LTW-010DCG White LED Datasheet - EIA Package - Voltage 2.9-3.6V - Luminous Intensity 1900-2800mcd - English Technical Document

1. Product Overview

The LTW series represents an energy-efficient and ultra-compact solid-state lighting solution. This product combines the long lifetime and high reliability inherent to Light Emitting Diodes with a brightness level suitable for displacing conventional lighting technologies in various applications. It offers design flexibility and is presented in a package compatible with automated assembly processes.

1.1 Key Features and Benefits

The primary features of this LED component focus on manufacturability and environmental compliance.

• Packaged on 12mm tape wound on 7-inch diameter reels.
• Fully compatible with standard automatic pick-and-place equipment.
• Suitable for both infrared (IR) and vapor phase reflow soldering processes.
• Conforms to EIA standard package outlines.
• Designed to be compatible with integrated circuit (IC) driving methods.
• Manufactured as a green product, compliant with Pb-free requirements according to RoHS directives.

The component is designed for a wide array of lighting applications, leveraging its compact size and efficiency. Potential use cases include, but are not limited to: reading lights for automotive, bus, and aircraft interiors; portable lighting such as flashlights and bicycle lights; downlighters and orientation lighting; decorative and entertainment lighting; security, garden, and bollard lighting; cove, undershelf, and task lighting; traffic signaling, beacons, and railway crossing lights; various indoor and outdoor commercial and residential architectural lighting; and edge-lit signs for exits or point-of-sale displays.

2. Mechanical and Package Information

The LED is provided in a standard surface-mount device (SMD) package. The detailed outline and dimensions are provided in the datasheet drawings. All dimensional values are specified in millimeters (mm). The standard tolerance for these dimensions is ±0.1 mm (approximately ±0.004 inches), unless explicitly stated otherwise in the notes accompanying the drawings. The datasheet also includes detailed diagrams for the recommended printed circuit board (PCB) attachment pad layout to ensure proper soldering and thermal performance.

2.1 Packaging Specifications

The components are supplied in a tape-and-reel format suitable for high-volume assembly.

• Tape: The LEDs are housed in pockets within a 12mm wide carrier tape.
• Reel: The tape is wound onto a standard 7-inch (178mm) diameter reel.
• Quantity: Each reel contains a maximum of 2000 pieces.
• Cover Tape: Empty component pockets are sealed with a top cover tape.
• Missing Components: The specification allows for a maximum of two consecutive missing lamps on a reel.
• Standard: The packaging conforms to EIA-481-1-B specifications.

3. Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (Ta) of 25°C.

Important Note: Operating the LED under any reverse bias condition in an application may lead to component damage or failure.

4. Electro-Optical Characteristics

The typical performance parameters are measured at an ambient temperature of 25°C and a forward current (IF) of 20mA, unless otherwise noted.

Measurement Notes:

1. Luminous intensity is measured using a sensor and filter combination that approximates the CIE standard photopic eye-response curve.
2. The viewing angle (2θ1/2) is defined as the full angle at which the luminous intensity drops to half of its value measured on the central axis.
3. The chromaticity coordinates (x, y) are defined according to the CIE 1931 chromaticity diagram.
4. The test standard referenced for measuring chromaticity and luminous intensity is CAS140B.
5. A tolerance of ±0.01 should be applied to the guaranteed chromaticity coordinates.

ESD Caution: This device is sensitive to electrostatic discharge (ESD) and electrical surges. Proper ESD precautions must be taken during handling, including the use of grounded wrist straps or anti-static gloves. All associated equipment and workstations must be correctly grounded.

5. Bin Code System and Specifications

The LEDs are sorted into bins based on key parameters to ensure consistency within a production lot. The bin codes allow designers to select components that meet specific application requirements for voltage and brightness.

5.1 Forward Voltage (VF) Binning

LEDs are categorized by their forward voltage drop at a test current of 20mA.

Tolerance on each Forward Voltage bin is ±0.1V.

5.2 Luminous Intensity (Iv) Binning

LEDs are sorted based on their luminous intensity output at 20mA.

Tolerance on each Luminous Intensity bin is ±10%.

5.3 Chromaticity (Color) Binning

A detailed color ranks table is provided, specifying the CIE 1931 (x, y) chromaticity coordinate boundaries for various bin codes (e.g., A52, A53, BE1, BG3, etc.). This allows for precise color selection. The tolerance for each hue (x, y) bin is ±0.01.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is compatible with lead-free reflow soldering processes. The datasheet provides a suggested infrared (IR) reflow soldering profile compliant with the J-STD-020D standard. The peak reflow temperature is specified as 260°C, with a maximum exposure time at that temperature of 10 seconds. Adhering to this profile is critical to prevent thermal damage to the LED package and internal die.

6.2 Cleaning

Care must be taken when cleaning assembled boards containing these LEDs. The use of unspecified chemical cleaners is prohibited as they may damage the LED package material (e.g., the lens or encapsulant). If cleaning is absolutely necessary, the recommended method is to immerse the LEDs in ethyl alcohol or isopropyl alcohol at normal room temperature. The immersion time must not exceed one minute to prevent potential degradation.

7. Reliability and Handling Precautions

7.1 Application Considerations

This LED product is designed and qualified for use in standard commercial and consumer electronic equipment. Examples include office equipment, communication devices, and household appliances. For applications requiring exceptional reliability where failure could risk life or health—such as in aviation, transportation, medical/life-support systems, or safety-critical devices—additional qualification and consultation are mandatory prior to design-in.

7.2 Moisture Sensitivity and Storage

This product is classified as Moisture Sensitivity Level (MSL) 3 per the JEDEC J-STD-020 standard. This classification has important implications for handling and storage to prevent \"popcorning\" or package cracking during reflow due to absorbed moisture.

• Sealed Bag Storage: When the moisture-proof barrier bag is unopened, the LEDs should be stored at 30°C or less and 90% Relative Humidity (RH) or less. The components have a shelf life of one year in this condition.
• After Bag Opening: Once the moisture-proof bag is opened, the LEDs must be stored in an environment of 30°C or less and 60% RH or less.
• Floor Life: After the bag is opened, the components must undergo the reflow soldering process within 168 hours (7 days). This time limit is critical. The condition should be verified using the humidity indicator card (HIC) included in the bag; if the indicator shows pink (exceeding 10% RH level), the components require baking before use according to the appropriate MSL3 procedures.

8. Typical Performance Curves and User Guide

The datasheet includes a section for typical characteristic curves, which graphically represent the relationship between various parameters. These curves are essential for detailed circuit design and understanding device behavior under different conditions. While the specific graphs are not detailed in the provided text, they typically include:

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with driving current.
• Forward Voltage vs. Forward Current: Illustrates the diode's IV characteristic.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the thermal derating of light output.
• Viewing Angle Pattern: A polar plot showing the spatial distribution of light.

The user guide section consolidates practical information for implementing the LED, including the recommended PCB pad layout (for optimal solder joint formation and heat dissipation), tape dimensions, and reel specifications, ensuring compatibility with manufacturing equipment.