T3C Series White LED 3030 Specification Sheet - Dimensions 3.0x3.0x0.52mm - Voltage 48-50V - Power 1.5W - English Technical Document

1. Product Overview

The T3C series represents a high-performance white LED solution designed for general and architectural lighting applications. This top-view LED is built on a thermally enhanced package platform, enabling reliable operation under demanding conditions. The compact 3030 footprint (3.0mm x 3.0mm) makes it suitable for space-constrained designs while delivering substantial luminous output.

Key advantages of this series include its high current capability, which supports robust performance, and a wide viewing angle of 120 degrees, ensuring uniform light distribution. The product is compliant with Pb-free reflow soldering processes, adhering to RoHS environmental standards, which simplifies manufacturing and aligns with global regulatory requirements.

2. Technical Parameter Deep Dive

2.1 Electro-Optical Characteristics

The fundamental performance is measured at a junction temperature (Tj) of 25\u00b0C and a forward current (IF) of 25mA. The luminous flux varies with Correlated Color Temperature (CCT). For a 2700K (warm white) LED with a Color Rendering Index (CRI or Ra) of 80, the typical luminous flux is 139 lumens, with a minimum of 122 lumens. As the CCT increases to 6500K (cool white), the typical flux reaches 146 lumens, with a minimum of 139 lumens. A measurement tolerance of \u00b17% applies to luminous flux, and \u00b12 for CRI.

The forward voltage (VF) is specified between 48V (Min) and 50V (Typ) under the same 25mA condition, with a tolerance of \u00b13%. The reverse current (IR) is a maximum of 10\u00b5A at a reverse voltage (VR) of 5V. The device offers protection against Electrostatic Discharge (ESD) up to 1000V (Human Body Model).

2.2 Absolute Maximum Ratings and Thermal Management

Safe operating limits are critical for reliability. The absolute maximum forward current (IF) is 30mA DC, with a pulsed forward current (IFP) of 45mA allowed under specific conditions (pulse width \u2264100\u00b5s, duty cycle \u22641/10). The maximum power dissipation (PD) is 1500mW.

Thermal parameters define the operating envelope. The junction temperature (Tj) must not exceed 120\u00b0C. The device can operate in ambient temperatures (Topr) from -40\u00b0C to +105\u00b0C and be stored (Tstg) from -40\u00b0C to +85\u00b0C. A key thermal metric is the thermal resistance from the junction to the solder point (Rth j-sp), which is typically 8\u00b0C/W. This low value is a result of the thermally enhanced package design, facilitating efficient heat transfer away from the LED chip to the printed circuit board.

3. Binning System Explanation

3.1 Luminous Flux and Forward Voltage Binning

To ensure color and brightness consistency in production, LEDs are sorted into bins. The luminous flux binning provides multiple output ranges for each CCT. For example, a 4000K LED with Ra80 can be binned as 2G (139-148 lm), 2H (148-156 lm), or 2J (156-164 lm). This allows designers to select the appropriate brightness grade for their application.

Similarly, forward voltage is binned to ensure electrical compatibility in circuit design. Bins include 6Q (44-46V), 6R (46-48V), and 6S (48-50V). Selecting LEDs from the same voltage bin helps maintain uniform current distribution in multi-LED arrays.

3.2 Chromaticity Binning

Color consistency is managed through strict chromaticity binning defined on the CIE 1931 diagram. The bins are defined by a 5-step MacAdam ellipse centered on specific (x, y) coordinates for each CCT at both 25\u00b0C and 85\u00b0C junction temperatures. This accounts for color shift with temperature. For instance, the 4000K bin (40R5) has a center at x=0.3875, y=0.3868 at 25\u00b0C, with ellipse radii (a, b) of 0.01565 and 0.00670 respectively. This system, aligned with standards like Energy Star for 2600K-7000K, guarantees that all LEDs within a bin will appear visually identical to the human eye.

4. Performance Curve Analysis

The provided graphs offer crucial insights into real-world performance. The Forward Current vs. Relative Luminous Flux curve shows that light output increases with current but will eventually saturate. The Forward Current vs. Forward Voltage curve demonstrates the diode's characteristic exponential relationship, which is vital for driver design.

The Ambient Temperature vs. Relative Luminous Flux graph is critical for thermal design. It shows that light output decreases as the ambient (and consequently junction) temperature rises. Proper heat sinking is essential to maintain rated brightness. Conversely, the Ambient Temperature vs. Relative Forward Voltage graph shows a negative temperature coefficient, where forward voltage decreases slightly with increasing temperature. The Viewing Angle Distribution plot confirms the Lambertian-like emission pattern with a 120-degree half-intensity angle, providing wide, even illumination. The Color Spectrum plots for Warm, Natural, and Cool White illustrate the different spectral power distributions, impacting both color quality and application suitability.

5. Mechanical and Package Information

The LED features a compact surface-mount device (SMD) package with dimensions of 3.00mm in length and width, and a height of 0.52mm. The soldering pad pattern is clearly defined, with separate anode and cathode pads to ensure correct electrical connection and optimal thermal path to the PCB. Polarity is marked on the package bottom view. All unspecified tolerances are \u00b10.1mm. This standardized 3030 footprint allows for easy integration into existing optical systems and manufacturing lines.

