index (Ra). For a standard test condition of IF=120mA, the typical luminous flux ranges from approximately 94 lumens for a 2700K, Ra90 LED to 129 lumens for cooler white LEDs (4000K-6500K) with Ra70. The forward voltage (VF) typically measures 5.9V at 120mA, with a specified tolerance of ±0.2V. The viewing angle (2θ1/2), defined as the off-axis angle where luminous intensity drops to half its peak value, is 120 degrees.

2.2 Absolute Maximum Ratings and Electrical Characteristics

To ensure device reliability, operation must never exceed the Absolute Maximum Ratings. The maximum continuous forward current (IF) is 200mA, with a pulsed forward current (IFP) of 300mA allowed under specific conditions (pulse width ≤100μs, duty cycle ≤10%). The maximum power dissipation (PD) is 1280 mW. The device can withstand a reverse voltage (VR) of up to 5V. The operating temperature range (Topr) is from -40°C to +105°C, and the maximum allowable junction temperature (Tj) is 120°C.

2.3 Thermal Characteristics

Thermal management is paramount for LED performance and lifespan. The key parameter here is the thermal resistance from the junction to the solder point (Rth j-sp), which is specified as 13°C/W. This value indicates how effectively heat generated at the LED chip is transferred to the printed circuit board (PCB). A lower thermal resistance is always desirable. The datasheet provides derating curves showing how the maximum allowable forward current decreases as the ambient temperature increases to prevent the junction temperature from exceeding its limit.

3. Binning System Explanation

Due to manufacturing variances, LEDs are sorted into performance bins to ensure consistency in application. This product uses a multi-dimensional binning system.

3.1 Luminous Flux Binning

LEDs are grouped based on their measured luminous flux at 120mA. The bin code (e.g., 5G, 5H, 5J) defines a specific lumen range. For example, for a 4000K LED with Ra80, bin code 5H corresponds to a flux range of 115-120 lumens, while 5J corresponds to 120-125 lumens. The available bins vary with CCT and CRI combinations.

3.2 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design, particularly for driving multiple LEDs in series. The bins are labeled Z3 (5.6-5.8V), A4 (5.8-6.0V), B4 (6.0-6.2V), and C4 (6.2-6.4V). Selecting LEDs from the same voltage bin can help achieve more uniform current distribution in parallel strings.

3.3 Chromaticity Binning (Color)

The chromaticity coordinates (x, y on the CIE diagram) are controlled within a 5-step MacAdam ellipse for each nominal CCT (2700K, 3000K, 4000K, 5000K, 5700K, 6500K). A 5-step ellipse ensures that color differences between LEDs within the same bin are barely perceptible to the human eye under standard viewing conditions. The datasheet provides the center coordinates and ellipse parameters for each CCT rank at both 25°C and 85°C junction temperatures, acknowledging the color shift that occurs with temperature.

4. Performance Curve Analysis

The datasheet includes several graphs essential for design engineers.

4.1 Spectral Power Distribution

Graphs are provided for spectra with Ra≥70, Ra≥80, and Ra≥90. Higher CRI spectra show a more filled-in spectrum, particularly in the red region, leading to more accurate color rendition of illuminated objects.

4.2 Forward Current vs. Relative Luminous Intensity & Voltage

The Relative Luminous Intensity curve shows a near-linear relationship with current in the lower range, typically saturating at higher currents due to efficiency droop and thermal effects. The Forward Voltage curve shows the characteristic exponential rise with current, crucial for designing constant-current drivers.

4.3 Thermal Derating Curves

The "Ambient Temperature vs. Relative Luminous Flux" curve demonstrates the reduction in light output as the LED's operating temperature increases. The "Ambient Temperature vs. Relative Forward Voltage" curve shows the decrease in VF with rising temperature, a negative temperature coefficient typical for semiconductors. The "Maximum Forward Current vs. Ambient Temperature" graph is a derating curve, defining the highest safe operating current at any given ambient temperature to keep Tj below 120°C.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED is housed in a 3030 package, meaning its footprint is approximately 3.0mm x 3.0mm. The overall height is 0.66mm. Detailed mechanical drawings show top, bottom, and side views with critical dimensions, including the lens curvature and solder pad layout. All unspecified tolerances are ±0.2mm.

