ALFS1H-C010001H-AM LED 规格书 - SMD陶瓷封装 - 1000mA下450流明 - 3.3V - 120°视角 - 中文技术文档

1. 产品概述

本文档详细阐述了一款专为严苛汽车照明应用设计的高性能表面贴装LED的规格。该器件采用坚固的陶瓷封装，提供卓越的热管理和可靠性。其主要设计重点在于汽车外部照明系统，这些系统对性能一致性、长寿命以及在恶劣环境条件下的耐受性要求极高。

1.1 核心优势

该LED为汽车设计工程师提供了多项关键优势：

• 高光输出：在1000mA驱动电流下，典型光通量可达450流明，能够提供明亮高效的光源。
• 宽视角：具备120度视角，提供出色的空间光分布，适用于多种照明功能。
• 汽车级可靠性：符合AEC-Q102标准认证，确保满足汽车电子元件严格的质量和可靠性要求。
• 环境耐受性：展现出高抗静电放电能力（ESD高达8kV HBM）和抗硫腐蚀能力（A1级），这对于汽车环境中的长期运行至关重要。
• 合规性：产品符合RoHS、REACH和无卤素指令，支持全球环保法规。

1.2 目标市场与应用

该LED专门针对汽车外部照明市场。其性能特点使其成为以下关键应用的理想选择：

• 前照灯：可用于远光灯、近光灯或自适应远光系统。
• 日间行车灯：提供高可见度和独特造型。
• 雾灯：在恶劣天气条件下提供稳健性能。

2. 深入技术参数分析

本节对规格书中关键的电学、光学和热学参数进行详细、客观的解读。

2.1 光度与电气特性

核心性能在测试条件IF=1000mA、焊盘温度保持25°C下定义。

• 光通量（Φv）：典型值为450流明，最小400流明，最大500流明。测量公差为±8%。此参数高度依赖于结温。
• 正向电压（VF）：在1000mA下，典型值为3.30V，范围从2.90V到3.80V。±0.05V的测量公差对于精确的电源设计和分档一致性很重要。
• 正向电流（IF）：器件的绝对最大连续正向电流额定值为1500mA，典型工作点为1000mA。不建议在低于50mA下工作。
• 视角（φ）：标称120°视角的公差为±5°。这定义了光强至少为其峰值一半的角度范围。
• 相关色温（CCT）：色温范围规定为5391K至6893K，归类为冷白光LED。

2.2 热特性

有效的热管理对于维持性能和寿命至关重要。

• 热阻（Rth JS）：给出了两个值：最大“实际”热阻（结到焊点）为4.4 K/W，最大“电气”等效热阻为3.4 K/W。较低的电气值通常用于电路仿真中的结温估算。这种低热阻得益于陶瓷封装。
• 结温（TJ）：最大允许结温为150°C。
• 工作与存储温度：器件可在-40°C至+125°C的宽温度范围内工作和存储。

2.3 绝对最大额定值

超出这些限值的应力可能导致永久性损坏。

• 功耗（Pd）：最大5700 mW。
• 反向电压（VR）：该器件并非为反向偏置操作而设计。
• ESD敏感度（HBM）：可承受高达8 kV，这对于汽车应用来说非常稳健。
• 回流焊温度：在组装过程中可承受260°C的峰值温度。

3. 分档系统说明

LED根据关键性能参数进行分档，以确保同一生产批次内的一致性。

光通量在“C组”下分为四个档位（6, 7, 8, 9）。例如，7档覆盖的光通量范围为425流明至450流明。这使得设计人员可以根据所需的亮度水平选择LED。

正向电压分为三个代码：1A（2.90V-3.20V）、1B（3.20V-3.50V）和1C（3.50V-3.80V）。在并联连接LED时，匹配VF档位有助于实现均匀的电流分配。

冷白光LED在CIE 1931色度图上进行分档。定义了多个档位（例如，63M, 61M, 58M, 56M, 65L, 65H, 61L, 61H），每个档位代表x,y色彩空间上的一个小四边形区域。±0.005的严格公差确保了档位内最小的颜色差异。分档结构图显示了每个档位的具体坐标边界。