6. Soldering and Assembly Guidelines

The device is qualified for lead-free reflow soldering processes. A detailed reflow profile is provided to ensure reliable solder joints without damaging the LED. Key parameters include: a peak package body temperature (Tp) not exceeding 260\u00b0C, with time within 5\u00b0C of this peak (tp) limited to 30 seconds maximum. The liquidous temperature (TL) is 217\u00b0C, and the time above this temperature (tL) should be between 60-150 seconds. The ramp-up rate from TL to Tp should not exceed 3\u00b0C/second, and the ramp-down rate from Tp to TL should not exceed 6\u00b0C/second. The total time from 25\u00b0C to peak temperature must be 8 minutes or less. Adhering to this profile is essential for long-term reliability.

7. Model Numbering System

The part number follows a structured format: T3C**851A-R****. This code encapsulates key product attributes. The "3C" indicates the 3030 package type. The following two digits represent the CCT (e.g., 27 for 2700K, 40 for 4000K). The next digit indicates the Color Rendering Index (7 for Ra70, 8 for Ra80, 9 for Ra90). Subsequent characters define the number of serial and parallel chips, component code, and color code (e.g., 'R' for 85\u00b0C ANSI binning). This system allows for precise identification and ordering of the desired LED configuration.

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is well-suited for a variety of lighting applications due to its high output and reliability. Primary uses include interior lighting for residential and commercial spaces, retrofitting existing fixtures to LED technology, general area illumination, and architectural or decorative lighting where both performance and form factor are important.

8.2 Design Considerations

When designing with this LED, several factors must be considered. First, thermal management is paramount. Using an appropriate Metal Core PCB (MCPCB) or other effective heat sinking is necessary to keep the junction temperature within safe limits, thereby ensuring long life and maintaining luminous flux. Second, a constant current LED driver is required to provide stable 25mA (or other designed current) to the LED, as the forward voltage has a tolerance and a negative temperature coefficient. Third, for multi-LED arrays, consider using LEDs from the same flux and voltage bins to achieve uniform brightness and current sharing. Finally, ensure the PCB pad layout matches the recommended soldering pattern for optimal solder joint integrity and thermal performance.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, the T3C 3030 series offers distinct advantages. Its higher forward voltage (48-50V) suggests it may use multiple series-connected chips within the package, which can simplify driver design for certain configurations compared to parallel low-voltage chips. The thermally enhanced package with a low 8\u00b0C/W Rth j-sp provides better heat dissipation than many conventional packages, allowing for higher drive currents or improved longevity at standard currents. The combination of high flux output (up to 164 lm for 5000K-6500K in the J-bin) within the compact 3030 footprint offers a favorable lumen density for space-efficient luminaires.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What driver current should I use?
A: The standard test condition is 25mA, and the absolute maximum is 30mA DC. Design should be based on 25mA for guaranteed specifications. Exceeding 30mA risks permanent damage.

Q: How does temperature affect performance?
A: As shown in the performance curves, luminous flux decreases with increasing junction temperature. Forward voltage also decreases slightly. Proper heat sinking is critical to maintain output and longevity.

Q: What is the meaning of the 5-step MacAdam ellipse?
A: It defines the acceptable color variation. LEDs within the same 5-step ellipse will appear identical in color to the vast majority of observers under typical viewing conditions, ensuring color uniformity in a fixture.

Q: Can I use wave soldering?
A: The datasheet specifies reflow soldering characteristics only. Wave soldering is typically not recommended for such SMD LEDs due to the excessive thermal stress and potential for contamination.

11. Practical Design and Usage Case

Consider designing a linear LED fixture for office lighting. The goal is high efficiency, good color quality (Ra80, 4000K), and uniform illumination. Using the T3C 3030 LED in the 2H flux bin (148-156 lm) ensures bright output. A thermal simulation should be performed to design an aluminum heatsink that keeps the junction temperature below 85\u00b0C when driven at 25mA in the intended ambient temperature. LEDs should be sourced from the same voltage bin (e.g., 6S) and the same chromaticity bin (40R5) to prevent visible color differences and ensure even current distribution when connected in series. A constant current driver providing 25mA per series string would be selected. The wide 120-degree viewing angle may eliminate the need for secondary optics in some diffused fixture designs, simplifying assembly and reducing cost.

12. Operating Principle Introduction

A white LED operates on the principle of electroluminescence in a semiconductor material. When a forward voltage is applied, electrons and holes recombine within the active region of the chip, releasing energy in the form of photons. The T3C series likely uses a blue-emitting indium gallium nitride (InGaN) chip. To produce white light, a portion of the blue light is converted to longer wavelengths (yellow, red) by a phosphor layer coating the chip. The mixture of blue light from the chip and converted light from the phosphor results in the perception of white light. The specific blend of phosphors determines the Correlated Color Temperature (CCT) and Color Rendering Index (CRI). The thermally enhanced package is crucial because high junction temperatures can degrade the phosphor and the semiconductor chip itself, reducing light output and shifting color over time.

13. Technology Trends and Developments

The LED industry continues to evolve towards higher efficacy (lumens per watt), improved color quality (higher CRI and better R9 values for red rendition), and greater reliability. There is a strong focus on reducing cost per lumen. Thermally enhanced packages, like the one used in this series, are becoming standard to handle the increased power densities of newer, more efficient chips. Furthermore, there is a trend towards more precise and tighter binning (e.g., 3-step or even 2-step MacAdam ellipses) to meet the demands of high-end applications where perfect color matching is critical. The drive for sustainability pushes for higher efficiency and longer lifetime, reducing the total cost of ownership and environmental impact of lighting systems. The T3C series, with its robust thermal design and performance specifications, aligns with these overarching industry trends.