334-15/F1C1-1XZA White LED Lamp Datasheet - T-1 3/4 Package - 3.2V Typ - 15 deg Viewing Angle - English Technical Document

1. Product Overview

This document details the specifications for a high-luminosity white LED lamp encapsulated in a popular T-1 3/4 round package. The device is engineered to deliver superior luminous output, making it suitable for applications demanding high brightness and clear visibility.

1.1 Core Features and Advantages

The LED offers several key advantages: a compact and industry-standard T-1 3/4 form factor, very high luminous intensity, and compliance with environmental and handling standards. Its typical chromaticity coordinates are x=0.29, y=0.28 according to the CIE 1931 color space, producing a consistent white light. The device is designed to withstand electrostatic discharge (ESD) up to 4KV (HBM) and adheres to RoHS compliance requirements.

1.2 Technology and Operating Principle

The white light is generated using an InGaN (Indium Gallium Nitride) semiconductor chip that emits blue light. A phosphor coating, deposited within the reflector cup of the package, absorbs a portion of this blue emission and re-emits it as yellow light. The combination of the remaining blue light and the converted yellow light results in the perception of white light by the human eye. This phosphor-converted white LED technology allows for efficient and tunable white light production.

2. Absolute Maximum Ratings

Operating the device beyond these limits may cause permanent damage.

• Continuous Forward Current (I_F): 30 mA
• Peak Forward Current (I_FP): 100 mA (Duty 1/10 @ 1kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 110 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• ESD Withstand Voltage (HBM): 4000 V
• Zener Reverse Current (I_z): 100 mA (Note: This suggests an integrated protection Zener diode)
• Soldering Temperature (T_sol): 260°C for 5 seconds

3. Electro-Optical Characteristics (T_a=25°C)

Typical performance parameters measured under standard test conditions.

• Forward Voltage (V_F): 2.8V (Min), 3.2V (Typ), 3.6V (Max) at I_F=20mA
• Reverse Current (I_R): 50 µA (Max) at V_R=5V
• Luminous Intensity (I_V): 18000 mcd (Min), 36000 mcd (Max) at I_F=20mA. The typical value falls within the defined bin ranges.
• Zener Reverse Voltage (V_z): 5.2V (Typ) at I_z=5mA, confirming the integrated protection diode.
• Viewing Angle (2θ_1/2): 15° (Typ) at I_F=20mA, indicating a relatively narrow beam.
• Chromaticity Coordinates: x=0.29 (Typ), y=0.28 (Typ) at I_F=20mA.

4. Binning and Classification System

To ensure consistency, LEDs are sorted into bins based on key parameters.

4.1 Luminous Intensity Binning

LEDs are categorized into three bins (X, Y, Z) based on their measured luminous intensity at 20mA.
Bin X: 18000 - 22500 mcd
Bin Y: 22500 - 28500 mcd
Bin Z: 28500 - 36000 mcd
A general tolerance of ±10% applies to luminous intensity.

4.2 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design for current regulation.
Bin 0: 2.8 - 3.0V
Bin 1: 3.0 - 3.2V
Bin 2: 3.2 - 3.4V
Bin 3: 3.4 - 3.6V
Measurement uncertainty for V_F is ±0.1V.

4.3 Color Binning (Chromaticity)

The color is defined within specific regions on the CIE 1931 chromaticity diagram. The document specifies seven color ranks: A1, A0, B3, B4, B5, B6, and C0, each with defined coordinate boundaries (x, y). These ranks correspond to different correlated color temperatures (CCT), ranging from warmer to cooler white. A grouping (Group 1: A1+A0+B3+B4+B5+B6+C0) is provided, likely representing the standard shipping mix. Measurement uncertainty for color coordinates is ±0.01.

5. Performance Curve Analysis

Graphical data provides insight into device behavior under varying conditions.

5.1 Relative Intensity vs. Wavelength

The spectral power distribution curve shows a dominant blue peak from the InGaN chip and a broader yellow peak from the phosphor, combining to form the white light spectrum.

5.2 Directivity Pattern

The polar diagram illustrates the 15° typical viewing angle, showing how light intensity decreases at angles off the central axis.

5.3 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship, crucial for designing appropriate current-limiting circuitry.

5.4 Relative Intensity vs. Forward Current

Shows the light output's dependence on drive current, typically increasing sub-linearly at higher currents due to efficiency droop.

5.5 Chromaticity Shift vs. Forward Current

Depicts how the color coordinates (x, y) may shift slightly with changes in drive current, which is important for color-critical applications.

5.6 Forward Current vs. Ambient Temperature

This derating curve indicates the maximum allowable forward current decreases as ambient temperature increases to prevent overheating and ensure reliability.

6. Mechanical and Package Information

6.1 Package Dimensions

The T-1 3/4 round package dimensions are provided in a detailed drawing. Key notes include: all dimensions are in millimeters with a standard tolerance of ±0.25mm unless specified; lead spacing is measured at the package exit; and the maximum resin protrusion under the flange is 1.5mm.

6.2 Polarity Identification

The cathode is typically identified by a flat spot on the lens, a shorter lead, or other marking as per the dimensional drawing. Correct polarity must be observed during installation.