5.2 Pad Design and Polarity Identification

The bottom view clearly shows the two anode and two cathode solder pads. The polarity is marked on the package itself, with a distinctive marker denoting the cathode side. This is critical for correct orientation during assembly. The solder pad pattern is designed to facilitate good solder joint formation and mechanical stability during reflow.

6. Soldering & Assembly Guidelines

The component is rated for lead-free reflow soldering. The maximum soldering temperature profile is specified: the package body temperature must not exceed 230°C or 260°C for more than 10 seconds, depending on the specific profile used. Standard IPC/JEDEC J-STD-020 profiles for lead-free processing are applicable. It is recommended to follow the manufacturer's suggested profile to avoid thermal shock, solder joint defects, or damage to the LED's internal materials. Devices should be stored in a dry, controlled environment prior to use.

7. Application Suggestions

7.1 Typical Application Scenarios

This LED is well-suited for:
- Retrofit Lamps: Direct replacement for traditional incandescent, halogen, or CFL bulbs in downlights, track lights, and bulbs.
- General Lighting: Linear modules, panel lights, and high-bay fixtures where high flux output is required.
- Signage & Architectural Lighting: Backlighting for indoor/outdoor signs, channel letters, and decorative accent lighting due to its wide viewing angle and brightness.

7.2 Design Considerations

1. Thermal Management: The low Rth j-sp is only effective if the PCB has a low thermal resistance path to a heatsink. Use metal-core PCBs (MCPCBs) or other thermally enhanced substrates.
2. Drive Current: While capable of 200mA, operating at or below the test current of 120mA often provides a better balance of efficiency, lifetime, and thermal load.
3. Optics: The 120-degree viewing angle may require secondary optics (lenses, reflectors) for applications needing a narrower beam.
4. Electrical Design: Use a constant-current driver matched to the forward voltage bin and desired operating current. Consider the negative VF temperature coefficient when designing feedback loops.

8. Common Questions Based on Technical Parameters

Q: What is the actual power consumption at the typical operating point?
A: At IF=120mA and VF=5.9V, the electrical power input is approximately 0.71 Watts (120mA * 5.9V = 0.708W).

Q: How does color rendering index (CRI) affect light output?
A: As shown in the electro-optical table, for the same CCT, LEDs with higher CRI (Ra90) have lower typical luminous flux compared to those with standard CRI (Ra70). This is a fundamental trade-off in phosphor-converted white LEDs.

Q: Can I drive this LED with a constant voltage source?
A: It is strongly discouraged. The exponential I-V relationship of LEDs means small changes in voltage cause large changes in current, leading to thermal runaway and failure. Always use a constant-current driver.

Q: What does the 5-step MacAdam ellipse mean for my application?
A: It guarantees very tight color consistency. LEDs from the same CCT bin will appear virtually identical in color to most observers, which is critical in multi-LED fixtures to avoid visible color variation (color mixing).

9. Operating Principle

This is a phosphor-converted white LED. The core semiconductor chip emits blue light when electrical current passes through it (electroluminescence). This blue light strikes a layer of phosphor material deposited on or near the chip. The phosphor absorbs a portion of the blue photons and re-emits light at longer wavelengths (yellow, and often red for high-CRI types). The combination of the remaining blue light and the broad-spectrum phosphor emission results in the perception of white light. The specific blend of phosphors determines the CCT and CRI of the final output.

10. Industry Trends

The 3030 package format represents a balance between high power handling capability and a compact footprint, making it a popular choice in the mid-power LED segment. Industry trends continue to focus on increasing luminous efficacy (lumens per watt), improving color consistency and rendering, and enhancing reliability at higher operating temperatures. There is also a drive towards more sustainable manufacturing processes and materials. The integration of advanced phosphors for better spectral quality and the optimization of package geometry for superior thermal performance are ongoing areas of development in packages of this class.