T20 Series 2016 White LED Datasheet - Size 2.0x1.6x0.75mm - Voltage 5.9-6.4V - Power 0.64W - English Technical Document

1. Product Overview

The T20 Series 2016 is a high-performance white LED designed for general lighting applications. This top-view LED features a thermally enhanced package design, enabling high luminous flux output and reliable operation under demanding conditions. Its compact size and wide viewing angle make it suitable for a variety of lighting fixtures.

1.1 Core Advantages

• Thermally Enhanced Package: Improved thermal management for better performance and longevity.
• High Luminous Flux Output: Delivers bright, efficient illumination.
• High Current Capability: Supports operation at up to 100mA forward current.
• Compact Package Size: The 2016 footprint (2.0mm x 1.6mm) allows for high-density PCB layouts.
• Wide Viewing Angle: A typical 120-degree half-intensity angle provides broad, uniform light distribution.
• Pb-free and RoHS Compliant: Suitable for environmentally conscious manufacturing processes.

1.2 Target Market and Applications

This LED is engineered for diverse lighting solutions where reliability and efficiency are paramount.

• Interior Lighting: Downlights, panel lights, and other indoor fixtures.
• Retrofits and Replacements: Upgrading existing lighting systems with modern LED technology.
• General Lighting: A versatile light source for commercial and residential use.
• Architectural and Decorative Lighting: Accent lighting, cove lighting, and other design-focused applications.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Electro-Optical Characteristics

The performance is measured at a standard test condition of 80mA forward current (IF) and a junction temperature (Tj) of 25°C. The luminous flux varies with Correlated Color Temperature (CCT) and Color Rendering Index (CRI).

• Luminous Flux (Typical/Minimum): Ranges from approximately 51 lm to 66 lm depending on CCT/CRI combination. For example, a 4000K LED with Ra80 has a typical flux of 66 lm and a minimum of 63 lm.
• Tolerances: Luminous flux measurements have a ±7% tolerance, and CRI (Ra) measurements have a ±2 tolerance.

2.2 Absolute Maximum Ratings

These are the stress limits beyond which permanent damage to the device may occur. Operation should always be maintained within these limits.

• Forward Current (IF): 100 mA (Continuous).
• Pulse Forward Current (IFP): 150 mA (Pulse width ≤100μs, Duty cycle ≤1/10).
• Power Dissipation (PD): 640 mW.
• Reverse Voltage (VR): 5 V.
• Operating Temperature (Topr): -40°C to +105°C.
• Junction Temperature (Tj): 120°C (Maximum).

2.3 Electrical and Thermal Characteristics

These are typical operating parameters at Tj=25°C.

• Forward Voltage (VF): 5.9V to 6.4V at IF=80mA, with a measurement tolerance of ±0.2V.
• Viewing Angle (2θ1/2): 120 degrees (typical). This is the off-axis angle where luminous intensity drops to half its peak value.
• Thermal Resistance (Rth j-sp): 25 °C/W (typical). This parameter indicates the thermal impedance from the LED junction to the solder point on an MCPCB, crucial for heatsink design.
• Electrostatic Discharge (ESD): Withstands 1000V (Human Body Model).

3. Binning System Explanation

The LEDs are sorted into bins based on key performance parameters to ensure consistency in production runs.

3.1 Luminous Flux Binning

LEDs are categorized into specific flux ranks (e.g., E8, F1) with defined minimum and maximum luminous output values. The binning structure is defined separately for different CCT and CRI combinations. For instance, a 4000K Ra80 LED in bin F1 will have a luminous flux between 66 lm and 70 lm.

3.2 Forward Voltage Binning

LEDs are also binned by forward voltage drop at 80mA. Codes like Z3, A4, B4, and C4 represent voltage ranges (e.g., Z3: 5.6V - 5.8V). This is important for designing constant-current drivers to ensure uniform brightness across multiple LEDs in a string.

3.3 Chromaticity Binning (Color)

The color consistency is controlled within a 5-step MacAdam ellipse on the CIE chromaticity diagram. Each CCT (e.g., 2700K, 4000K) has a defined center coordinate (x, y) and ellipse parameters (a, b, Φ). This ensures minimal visible color difference between LEDs of the same nominal white point.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions.