这些图表提供了在不同工作条件下LED行为的关键洞察。

相对光谱分布图显示在蓝色波长区域有一个峰值，这是荧光粉转换白光LED的典型特征。典型辐射特性图说明了空间强度分布，确认了光强降至峰值50%时的120°视角。

正向电流与正向电压曲线是非线性的，显示了二极管的典型指数关系。相对光通量与正向电流曲线显示光输出随电流增加而增加，但在极高电流（超过1000mA）下可能出现饱和或效率下降。

图表清晰地显示了温度的显著影响：

正向电压随温度升高线性下降（负温度系数），这可用于结温监测。

光输出随温度升高而降低。保持低结温对于稳定的光输出至关重要。

色坐标（CIE x, y）随温度变化，这对于要求稳定色点的应用很重要。颜色也随驱动电流略有偏移，强调了使用恒流驱动器的必要性。这是热设计的关键图表。它绘制了最大允许正向电流与焊盘温度（Ts）的关系。随着Ts升高，必须降低最大允许电流以防止超过150°C的结温限制。例如，在Ts=125°C时，最大电流为1200mA；在Ts=110°C时，为1500mA。SMD陶瓷封装提供了机械稳定性和优异的热传导性。规格书包含详细的机械图纸（第7节），规定了封装的长度、宽度、高度、引脚间距和公差。此信息对于PCB焊盘设计和组装间隙检查至关重要。

第8节提供了推荐的PCB焊盘图形（焊盘几何形状和尺寸），以确保回流焊过程中形成可靠的焊点，并优化从LED散热焊盘到PCB的热传递。

机械图纸标明了阳极和阴极端子。组装时必须注意正确的极性以防止损坏。第9节规定了推荐的回流焊温度曲线。该曲线包括预热、保温、回流和冷却阶段，峰值温度不超过260°C。遵循此曲线可防止热冲击并确保可靠的焊接连接。提供了通用操作和应用说明（第11节），涵盖避免透镜机械应力、防止污染以及操作期间确保适当的ESD防护等主题。器件应在规定的温度范围（-40°C至+125°C）内并在湿度受控的环境中存储。湿度敏感等级（MSL）为2级。关于LED供应方式的详细信息见第10节。这通常包括卷盘类型、载带宽度、口袋尺寸以及卷盘上元件的方向，以供自动贴片机使用。

第5节和第6节详细说明了料号结构和订购代码。完整的料号“ALFS1H-C010001H-AM”编码了特定信息，如产品系列、光通量档、电压档和颜色档。理解此命名法对于采购具有所需性能特性的确切器件至关重要。

该LED需要恒流驱动器以实现稳定工作。驱动器应设计为提供所需电流（例如1000mA），同时适应所选档位的正向电压范围。热管理至关重要；PCB应在LED散热焊盘下方有足够的铜面积或散热过孔阵列，以有效散热，尽可能降低结温。

• 使用降额曲线和热阻计算必要的散热。低Rth JS是一个优势，但并不能消除对良好散热路径的需求。120°视角可能需要次级光学元件（透镜、反射器）来为前照灯等特定应用塑形光束。
• 在设计并联串时考虑正向电压分档以确保电流平衡。在板上实现反极性保护。AEC-Q102和抗硫认证是汽车应用的关键，但应用特定的环境测试（振动、热循环）仍需验证。
• 虽然规格书中未提供直接竞争对手对比，但可以推断出该产品的关键差异化因素：与标准塑料SMD封装相比，陶瓷封装提供了更优的导热性和长期可靠性，尤其是在高功率和高温条件下。
• 完整的AEC-Q102认证和抗硫性（A1级）在通用高功率LED中并不总是具备，这使得该器件特别适合严苛的汽车环境。高光通量（450流明）、相对较宽的视角（120°）和坚固结构的结合，为外部照明提供了一个平衡的解决方案。

答：仅当焊盘温度（Ts）根据降额曲线维持在110°C或以下时才可以。在更高的环境温度下，必须降低电流（例如，在Ts=125°C时降至1200mA）以避免超过最大结温。

