PLCC-2 Side View Yellow LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 2.2V - Power 0.11W - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, Yellow-emitting Side View LED in a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. Designed primarily for demanding environments, it features robust construction, high luminous intensity, and wide viewing angle, making it an ideal choice for backlighting and indicator applications where space is constrained and reliability is paramount.

1.1 Core Advantages and Target Market

The primary advantages of this LED component include its compact side-view form factor, which allows for illumination from the edge of a PCB, excellent luminous output for its package size, and enhanced reliability certifications. It is specifically engineered for markets requiring long-term durability and performance stability. The key target application is Automotive Interior Lighting, such as backlighting for switches, dashboard indicators, and control panels. Its qualifications make it suitable for other applications where resistance to environmental factors like sulfur and high operational temperatures is necessary.

2. In-Depth Technical Parameter Analysis

A thorough understanding of the electrical, optical, and thermal parameters is crucial for proper circuit design and ensuring long-term reliability.

2.1 Photometric and Optical Characteristics

The LED's core performance is defined under a standard test condition of a forward current (I_F) of 50mA.

• Typical Luminous Intensity (I_V): 2800 millicandelas (mcd). This is a measure of the perceived brightness in a specific direction. The minimum guaranteed value is 2240 mcd, and the maximum can reach up to 4500 mcd, indicating potential unit-to-unit variation covered by the binning system.
• Viewing Angle (2θ_½): 120 degrees. This wide viewing angle ensures uniform illumination over a broad area, which is essential for side-view applications where light needs to be dispersed laterally.
• Dominant Wavelength (λ_d): 591 nm (Typical), with a range from 588 nm to 594 nm. This parameter defines the perceived color of the yellow light. The tight tolerance (±1nm) ensures consistent color output across different production batches.

The luminous flux measurement has a stated tolerance of ±11%, and all measurements are referenced to a thermal pad temperature of 25°C.

2.2 Electrical and Thermal Parameters

• Forward Voltage (V_F): 2.20V (Typical) at 50mA, with a range from 1.75V to 2.75V. This parameter is critical for designing the current-limiting circuitry. The measurement tolerance is ±0.05V.
• Forward Current (I_F): The device is rated for a continuous forward current between 5 mA (minimum for operation) and 70 mA (absolute maximum). The typical operating current is 50mA.
• Thermal Resistance: Two values are provided:
  • Real R_thJS: 85 K/W (Typical), 100 K/W (Max). This represents the actual thermal resistance from the semiconductor junction to the solder point.
  • Electrical R_thJS: 60 K/W (Typical), 85 K/W (Max). This is often derived from electrical measurement methods and is typically lower than the real value. Designers should use the Real R_thJS value (85 K/W) for accurate thermal management calculations to ensure the junction temperature (T_J) does not exceed its maximum rating.

3. Absolute Maximum Ratings and Reliability

Exceeding these limits may cause permanent damage to the device.

• Power Dissipation (P_d): 192 mW.
• Junction Temperature (T_J): 125 °C.
• Operating Temperature (T_opr): -40 °C to +110 °C. This wide range is essential for automotive applications.
• Storage Temperature (T_stg): -40 °C to +110 °C.
• ESD Sensitivity (HBM): 2 kV. This indicates a moderate level of electrostatic discharge protection. Proper ESD handling procedures should still be followed during assembly.
• Surge Current (I_FM): 100 mA for pulses ≤10 μs with a very low duty cycle (D=0.005).
• Sulfur Robustness: Class A1. This certification indicates the LED's resin and materials are resistant to corrosion caused by sulfur-containing atmospheres, a common issue in certain industrial and automotive environments.
• Soldering: Withstands reflow soldering at 260°C for 30 seconds.
• Compliance: The component is compliant with RoHS, REACH, and is Halogen-Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

4. Performance Curve Analysis

The datasheet provides several graphs that illustrate the device's behavior under varying conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The graph shows the exponential relationship typical of LEDs. At the recommended 50mA operating point, the voltage is centered around 2.2V. Designers must ensure the driver circuit can provide a stable current within this voltage window.

