White LED 5050 SMD Datasheet - Size 5.0x5.0x1.9mm - Voltage 25V - Power 5W - English Technical Document

1. Product Overview

This document details the specifications for the T5C series of high-power, top-view white LED components in a 5050 surface-mount device (SMD) package. Designed for demanding general lighting applications, this LED combines a thermally enhanced package with high luminous flux output and a wide viewing angle. It is suitable for reflow soldering processes and is compliant with relevant environmental standards.

1.1 Core Advantages

• Thermally Enhanced Package Design: Optimized for efficient heat dissipation, supporting higher drive currents and improving longevity.
• High Luminous Flux Output: Delivers high brightness levels suitable for replacement and general lighting fixtures.
• High Current Capability: Rated for a forward current (IF) of 200mA, with a maximum pulse rating of 330mA.
• Compact Package Size (5050): The 5.0mm x 5.0mm footprint allows for high-density PCB layouts.
• Wide Viewing Angle (120°): Provides uniform illumination over a broad area.
• Pb-free & RoHS Compliant: Suitable for use in products requiring compliance with environmental directives.

1.2 Target Applications

This LED is engineered for a variety of indoor and architectural lighting applications where reliability, brightness, and color quality are paramount.

• Interior Lighting: Downlights, panel lights, and other built-in fixtures.
• Retrofits (Replacement): Direct replacement for traditional lighting sources in existing fixtures.
• General Lighting: Task lighting, accent lighting, and area illumination.
• Architectural / Decorative Lighting: Cove lighting, signage, and aesthetic lighting elements.

2. In-Depth Technical Parameter Analysis

This section provides a detailed breakdown of the LED's electrical, optical, and thermal characteristics under standard test conditions (Tj = 25°C, IF = 200mA).

2.1 Electro-Optical Characteristics

The primary performance metrics define the light output and color quality. Measurements are typically taken at a junction temperature (Tj) of 25°C and a forward current of 200mA.

Key Notes: Luminous flux tolerance is ±7%. Color Rendering Index (Ra) measurement tolerance is ±2. Higher CRI versions (Ra90) offer superior color fidelity but at a slightly reduced lumen output compared to Ra70 and Ra80 bins.

2.2 Absolute Maximum Ratings

These are the stress limits beyond which permanent damage to the device may occur. Operation should always be maintained within these limits.

Design Consideration: The Pulse Forward Current (IFP) rating applies only under specific conditions: pulse width ≤ 100μs and duty cycle ≤ 1/10. Exceeding any absolute maximum rating can alter the device's properties and lead to failure.

2.3 Electrical & Thermal Characteristics

These parameters define the operating behavior under normal conditions.

Key Notes: Forward Voltage tolerance is ±3%. The thermal resistance value is critical for thermal management design; a lower value indicates better heat transfer from the LED junction to the PCB. The ESD rating of 1000V HBM requires standard ESD handling precautions during assembly.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on measured performance. This allows designers to select components that meet specific application requirements.

3.1 Part Numbering System

The part number follows a structured code: T5C***82C-R****. Key elements include:

• X1 (Type Code): "5C" indicates the 5050 package.
• X2 (CCT Code): e.g., "27" for 2700K, "40" for 4000K, "65" for 6500K.
• X3 (Color Rendering Code): "7" for Ra70, "8" for Ra80, "9" for Ra90.
• X4 & X5 (Chip Configuration): Indicates the number of serial and parallel LED chips inside the package (1-Z).
• X7 (Color Code): Defines the chromaticity binning standard (e.g., ANSI, ERP).

3.2 Luminous Flux Binning

LEDs are grouped by their minimum and maximum luminous output at 200mA. For example, for a 4000K, Ra80 LED:

• Code GN: 600 lm (Min) to 650 lm (Max)
• Code GP: 650 lm (Min) to 700 lm (Max)
• Code GQ: 700 lm (Min) to 750 lm (Max)

Selecting a higher bin (e.g., GQ) guarantees a higher minimum brightness.

3.3 Forward Voltage Binning

To aid in driver design and current matching, LEDs are also binned by forward voltage (VF).

• Code 6D: VF = 22V to 24V
• Code 6E: VF = 24V to 26V
• Code 6F: VF = 26V to 28V

3.4 Chromaticity Binning

The color point (x, y coordinates on the CIE diagram) is tightly controlled. The specification references a 5-step MacAdam ellipse, meaning all LEDs within a given bin are visually indistinguishable in color under standard viewing conditions. Center coordinates and ellipse parameters are provided for each CCT at both 25°C and 85°C junction temperatures, accounting for color shift with temperature. Energy Star binning is applied for all CCTs from 2600K to 7000K.

4. Performance Curve & Spectral Analysis

The datasheet includes graphical representations of key performance aspects.

4.1 Spectral Power Distribution

Separate spectra are provided for Ra≥70, Ra≥80, and Ra≥90 versions. Higher CRI spectra will show a more filled-in curve across the visible spectrum, particularly in the red and cyan regions, leading to more accurate color rendering.

4.2 Viewing Angle Distribution

A polar diagram illustrates the spatial radiation pattern. The typical 120° full width at half maximum (FWHM) indicates a Lambertian or near-Lambertian distribution, where light intensity is highest at 0° (perpendicular to the LED surface) and decreases following a cosine law.

5. Mechanical & Package Information

5.1 Package Dimensions

The 5050 SMD package has the following critical dimensions (in mm, tolerance ±0.1mm unless noted):

• Overall Size: 5.00 (L) x 5.18 (W) x 1.90 (H) max.
• LED Chip Area: 4.20 x 4.54.
• Terminal Pitch & Size: Detailed pad layout is shown for optimal solder joint formation and thermal connection.

