LED Specification Sheet - 3020 Series 0.2W White LED - Size 3.0x2.0mm - Voltage 3.2V - Power 0.2W - English Technical Document

1. Product Overview

The 3020 series is a compact, high-performance surface-mount device (SMD) LED designed for general lighting applications. This single-chip white LED offers a balance of efficiency, reliability, and cost-effectiveness, making it suitable for a wide range of indoor and outdoor lighting solutions. Its primary advantages include a standard 3020 footprint, consistent luminous output, and robust thermal performance within its specified operating range.

2. Technical Parameters Deep Dive

2.1 Absolute Maximum Ratings (Ts=25°C)

The following parameters define the operational limits of the LED. Exceeding these values may cause permanent damage.

• Forward Current (IF): 90 mA (Continuous)
• Forward Pulse Current (IFP): 120 mA (Pulse width ≤ 10ms, Duty cycle ≤ 1/10)
• Power Dissipation (PD): 297 mW
• Operating Temperature (Topr): -40°C to +80°C
• Storage Temperature (Tstg): -40°C to +80°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): Reflow soldering at 230°C or 260°C for 10 seconds maximum.

2.2 Electro-Optical Characteristics (Ts=25°C)

These are the typical performance parameters under standard test conditions.

• Forward Voltage (VF): 3.2 V (Typical), 3.4 V (Maximum) at IF=60mA
• Reverse Voltage (VR): 5 V
• Reverse Current (IR): 10 µA (Maximum)
• Viewing Angle (2θ1/2): 110° (Typical)

3. Binning System Explanation

The product uses a comprehensive binning system to ensure color and performance consistency for end applications.

3.1 Luminous Flux Binning

For the specified color (Cool White with CRI 85, CCT >5000K), luminous flux is measured at a forward current of 60mA. The bins are defined as follows:

• Code C8: 16 lm (Min) to 17 lm (Max)
• Code C9: 17 lm (Min) to 18 lm (Max)
• Code D1: 18 lm (Min) to 19 lm (Max)
• Code D2: 19 lm (Min) to 20 lm (Max)

Tolerance for luminous flux measurement is ±7%.

3.2 Forward Voltage Binning

Forward voltage is binned to aid in circuit design for current regulation.

• Code B: 2.8 V (Min) to 2.9 V (Max)
• Code C: 2.9 V (Min) to 3.0 V (Max)
• Code D: 3.0 V (Min) to 3.1 V (Max)
• Code E: 3.1 V (Min) to 3.2 V (Max)
• Code F: 3.2 V (Min) to 3.3 V (Max)
• Code G: 3.3 V (Min) to 3.4 V (Max)

Tolerance for voltage measurement is ±0.08V.

3.3 Chromaticity Binning

The LED's color is defined within specific regions on the CIE 1931 chromaticity diagram. For the Cool White variant (CCT >5000K, up to 20000K), the chromaticity coordinates are bounded by defined polygon regions (e.g., Wa, Wb, Wc, Wd, We, Wf, Wg1, Wh1 as listed in the datasheet). This ensures the emitted white light falls within an acceptable color range. The allowable deviation for chromaticity coordinates is ±0.005.

Tolerance for Color Rendering Index (CRI) is ±2.

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve is characteristic of a semiconductor diode. For this LED, the forward voltage increases non-linearly with current. At the typical operating current of 60mA, the forward voltage is approximately 3.2V. Designers must use current-limiting circuitry, not voltage sources, to drive the LED reliably.

4.2 Forward Current vs. Relative Luminous Flux

The luminous output increases with forward current but will eventually saturate and can decrease at very high currents due to thermal effects. The curve shows that operating at or below the recommended 60mA provides optimal efficiency and longevity.

4.3 Junction Temperature vs. Relative Spectral Power

As the junction temperature (Tj) rises, the spectral power distribution can shift. For white LEDs, this often manifests as a change in correlated color temperature (CCT) and a potential decrease in luminous flux. Maintaining a low junction temperature through proper thermal management is crucial for color stability and light output maintenance.