答：Rth JS实际值是测量得到的从结到焊点的热阻。Rth JS电气值是电气推导的等效值，通常较低，常用于SPICE模型进行温度仿真。对于实际热设计，应使用“实际”值（最大4.4 K/W）进行保守计算。

答：对一致性至关重要。对于使用多个LED的应用（例如，DRL灯条），指定相同的光通量、电压和颜色档位可确保所有单元具有均匀的亮度、颜色和电气行为。

答：是的，绝对需要。尽管封装热阻低，但总功耗（在1000mA下约3.3W）需要一个有效的热管理系统，通常包括增强散热的PCB，可能还需要外部散热器，以维持性能和寿命。

设计师因其亮度和汽车级可靠性选择了此LED。他们选择光通量7档（425-450流明）和电压1B档（3.20-3.50V）以确保良好的良率。该模块使用6个LED串联。驱动器指定为1000mA恒流，输出电压范围覆盖6 * VF_max（约21V）。PCB为2盎司铜板，具有大面积裸露焊盘区域连接到内部接地层以散热。LED焊盘下的散热过孔将热量传递到PCB背面，该背面连接到车辆的金属外壳。使用降额曲线并估算系统的热阻，设计师确认在最坏情况环境温度下，结温将保持在110°C以下，从而允许LED以全1000mA驱动。

这是一种荧光粉转换白光LED。其核心是一个半导体芯片（通常基于InGaN），当正向偏置时发出蓝光（电致发光）。该蓝光照射到沉积在芯片上或周围的荧光粉层。荧光粉吸收部分蓝光，并以更宽谱段的长波长光（黄光、红光）重新发射。剩余的蓝光与荧光粉转换的黄/红光混合，被人眼感知为白光。荧光粉的具体混合决定了相关色温（CCT），对于此器件，其在冷白光范围内（5391K-6893K）。

汽车LED照明市场持续发展，趋势明显：

芯片技术和荧光粉效率的持续改进带来更高的发光效率，从而实现更亮的灯光或更低的功耗。

正在开发能够从更小封装中提供更多光输出的器件，从而实现更紧凑和风格化的灯具设计。

将控制电子器件（例如，用于自适应光束图案）直接集成到LED封装中是一个发展领域。

重点是提高显色指数（CRI）并实现动态色温调节，尤其是对于内饰照明。

随着LED渗透到前照灯等安全关键应用，遵守AEC-Q102等标准变得更加关键。针对新型应力因素（如来自激光雷达系统的激光）的测试可能会出现。

Section 9 specifies the recommended reflow soldering temperature profile. The profile includes preheat, soak, reflow, and cooling stages, with a peak temperature not exceeding 260°C. Adhering to this profile prevents thermal shock and ensures reliable solder connections.

.2 Precautions for Use

General handling and application notes are provided (Section 11), covering topics such as avoiding mechanical stress on the lens, preventing contamination, and ensuring proper ESD precautions during handling.

.3 Storage Conditions

The device should be stored within the specified temperature range (-40°C to +125°C) and in a moisture-controlled environment. The Moisture Sensitivity Level (MSL) is rated at Level 2.

. Packaging & Ordering Information

.1 Packaging Information

Details on how the LEDs are supplied are found in Section 10. This typically includes the reel type, tape width, pocket dimensions, and orientation of components on the reel for automated pick-and-place machines.

.2 Part Number & Ordering Information

Sections 5 and 6 detail the part number structure and ordering codes. The full part number "ALFS1H-C010001H-AM" encodes specific information such as the product series, flux bin, voltage bin, and color bin. Understanding this nomenclature is essential for procuring the exact device with the desired performance characteristics.

. Application Design Suggestions

.1 Typical Application Circuits

This LED requires a constant current driver for stable operation. The driver should be designed to provide the required current (e.g., 1000mA) while accommodating the forward voltage range of the selected bin. Thermal management is critical; the PCB should have a sufficient copper area or thermal via array under the LED's thermal pad to dissipate heat effectively, keeping the junction temperature as low as possible.