4.2 Relative Luminous Intensity vs. Forward Current

This curve demonstrates that light output increases with current but begins to show signs of saturation at higher currents (approaching 70mA). Operating at 50mA provides a good balance between brightness and efficiency/heat generation.

4.3 Temperature Dependence

Three key graphs illustrate thermal effects: Relative Luminous Intensity vs. Junction Temperature: Light output decreases as temperature increases. At the maximum junction temperature of 125°C, output is roughly 60-70% of its value at 25°C. This must be factored into brightness calculations for high-temperature environments. Relative Forward Voltage vs. Junction Temperature: The forward voltage has a negative temperature coefficient, decreasing by approximately 2mV/°C. This characteristic can sometimes be used for indirect temperature sensing. Relative Wavelength vs. Junction Temperature: The dominant wavelength shifts slightly with temperature (approximately +0.1 nm/°C). This is generally negligible for yellow indicator applications but is noted for color-critical uses.

4.4 Forward Current Derating Curve

This is a critical graph for reliability. It shows the maximum allowable continuous forward current as a function of the solder pad temperature (T_S). For example, at a pad temperature of 110°C, the maximum allowed current drops to 55mA. At the absolute maximum pad temperature, the current must be reduced to 5mA. This curve must be used to ensure the LED is not overdriven for its operating temperature.

4.5 Permissible Pulse Handling Capability

This graph defines the maximum single-pulse current the LED can handle for very short durations (microseconds to milliseconds) at various duty cycles. It allows for designs requiring brief, high-intensity flashes.

5. Binning System Explanation

To manage manufacturing variations, LEDs are sorted into performance bins. The part number likely includes codes that specify its bin for key parameters.

5.1 Luminous Intensity Binning

The provided table lists an extensive binning structure from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). The typical part, with 2800 mcd, falls into the CA bin (2800-3550 mcd). Designers must specify the required intensity bin to ensure consistent brightness across all units in a product.

5.2 Dominant Wavelength Binning

The wavelength is binned in 3nm steps. The typical value of 591 nm corresponds to the 8891 bin (588-591 nm) or 9194 bin (591-594 nm). Specifying a tight wavelength bin is crucial for color consistency, especially in multi-LED arrays.

5.3 Forward Voltage Binning

The snippet shows a voltage bin code "1012" with a range of 1.0V to 1.2V, which seems inconsistent with the typical 2.2V. This may be an error in the provided text or refer to a different product variant. Typically, V_F is binned in steps like 0.1V or 0.2V (e.g., 2.0-2.2V, 2.2-2.4V).

6. Mechanical, Packaging & Assembly Information

6.1 Mechanical Dimensions and Polarity

The LED uses a standard PLCC-2 surface-mount package. The exact dimensions (length, width, height) and pad layout are defined in the mechanical drawing section. The package includes a molded lens to achieve the 120-degree viewing angle. Polarity is indicated by a cathode mark on the package body; connecting the device in reverse bias is not designed for operation.

6.2 Recommended Soldering Pad and Reflow Profile

A recommended land pattern (solder pad design) is provided to ensure proper soldering and mechanical stability. The reflow soldering profile is specified as a peak temperature of 260°C for 30 seconds maximum. Adhering to this profile is essential to prevent thermal damage to the plastic package and the internal die attach.

6.3 Packaging Information

The LEDs are supplied on tape-and-reel for compatibility with automated pick-and-place assembly equipment. The reel specifications (tape width, pocket spacing, reel diameter) are standardized to fit common SMT assembly machines.

