334-15/T1 C3-2TVA LED Lamp Datasheet - T-1 3/4 Package - 3.6V Max - 30mA - White Light - English Technical Document

1. Product Overview

This document details the specifications for a high-luminosity white LED lamp. The device is built using an InGaN semiconductor chip and a phosphor conversion system within a popular T-1 3/4 round package. The primary design goal is to deliver high luminous intensity suitable for a range of indicator and illumination applications. The product adheres to several environmental and safety standards, including RoHS compliance, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It also features a robust ESD withstand voltage of up to 4KV (HBM).

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined under conditions of Ta=25°C. Exceeding these ratings may cause permanent damage.

• Continuous Forward Current (I_F): 30 mA
• Peak Forward Current (I_FP): 100 mA (Duty 1/10 @ 1KHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 110 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• ESD (HBM): 4000 V
• Zener Reverse Current (I_z): 100 mA
• Soldering Temperature (T_sol): 260°C for 5 seconds.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at Ta=25°C and a standard test current of I_F=20mA.

• Forward Voltage (V_F): Min. 2.8V, Typ. --, Max. 3.6V. This defines the voltage drop across the LED when operating.
• Zener Reverse Voltage (V_z): Typ. 5.2V at I_z=5mA, indicating an integrated protection feature.
• Reverse Current (I_R): Max. 50 µA at V_R=5V.
• Luminous Intensity (I_V): Min. 7150 mcd, Typ. --, Max. 14250 mcd. This is the primary measure of light output.
• Viewing Angle (2θ_1/2): Typical 30 degrees. This defines the angular spread where luminous intensity is at least half of the peak value.
• Chromaticity Coordinates (CIE 1931): Typical x=0.26, y=0.27. This places the white light output within a specific region on the color chart.

3. Binning System Explanation

The LEDs are sorted into bins based on key parameters to ensure consistency in production runs.

3.1 Luminous Intensity Binning

LEDs are categorized into three bins (T, U, V) based on their measured luminous intensity at I_F=20mA, with a stated tolerance of ±10%.

• Bin T: 7150 mcd (Min.) to 9000 mcd (Max.)
• Bin U: 9000 mcd (Min.) to 11250 mcd (Max.)
• Bin V: 11250 mcd (Min.) to 14250 mcd (Max.)

3.2 Forward Voltage Binning

Forward voltage is binned into four codes (0, 1, 2, 3) with a measurement uncertainty of ±0.1V.

• Bin 0: 2.8V (Min.) to 3.0V (Max.)
• Bin 1: 3.0V (Min.) to 3.2V (Max.)
• Bin 2: 3.2V (Min.) to 3.4V (Max.)
• Bin 3: 3.4V (Min.) to 3.6V (Max.)

3.3 Color Binning

The color is defined within specific chromaticity coordinate boundaries. The datasheet references groups combining specific bins (e.g., Group 1: A1+A0). The color ranks A1 and A0 have defined coordinate boxes on the CIE 1931 diagram, with a measurement uncertainty of ±0.01 for both x and y coordinates.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate device behavior under varying conditions.

• Relative Intensity vs. Wavelength: Shows the spectral power distribution of the white light, which is a combination of the blue InGaN chip emission and the broader phosphor-converted yellow emission.
• Directivity Pattern: A polar plot visualizing the 30-degree typical viewing angle, showing how light intensity decreases from the center axis.
• Forward Current vs. Forward Voltage (I-V Curve): Demonstrates the exponential relationship, crucial for designing current-limiting circuitry.
• Relative Intensity vs. Forward Current: Shows how light output increases with drive current, important for brightness control and understanding efficiency.
• Chromaticity Coordinate vs. Forward Current: Indicates how the perceived color of the white light may shift slightly with changes in operating current.
• Forward Current vs. Ambient Temperature: Illustrates the derating of the maximum permissible forward current as ambient temperature increases, critical for thermal management.

5. Mechanical and Package Information

The device uses a standard T-1 3/4 (approximately 5mm) round package with two axial leads. Key dimensional notes include:

• All dimensions are in millimeters (mm).
• A general tolerance of ±0.25mm applies unless otherwise specified.
• Lead spacing is measured at the point where the leads exit the package body.
• The maximum protrusion of resin under the flange is 1.5mm.
• The package drawing provides detailed measurements for the lens diameter, body length, lead length and diameter, and seating plane.

6. Soldering and Assembly Guidelines

6.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid stressing the package during bending to prevent internal damage or breakage.
• Cut leads at room temperature; high-temperature cutting may cause failure.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

6.2 Storage

• Recommended storage: ≤30°C and ≤70% Relative Humidity.
• Standard storage life after shipment: 3 months.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in high humidity to prevent condensation.

6.3 Soldering

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature max 300°C (for 30W max iron), soldering time max 3 seconds.

Wave/DIP Soldering: Pre-heat temperature max 100°C (for max 60 sec), solder bath temperature max 260°C for 5 seconds.

7. Packaging and Ordering Information

7.1 Packing Specification

• Packaging: LEDs are packed in anti-electrostatic bags, placed in inner cartons, which are then packed into master outside cartons.
• Packing Quantity: 200-500 pieces per bag. 5 bags per inner carton. 10 inner cartons per outside carton.

7.2 Label Explanation

Labels on packaging include: Customer's Production Number (CPN), Production Number (P/N), Quantity (QTY), Luminous Intensity and Forward Voltage Ranks (CAT), Color Rank (HUE), Reference (REF), and Lot Number (LOT No).