.2 Design Considerations

• Thermal Design:Use the derating curve and thermal resistance to calculate the necessary heatsinking. The low Rth JS is an advantage but does not eliminate the need for a good thermal path to the ambient.
• Optical Design:The 120° viewing angle may require secondary optics (lenses, reflectors) to shape the beam for specific applications like headlamps.
• Electrical Design:Consider the forward voltage binning when designing for parallel strings to ensure current balance. Implement reverse polarity protection on the board.
• Reliability:The AEC-Q102 and sulfur robustness qualifications are key for automotive use, but the application's specific environmental tests (vibration, thermal cycling) must still be validated.

. Technical Comparison & Differentiation

While a direct competitor comparison is not provided in the datasheet, key differentiators of this product can be inferred:

• Ceramic vs. Plastic Package:The ceramic package offers superior thermal conductivity and long-term reliability compared to standard plastic SMD packages, especially under high power and high temperature conditions.
• Automotive Focus:Full AEC-Q102 qualification and sulfur resistance (Class A1) are not always present in general-purpose high-power LEDs, making this device specifically suited for the harsh automotive environment.
• Performance Balance:The combination of high flux (450lm), relatively wide viewing angle (120°), and robust construction presents a balanced solution for exterior lighting.

. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 1500mA continuously?

A: Only if the solder pad temperature (Ts) is maintained at or below 110°C, as per the derating curve. At higher ambient temperatures, the current must be reduced (e.g., to 1200mA at Ts=125°C) to avoid exceeding the maximum junction temperature.

Q: What is the difference between Rth JS real and Rth JS el?

A: Rth JS real is the measured thermal resistance from the junction to the solder point. Rth JS el is an electrically derived equivalent value, often lower, which is commonly used in SPICE models for temperature simulation. For practical thermal design, the "real" value (4.4 K/W max) should be used for conservative calculations.

Q: How important is bin selection for my application?

A: Critical for consistency. For applications with multiple LEDs (e.g., a DRL strip), specifying the same flux, voltage, and color bin ensures uniform brightness, color, and electrical behavior across all units.

Q: Is a heatsink required?

A> Yes, absolutely. Despite the low package thermal resistance, the total power dissipation (up to ~3.3W at 1000mA) necessitates an effective thermal management system, usually involving a thermally enhanced PCB and possibly an external heatsink, to maintain performance and longevity.

. Practical Design Case Study

Scenario: Designing a Daytime Running Light (DRL) module.

A designer selects this LED for its brightness and automotive-grade reliability. They choose Bin 7 for flux (425-450lm) and Bin 1B for voltage (3.20-3.50V) to ensure good yield. The module uses 6 LEDs in series. The driver is specified for 1000mA constant current with an output voltage range covering 6 * VF_max (approx. 21V). The PCB is a 2oz copper board with a large exposed pad area connected to an internal ground plane for heat spreading. Thermal vias under the LED pad transfer heat to the back side of the PCB, which is attached to the metal housing of the vehicle. Using the derating curve and estimating the thermal resistance of the system, the designer confirms the junction temperature will remain below 110°C in the worst-case ambient temperature, allowing the LEDs to be driven at the full 1000mA.

. Operating Principle

This is a phosphor-converted white LED. The core is a semiconductor chip (typically based on InGaN) that emits blue light when forward biased (electroluminescence). This blue light strikes a phosphor layer deposited on or around the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broader spectrum of longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-converted yellow/red light is perceived by the human eye as white light. The specific blend of phosphors determines the correlated color temperature (CCT), which for this device is in the cool white range (5391K-6893K).

. Technology Trends

The automotive LED lighting market continues to evolve with clear trends:

• Increased Efficiency (lm/W):Ongoing improvements in chip technology and phosphor efficiency lead to higher luminous efficacy, allowing for brighter lights or lower power consumption.
• Higher Power Density:Devices are being developed to deliver more light from smaller packages, enabling more compact and stylized lamp designs.
• Advanced Functionality:Integration of control electronics (e.g., for adaptive beam patterning) directly with LED packages is an area of development.
• Color Tuning & Quality:There is a focus on improving color rendering index (CRI) and enabling dynamic color temperature adjustment, especially for interior lighting.
• Standardization & Reliability:Adherence to standards like AEC-Q102 becomes even more critical as LEDs penetrate safety-critical applications like headlights. Testing for novel stress factors (like laser light from LIDAR systems) may emerge.