4.4 Relative Spectral Power Distribution

The spectral curve for a white LED (typically phosphor-converted) shows a broad peak in the blue region from the primary die and a broader yellow/red emission from the phosphor. The exact shape varies with CCT (e.g., 2600-3700K, 3700-5000K, 5000-10000K), with cooler CCTs having more blue content and warmer CCTs having more yellow/red content.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The LED follows the standard 3020 footprint: approximately 3.0mm in length and 2.0mm in width. Detailed dimensional drawings with tolerances (±0.10mm for .X dimensions, ±0.05mm for .XX dimensions) are provided in the datasheet for PCB layout reference.

5.2 Pad Pattern and Stencil Design

Recommended solder pad layout and stencil opening dimensions are specified to ensure reliable solder joint formation during reflow. Adherence to these guidelines is important for proper alignment, thermal transfer, and mechanical stability.

6. Soldering & Assembly Guidelines

6.1 Moisture Sensitivity and Baking

This 3020 LED is classified as moisture-sensitive according to IPC/JEDEC J-STD-020C. If the original moisture barrier bag is opened and the components are exposed to ambient humidity, they must be baked before reflow soldering to prevent "popcorn" damage.

• Baking Condition: 60°C for 24 hours.
• Post-Baking: Solder within 1 hour or store in a dry environment (<20% RH).
• Do not bake at temperatures above 60°C.

6.2 Storage Conditions

• Unopened Bag: Temperature 5-30°C, Humidity <85%.
• Opened Bag: Use within 12 hours. Store at 5-30°C, Humidity <60%, preferably in a sealed container with desiccant or a nitrogen cabinet.
• If exposed for >12 hours, baking (60°C/24h) is required before use.

6.3 Reflow Soldering Profiles

Two standard reflow profiles are provided:

• Lead-Free Solder: Peak temperature 230°C or 260°C, with time above liquidus (TAL) controlled.
• Lead-Based Solder: Corresponding lower temperature profile.

It is critical to follow the recommended ramp-up, soak, reflow, and cooling rates to minimize thermal stress on the LED package and internal die.

7. Electrostatic Discharge (ESD) Protection

LEDs are semiconductor devices susceptible to ESD damage, particularly white, green, blue, and purple types.

• Potential Damage: ESD can cause immediate failure (dead LED) or latent damage leading to reduced brightness, color shift, or shortened lifespan.
• Protection Measures:
  • Use grounded anti-static workstations and floors.
  • Operators must wear anti-static wrist straps, gloves, and garments.
  • Use ionizers and ensure soldering equipment is properly grounded.
  • Use anti-static packaging materials.

8. Application & Design Considerations

8.1 Circuit Design

• Drive Method: Always use a constant-current driver. Avoid direct connection to a voltage source.
• Current Limiting: It is highly recommended to include a series resistor for each string of LEDs for additional current stabilization and protection, even when using a constant-current driver.
• Polarity: Observe correct anode/cathode orientation during assembly.
• Power Sequencing: When testing, connect the driver output to the LED first, then power the driver input to avoid voltage spikes.

8.2 Handling Precautions

Improper handling can cause physical and optical damage:

• Avoid Fingers: Do not handle the silicone lens with bare fingers, as oils and pressure can contaminate the surface or damage the wire bonds/die.
• Avoid Tweezers: Do not squeeze the silicone body with tweezers, as this can crush the die or break bonds.
• Use Correct Nozzle: For pick-and-place, use a vacuum nozzle with an appropriate size to avoid pressing into the soft silicone.
• Avoid Dropping: Prevents lead deformation.
• Post-Assembly: Do not stack assembled PCBs directly on top of each other, as this can scratch lenses and apply pressure to the components.