7. Assembly, Handling, and Storage Guidelines

7.1 Lead Forming

If leads need bending, it must be done at a point at least 3mm from the epoxy bulb base, performed before soldering, and done carefully to avoid stressing the package. Cutting should be done at room temperature. PCB holes must align perfectly with LED leads to avoid mounting stress.

7.2 Storage Conditions

LEDs should be stored at ≤30°C and ≤70% Relative Humidity. Shelf life is 3 months under these conditions. For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in humid environments to prevent condensation.

7.3 Soldering Recommendations

Maintain a distance of >3mm from the solder joint to the epoxy bulb. Soldering beyond the base of the tie bar is recommended. For hand soldering, use an iron tip temperature ≤300°C (30W max). For wave or dip soldering, follow the profile with a peak of 260°C for 5 seconds.

8. Packaging and Ordering Information

8.1 Packing Specification

LEDs are packed in anti-static bags (capable of withstanding 750V electrostatic fields) placed inside inner cartons, which are then packed into master shipping cartons. Packing quantity: 200-500 pieces per bag, 5 bags per inner carton, 10 inner cartons per outside carton.

8.2 Label Explanation

Labels include: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank), HUE (Dominant Wavelength/Color Rank), REF (Forward Voltage Rank), and LOT No. (Lot Number).

8.3 Product Designation / Part Numbering

The part number follows the format: 334-15/FN C1-□ □ □ □. The \"FN\" and subsequent squares likely denote specific options for luminous intensity bin, forward voltage bin, and color rank, allowing precise ordering.

9. Application Notes and Design Considerations

9.1 Typical Application Scenarios

This high-intensity LED is ideal for:
- Message Panels & Signage: Where bright, legible characters are needed.
- Optical Indicators: For status or warning lights requiring high visibility.
- Backlighting: For small panels, switches, or icons.
- Marker Lights: For aesthetic or positional marking.

9.2 Circuit Design Considerations

Always use a series current-limiting resistor or a constant-current driver. The forward voltage bin should be considered when calculating the resistor value to ensure consistent current and brightness. The integrated Zener diode provides basic reverse voltage protection but does not replace proper forward current regulation. For applications requiring stable color, consider the slight chromaticity shift with current and temperature.

9.3 Thermal Management

While the package has limited thermal dissipation capability, adhering to the maximum power dissipation (110mW) and current derating curve with temperature is essential for long-term reliability. Avoid operating in enclosed spaces without ventilation.

10. Technical Comparison and Market Context

This LED's primary differentiators are its very high luminous intensity within the compact T-1 3/4 package and its narrow 15° viewing angle, which concentrates light output for maximum axial brightness. Compared to standard T-1 LEDs, it offers significantly higher output. Compared to SMD (Surface Mount Device) LEDs, the through-hole package may be preferred for prototyping, manual assembly, or applications requiring robust mechanical mounting.

11. Frequently Asked Questions (FAQ)

Q: What is the typical drive current for this LED?
A: The standard test condition and many specifications are given at I_F=20mA. It can be driven up to 30mA continuously, but light output and efficiency should be evaluated from the performance curves.

Q: How do I interpret the color bins (A1, C0, etc.)?
A> These codes represent specific regions on the CIE chromaticity diagram, corresponding to different shades of white (from warmer to cooler). Refer to the chromaticity diagram and coordinate table in the datasheet. Group 1 is a common mix.

Q: Does this LED require a heatsink?
A: For continuous operation at maximum ratings, especially in elevated ambient temperatures, some form of thermal management (e.g., PCB copper area, airflow) is advisable to maintain performance and lifespan, though a dedicated heatsink may not be mandatory for all applications.

Q: Can I use it for automotive applications?
A: The operating temperature range (-40°C to +85°C) covers many automotive environments. However, specific automotive qualification (AEC-Q102) and application-specific testing (vibration, humidity, etc.) are not indicated in this generic datasheet and would need verification.

12. Practical Application Example

Design Case: High-Visibility Panel Indicator
Requirement: Design a status indicator visible in bright ambient light.
Solution: Use this LED with a 15° viewing angle to create a bright, focused spot. Drive it at 20mA using a constant-current circuit or a series resistor calculated based on the supply voltage (e.g., 12V) and the LED's forward voltage bin (e.g., Bin 1: 3.1V typical). R = (12V - 3.1V) / 0.020A = 445 Ω (use 470 Ω standard value). Place the LED behind a small aperture or collimating lens to enhance the narrow beam effect. Ensure the PCB layout allows the recommended 3mm clearance from the epoxy bulb for soldering.

13. Technology Trends

The industry continues to advance in phosphor-converted white LED technology, focusing on higher efficiency (lumens per watt), improved color rendering index (CRI) for better color accuracy, and greater color consistency (tighter binning). While through-hole packages like the T-1 3/4 remain relevant for specific markets, the broader trend is towards high-power SMD packages and Chip-Scale Package (CSP) LEDs for better thermal performance and miniaturization. The integration of protection elements, like the Zener diode seen here, is a common practice to enhance robustness in end applications.