7.3 Production Designation / Part Numbering

The part number follows the format: 334-15/T1C3- □ □ □ □. The blank squares (□) are placeholders for the specific bin codes related to Color Group, Luminous Intensity Bin, and Voltage Group, allowing for precise selection of performance characteristics.

8. Application Suggestions

8.1 Typical Application Scenarios

• Message Panels & Optical Indicators: Leverages high luminous intensity for excellent visibility.
• Backlighting: Suitable for small panel or icon backlighting.
• Marker Lights: Ideal for status or position indication.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit I_F to 30mA or below.
• Thermal Management: Consider the derating curve (Forward Current vs. Ambient Temp). In high-temperature environments or enclosed spaces, reduce drive current to maintain reliability.
• ESD Protection: While rated for 4KV HBM, implementing standard ESD protection on PCBs is good practice, especially in handling and assembly.
• Optical Design: The 30-degree viewing angle provides a relatively focused beam. For wider illumination, secondary optics (lenses, diffusers) may be required.

9. Technical Comparison and Differentiation

This LED's key differentiators in its class (T-1 3/4 white LED) include:

• High Luminous Intensity: A minimum of 7150 mcd is notably high for this package size, offering superior brightness.
• Integrated Zener Protection: The specified Zener reverse voltage (Vz) suggests built-in reverse voltage protection, which is not always present in basic LEDs, enhancing robustness in circuit design.
• Comprehensive Binning: Detailed binning for intensity, voltage, and color allows for precise matching in applications requiring consistency across multiple units.
• Environmental Compliance: Meets modern standards like Halogen-Free and REACH, which may be critical for specific markets and environmentally conscious designs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the recommended operating current?
A1: The absolute maximum continuous current is 30mA. A typical operating point is 20mA, which is the standard test condition for the listed optical specifications (luminous intensity, color). Operating at 20mA provides a good balance of brightness, efficiency, and longevity.

Q2: How do I interpret the luminous intensity bins (T, U, V)?
A2: These bins guarantee a minimum light output. For example, ordering from Bin V guarantees each LED will have at least 11250 mcd at 20mA. This is crucial for applications where a minimum brightness level must be met. The bins allow designers to select a cost-appropriate performance tier.

Q3: Can I drive this LED with a 5V supply?
A3: Not directly without a current-limiting resistor. The forward voltage (Vf) is between 2.8V and 3.6V. Connecting 5V directly would cause excessive current, destroying the LED. You must calculate and use a series resistor: R = (Supply Voltage - Vf) / I_F. Using a typical Vf of 3.2V and I_F=20mA with a 5V supply: R = (5 - 3.2) / 0.02 = 90 Ohms.

Q4: What does the 4KV ESD rating mean for handling?
A4: It means the LED can typically withstand a 4000V electrostatic discharge per the Human Body Model (HBM) without damage. While this is robust, it is still essential to follow standard ESD precautions during handling and assembly (e.g., using grounded workstations, wrist straps) to prevent cumulative damage or latent defects.

Q5: How critical is the 3mm minimum distance for soldering/lead bending?
A5: Very critical. The epoxy resin and internal wire bonds near the package base are sensitive to heat and mechanical stress. Violating this distance can cause immediate failure (cracked resin, broken bond) or long-term reliability issues (degraded light output, premature failure).

11. Practical Use Case Example

Scenario: Designing a High-Visibility Status Indicator Panel
A designer needs 20 bright white indicators for a control panel that must be visible under high ambient light. They select LEDs from the highest luminous intensity Bin (V) to ensure sufficient brightness. To ensure uniform appearance, they also specify a tight color bin (e.g., Group 1). A simple driver circuit is designed using a 5V rail. For each LED, a 100-ohm, 1/8W resistor is calculated (using a conservative Vf of 3.4V for Bin 2/3: (5-3.4)/0.02=80 Ohms; 100 Ohms is a standard value providing ~16mA, a safe and bright operating point). The PCB layout ensures a 3mm clearance between the solder pad and the LED body outline. During assembly, a soldering jig is used to maintain the 3mm lead bend distance before insertion into the board.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN). When a forward current is applied, electrons and holes recombine within the chip, emitting photons in the blue region of the spectrum (typically around 450-455nm). This blue light is not emitted directly. Instead, it strikes a layer of yellow (or yellow and red) phosphor material that is deposited inside the reflector cup surrounding the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broader spectrum of longer wavelength (yellow) light. The remaining unabsorbed blue light mixes with the yellow phosphorescent light, and the human eye perceives this combination as white light. The exact shade or "color temperature" of the white light is determined by the ratio of blue to yellow light, which is controlled by the phosphor composition and concentration.

13. Technology Trends and Context

The T-1 3/4 package represents a mature, through-hole technology widely used for decades in indicator applications. The use of an InGaN chip with phosphor conversion is the standard method for producing white LEDs since the invention of the blue LED. Current trends in the broader LED industry are moving towards:

• Surface-Mount Devices (SMDs): For automated assembly and smaller form factors, packages like 3528, 5050, or 2835 have largely replaced through-hole LEDs in new high-volume designs.
• Higher Efficiency: Ongoing development focuses on increasing lumens per watt (lm/W), reducing the electrical power needed for the same light output.
• Improved Color Rendering (CRI): Using multi-phosphor blends or violet/blue chips with red/green phosphors to produce white light that more accurately renders object colors.
• Integrated Solutions: LEDs with built-in current regulators, controllers, or even full RGB color mixing capabilities.

Despite these trends, through-hole LEDs like this one remain relevant for prototyping, repair, legacy system maintenance, educational purposes, and applications where manual assembly or extreme ruggedness is required. Their high intensity in a simple, robust package ensures a continued niche in the electronics component landscape.