9. Product Nomenclature Rule

The part number follows a specific coding system: T □□ □□ □ □ □ – □□□ □□

Key code definitions include:

• Package Code (e.g., 34): 3020 footprint.
• Chip Count Code (e.g., S): 'S' for single small-power chip.
• Color Code (e.g., W): 'W' for Cool White (>5000K). Other codes: L (Warm White), C (Neutral White), R (Red), etc.
• Optics Code (e.g., 00): '00' for no primary lens.
• Luminous Flux Bin Code (e.g., D1): Specifies the luminous output range.
• Forward Voltage Bin Code (e.g., D): Specifies the Vf range.

10. Typical Application Scenarios

Due to its compact size, good efficiency, and reliable performance, the 3020 0.2W white LED is well-suited for:

• Backlighting: LCD displays, indicator panels, signage.
• Decorative Lighting: Light strips, contour lighting, accent lighting.
• General Illumination: Integrated into bulbs, downlights, and panel lights where multiple LEDs are used in an array.
• Consumer Electronics: Status indicators, keyboard backlights.

11. Technical Comparison & Differentiation

Compared to earlier packages like 3528, the 3020 offers a more compact footprint, allowing for higher density PCB layouts and potentially better thermal management due to a different internal structure. Its 0.2W power rating places it between very low-power indicator LEDs and higher-power illumination LEDs, offering a good compromise between light output and power consumption for many applications. The detailed binning system for flux, voltage, and chromaticity provides designers with the predictability needed for consistent end-product quality.

12. Frequently Asked Questions (FAQ)

12.1 Why is baking necessary before soldering?

The LED package can absorb moisture from the air. During the high-temperature reflow process, this moisture rapidly turns to steam, creating internal pressure that can delaminate the package or crack the die, leading to failure. Baking removes this absorbed moisture.

12.2 Can I drive this LED directly with a 3.3V supply?

No. The forward voltage varies by bin and with temperature. A 3.3V supply could cause excessive current in a low Vf bin, leading to overheating and failure. Always use a constant-current driver or a voltage source with a series current-limiting resistor.

12.3 What is the purpose of the different bin codes?

Binning ensures consistency. By selecting LEDs from the same flux and chromaticity bin, a lighting product will have uniform brightness and color. Selecting from a specific voltage bin can simplify current regulation circuit design.

12.4 How critical is thermal management?

Very critical. Exceeding the maximum junction temperature (125°C) will drastically shorten the LED's lifespan and cause color shift. The PCB should be designed to act as a heat sink, and the LED should not be operated at absolute maximum currents without adequate cooling.

13. Design-in Case Study

Scenario: Designing a linear LED light strip for architectural accent lighting.

• Selection: The 3020 LED is chosen for its compact size, allowing many LEDs per meter for smooth light lines, and its 0.2W power rating keeps total strip power manageable.
• Binning: LEDs from a single luminous flux bin (e.g., D1) and chromaticity bin are specified to ensure consistent brightness and color along the entire strip.
• Circuit: LEDs are arranged in series-parallel strings. A constant-current driver is used, with a small series resistor on each parallel string for additional current balancing and protection as per the datasheet's recommended circuit (Figure 2).
• Thermal: The strip uses an aluminum PCB to effectively dissipate heat from the LEDs, keeping the junction temperature well below the maximum rating during continuous operation.
• Assembly: The contract manufacturer follows the handling, storage, and reflow guidelines strictly to achieve a high first-pass yield.

14. Operating Principle

A white LED typically consists of a blue-light-emitting semiconductor die (usually based on InGaN) coated with a yellow phosphor. When current flows through the die, it emits blue light. Part of this blue light is absorbed by the phosphor, which re-emits it as broad-spectrum yellow light. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow determines the correlated color temperature (CCT) of the white light.

15. Technology Trends

The general trend in SMD LEDs like the 3020 is toward higher luminous efficacy (more lumens per watt), improved color rendering index (CRI), and better color consistency across batches. There is also ongoing development in reliability and lifetime under various operating conditions. Furthermore, packaging technology continues to evolve to allow for higher power density and better thermal performance from ever-smaller footprints. The principles of careful binning, moisture sensitivity handling, and ESD protection remain fundamental to quality and reliability across all generations of LED technology.