4.1 Spectral Power Distribution

The datasheet includes spectra for both Ra80 and Ra90 variants. These curves show the relative intensity across wavelengths, defining the light's color quality and rendering properties.

4.2 Current vs. Voltage (I-V) and Current vs. Relative Intensity

The I-V curve (Fig. 5) shows the non-linear relationship between forward current and voltage. The curve showing forward current vs. relative intensity (Fig. 4) demonstrates how light output increases with current, up to the maximum rating.

4.3 Temperature Dependence

Key graphs illustrate the impact of ambient temperature (Ta):

• Relative Luminous Flux vs. Ta (Fig. 6): Light output decreases as temperature rises. Proper thermal design is critical to maintain brightness.
• Relative Forward Voltage vs. Ta (Fig. 7): Forward voltage typically decreases with increasing temperature.
• Chromaticity Shift vs. Ta (Fig. 8): Shows how the white point color coordinates may shift with temperature.

4.4 Forward Current Derating Curve

Figure 9 provides the allowable forward current as a function of ambient/solder point temperature. To ensure reliability and prevent overheating, the maximum permissible current must be reduced when operating at higher ambient temperatures.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact 2016 package size. Key dimensions include:

• Length: 2.00 mm
• Width: 1.60 mm
• Height: 0.75 mm (typical)
• Land pattern (solder pad) dimensions are provided for PCB layout.

All unspecified tolerances are ±0.1mm.

5.2 Polarity Identification

The cathode and anode are clearly marked in the bottom view diagram. Correct polarity connection is essential for device operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with standard Pb-free reflow soldering processes. The recommended profile parameters include:

• Peak Package Body Temperature (Tp): 260°C maximum.
• Time above Liquidous (TL=217°C): 60 to 150 seconds.
• Ramp-up Rate: Maximum 3°C per second from TL to Tp.
• Preheat: Ramp from 150°C to 200°C over 60-120 seconds.

Adherence to this profile is critical to prevent thermal damage to the LED package and internal die.

6.2 Handling and Storage Considerations

• ESD precautions should be observed during handling.
• Recommended storage temperature is between -40°C and +85°C.
• Avoid exposure to moisture; use dry packaging or bake according to standard MSL (Moisture Sensitivity Level) procedures if necessary.

7. Part Numbering and Ordering Information

7.1 Model Numbering System

The part number follows the format: T [X1][X2][X3][X4][X5][X6] – [X7][X8][X9][X10].

• X1 (Type Code): '20' for the 2016 package.
• X2 (CCT Code): e.g., '27' for 2700K, '40' for 4000K.
• X3 (Color Rendering): '7' for Ra70, '8' for Ra80, '9' for Ra90.
• X4 (Serial Chips): Number of chips in series (1-Z).
• X5 (Parallel Chips): Number of chips in parallel (1-Z).
• X6 (Component Code): Internal designation (A-Z).
• X7 (Color Code): Defines performance standard (e.g., 'M' for ANSI, 'F' for ERP).

8. Application Design Recommendations

8.1 Driver Circuit Design

Due to the forward voltage characteristics and binning, a constant-current driver is strongly recommended over a constant-voltage source. This ensures stable light output and protects the LED from current spikes. The driver should be selected to operate within the Absolute Maximum Ratings, considering the derating curve for high-temperature environments.

8.2 Thermal Management

Effective heat sinking is paramount for performance and lifetime. The thermal resistance from junction to solder point (Rth j-sp) is 25°C/W. Design the PCB and heatsink to keep the solder point temperature as low as possible, especially when operating at high currents or in warm ambients. Use thermally conductive materials and ensure good mechanical contact between the LED package and the heatsink.

8.3 Optical Design

The 120-degree viewing angle is suitable for applications requiring wide, diffuse illumination. For more focused beams, secondary optics (lenses or reflectors) will be necessary. The top-view design facilitates direct light emission perpendicular to the mounting plane.