7. Application Guidelines and Design Considerations

7.1 Typical Application Circuits

This LED requires a constant current source or a current-limiting resistor in series with a voltage supply. The resistor value can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Using the maximum V_F (2.75V) for this calculation ensures the current does not exceed the limit even with unit-to-unit variation. For a 5V supply and 50mA target: R = (5V - 2.75V) / 0.05A = 45 Ohms. A 47-Ohm standard resistor would be appropriate. The power rating of the resistor should be at least P = I²R = (0.05)² * 47 = 0.1175W, so a 1/4W resistor is sufficient.

7.2 Thermal Management

Effective heat sinking is vital for maintaining brightness and longevity. Using the Real R_thJS of 85 K/W: If the LED dissipates P_d = V_F * I_F = 2.2V * 0.05A = 0.11W, the temperature rise from junction to solder point is ΔT = R_th * P = 85 * 0.11 ≈ 9.4°C. If the PCB solder pad temperature is 80°C, the junction temperature T_J would be ~89.4°C, which is within the 125°C limit. Designers must ensure the PCB itself can dissipate heat to keep the pad temperature as low as possible.

7.3 Precautions for Use

• Always observe polarity to prevent damage.
• Do not operate below 5mA, as indicated on the derating curve.
• Implement proper ESD protection during handling and assembly.
• Follow the recommended reflow profile precisely.
• Consider the effects of temperature on luminous intensity and wavelength for the final application.
• For automotive use, ensure the circuit design accommodates load dump and other transients specific to the vehicle's electrical system.

8. Technical Comparison and FAQs

8.1 Differentiation from Standard LEDs

This LED differentiates itself through its combination of side-view form factor, high brightness (2800mcd) in a small package, and robustness certifications (AEC-Q102, Sulfur A1). Compared to a standard top-view PLCC-2 LED, it emits light from the side, enabling unique optical designs. Compared to other side-view LEDs, its AEC-Q102 qualification specifically targets the rigorous reliability requirements of automotive electronics.

8.2 Frequently Asked Questions Based on Parameters

Q: Can I drive this LED with 3.3V without a resistor?
A: No. With a typical V_F of 2.2V, connecting it directly to 3.3V would cause excessive current to flow, potentially exceeding the absolute maximum rating and destroying the LED. A current-limiting resistor or regulator is always required.

Q: Why is the luminous intensity measured in mcd instead of lumens?
A> Millicandelas (mcd) measure luminous intensity, which is light emitted in a specific direction. Lumens measure total luminous flux (light in all directions). For a directional component like a side-view LED with a defined viewing angle, mcd is the more relevant metric. The total flux can be approximated if the angular distribution is known.

Q: What does "Sulfur Robustness Class A1" mean for my design?
A> It means the LED's encapsulating resin and materials are formulated to resist darkening or corrosion caused by hydrogen sulfide and other sulfurous gases. This is critical in applications like automotive (where certain cabin materials can off-gas sulfur), industrial settings, or locations with high pollution. It enhances long-term reliability and maintains light output.

Q: How do I interpret the binning codes in the part number?
A> The part number (e.g., 57-21R-UY0501H-AM) contains embedded codes. While the full breakdown isn't provided here, segments like "UY" likely indicate the color (Yellow), and other characters specify the luminous intensity bin (e.g., CA for 2800mcd) and wavelength bin. Consult the manufacturer's full ordering guide for precise decoding.

9. Operational Principles and Trends

9.1 Basic Operating Principle

This is a semiconductor light-emitting diode. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region of the semiconductor chip (typically based on materials like AlInGaP for yellow light), releasing energy in the form of photons (light). The specific material composition and doping determine the dominant wavelength (color) of the emitted light.

9.2 Industry Trends

The trend for such components is towards higher efficiency (more light output per watt of electrical input), increased power density in smaller packages, and enhanced reliability specifications to meet the demands of automotive (AEC-Q102), industrial, and outdoor applications. Integration of features like built-in electrostatic protection and tighter binning for color and flux consistency are also common. The move towards halogen-free and environmentally compliant materials, as seen in this datasheet, is a standard industry requirement driven by global regulations.