5.2 Polarity Identification

The bottom view diagram clearly marks the cathode and anode pads. Correct polarity is essential during PCB assembly to prevent reverse bias damage.

5.3 Internal Configuration

The notation "8 Series 2 Parallel" suggests the package contains multiple LED chips connected in a combined series-parallel array to achieve the specified high forward voltage (~25V) and current capability.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed reflow profile is provided to ensure reliable solder joints without damaging the LED. Key parameters include:

• Peak Package Body Temperature (Tp): 260°C maximum.
• Time above Liquidus (TL=217°C): 60 to 150 seconds.
• Time within 5°C of Tp: 30 seconds maximum.
• Ramp-up Rate: 3°C/second maximum.
• Ramp-down Rate: 6°C/second maximum.

Critical Consideration: Adhering to this profile is vital. Excessive temperature or time can degrade the LED's internal materials (epoxy, phosphor) and solder interconnects, leading to premature failure or performance loss.

6.2 Storage & Handling

While not explicitly detailed in the provided excerpt, based on the storage temperature rating (Tstg: -40 to +85°C), components should be stored in a cool, dry environment. Standard moisture sensitivity level (MSL) precautions for SMD components are recommended, and the LEDs should be baked before reflow if the packaging has been exposed to ambient humidity for extended periods.

7. Application Design Considerations

7.1 Thermal Management

With a power dissipation up to 5.94W and a thermal resistance of 3°C/W (junction to solder point), effective heat sinking is non-negotiable. The PCB should use a Metal Core PCB (MCPCB) or another thermally conductive substrate. The calculated temperature rise from the solder point to the junction is ΔT = Power * Rth j-sp. For example, at 5W, ΔT = 15°C. The solder point temperature must be kept sufficiently low to ensure the junction temperature (Tj) remains below its maximum rating of 120°C during operation.

7.2 Electrical Drive

A constant current driver is mandatory for LED operation. The driver should be specified for an output current of 200mA (or lower, if dimming is required) and a voltage compliance that covers the LED's forward voltage bin range (e.g., 22-28V). For designs using multiple LEDs, series connection is common due to the high Vf; parallel connection requires careful current balancing.

7.3 Optical Design

The 120° viewing angle is suitable for applications requiring wide, diffuse illumination. For more focused beams, secondary optics (lenses or reflectors) will be necessary. The top-view design means light is primarily emitted perpendicular to the mounting plane.

8. Comparison & Differentiation

Compared to standard mid-power LEDs (e.g., 2835, 3030 packages), this 5050 LED offers significantly higher luminous flux per package, reducing the number of components needed for a given light output. Its higher forward voltage reduces current requirements for a given power, which can minimize resistive losses in traces and connectors. The primary trade-off is the increased thermal management challenge due to the higher power density.

9. FAQ Based on Technical Parameters

9.1 Can I drive this LED at 150mA instead of 200mA?

Yes, driving at a lower current will reduce light output (approximately proportional to current) and significantly improve efficacy (lumens per watt) and lifespan due to lower junction temperature.

9.2 What is the expected lifetime (L70/B50)?

While not explicitly stated in this datasheet, LED lifetime is primarily a function of junction temperature. Operating the LED well within its ratings, particularly keeping Tj low through good thermal design, is the key to achieving long life (typically 50,000 hours to L70 or more).

9.3 How does color shift with temperature and over time?

The chromaticity coordinates are specified at both 25°C and 85°C, showing the expected shift. Generally, white LEDs shift slightly in color as temperature increases. Over the long term, proper thermal management minimizes phosphor degradation, which is the main cause of color shift and lumen depreciation.

10. Practical Design Case Study

Scenario: Designing a 1200 lm, 4000K, Ra80 retrofit LED module to replace a 20W halogen lamp.

1. Component Selection: Choose 4000K, Ra80, Luminous Flux bin GP (Min 650lm) or GQ (Min 700lm).
2. Quantity Calculation: For bin GP: 1200 lm / 650 lm = ~1.85 LEDs. Use 2 LEDs in series for ~1300-1400 lm, then dim slightly if necessary.
3. Driver Specification: Select a constant current driver: Output = 200mA, Voltage range must cover 2 * VF (e.g., 2 * 24-28V = 48-56V).
4. Thermal Design: Total power ≈ 2 LEDs * (25V * 0.2A) = 10W. Use an MCPCB with a heatsink capable of dissipating 10W while keeping the LED solder point temperature low enough to maintain Tj < 120°C in the fixture's ambient environment.
5. PCB Layout: Follow the recommended solder pad pattern. Use wide traces for the high-current paths. Ensure adequate electrical isolation for the high voltage.

11. Operating Principle

A white LED is fundamentally a semiconductor diode. When forward biased, electrons and holes recombine in the active region, releasing energy in the form of photons (light). This primary light is typically in the blue or ultraviolet spectrum. To create white light, a phosphor coating is applied over the semiconductor chip. This phosphor absorbs a portion of the primary blue/UV light and re-emits it as light across a broader spectrum (yellow, red, green). The combination of the remaining blue light and the phosphor-converted light results in the perception of white light. The Correlated Color Temperature (CCT) and Color Rendering Index (CRI) are controlled by the precise composition and thickness of the phosphor layer.

12. Technology Trends

The high-power SMD LED market continues to evolve towards higher efficacy (more lumens per watt), improved color consistency, and higher reliability. Trends include the adoption of novel phosphor technologies (e.g., quantum dots, phosphor-in-glass) for better color rendering and stability, and the use of ceramic or other advanced package materials for superior thermal performance. There is also a drive towards standardized form factors and footprints to simplify design and manufacturing across the lighting industry. The principles of thermal management and constant-current drive remain foundational to all high-power LED applications.