9. Technical Comparison and Differentiation

While specific competitor comparisons are not provided in the source document, the T20 Series 2016 LED's key differentiators based on its specifications include:

• Balanced Performance: Offers a competitive combination of high luminous flux, good CRI options (up to Ra90), and a wide CCT range in a very compact package.
• Thermal Design: The explicitly stated 'Thermally Enhanced Package Design' suggests a focus on reliability under drive conditions, which may offer an advantage in applications where thermal management is challenging.
• Comprehensive Binning: Detailed binning for flux, voltage, and color (5-step MacAdam) allows for precise color matching and electrical consistency in high-quality lighting products.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the actual power consumption of this LED?

At the typical test condition of 80mA and a forward voltage of 5.9V-6.4V, the electrical power is between 472mW and 512mW. This is below the absolute maximum power dissipation rating of 640mW, providing a safety margin.

10.2 Can I drive this LED at its maximum current of 100mA?

Yes, but only if the thermal conditions allow it. You must consult the forward current derating curve (Fig. 9). At elevated ambient temperatures, the maximum allowable current is reduced. Exceeding the derated current or the maximum junction temperature (120°C) will shorten the LED's lifespan.

10.3 How do I select the right bin for my application?

For uniform appearance in multi-LED fixtures, specify tight bins for luminous flux (e.g., F1 only) and chromaticity (5-step ellipse). For cost-sensitive applications where slight variations are acceptable, a wider bin or mixing bins might be permissible. Voltage binning is critical for designs using LEDs in series to ensure they share current evenly.

11. Design and Usage Case Study

Scenario: Designing a retrofit LED tube light.

1. Requirements: Replace a fluorescent T8 tube. Need high efficiency, good color rendering (Ra80+), 4000K light, and reliable operation in an enclosed fixture.
2. LED Selection: The T20 2016 LED in 4000K/Ra80 is chosen for its high flux and compact size, allowing many LEDs to be placed on a narrow PCB strip.
3. Thermal Design: The aluminum PCB acts as a heatsink. The thermal resistance (25°C/W) is used to calculate the expected junction temperature based on the LED power and the PCB's ability to dissipate heat to the tube's environment. The derating curve is checked to ensure the chosen drive current (e.g., 80mA) is safe at the predicted maximum internal tube temperature.
4. Electrical Design: LEDs are arranged in a series-parallel configuration. Voltage bins (e.g., A4: 5.8-6.0V) are specified to minimize voltage mismatch. A constant-current driver compatible with the total voltage and current of the string is selected.
5. Result: A high-quality, reliable LED tube with consistent brightness and color, made possible by adhering to the detailed specifications and application guidelines provided in this datasheet.

12. Technical Principle Introduction

White LEDs are typically based on a blue LED chip coated with a phosphor layer. When the blue light from the semiconductor chip excites the phosphor, it down-converts a portion of this light to longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-emitted light is perceived as white by the human eye. The Correlated Color Temperature (CCT) is controlled by the phosphor composition, making it appear 'warm' (2700K, more yellow/red) or 'cool' (6500K, more blue). The Color Rendering Index (CRI) measures how accurately the light reveals the true colors of objects compared to a natural reference source; a higher Ra value (e.g., 90) indicates better color fidelity.

13. Industry Trends and Developments

The LED industry continues to evolve towards higher efficacy (more lumens per watt), improved color quality, and greater reliability. Trends relevant to components like the T20 Series include:

• Increased Efficiency: Ongoing improvements in chip and phosphor technology drive higher luminous flux from the same or smaller packages.
• Color Quality: Demand for high-CRI (Ra90, Ra95+) and full-spectrum lighting is growing in commercial and residential applications.
• Miniaturization: The push for smaller, more powerful LEDs enables sleeker luminaire designs and higher pixel density in direct-view applications.
• Smart and Tunable Lighting: LEDs are increasingly integrated into systems that allow dynamic control of intensity and color temperature.
• Sustainability: Focus on long lifetime, RoHS compliance, and recyclability remains a strong driver in component design and manufacturing.

The specifications of the T20 Series 2016 LED align with these trends by offering good efficiency, high-CRI options, and a compact form factor suitable for modern lighting designs.