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ELM4XXA Series Solid State Relay Datasheet - 4-Pin SOP Package - 400V/600V Load Voltage - 120mA/50mA Load Current - English Technical Document

Technical datasheet for the ELM4XXA series of 4-pin mini flat package solid state relays. Features include halogen-free compliance, low operation current, high isolation voltage, and approvals from UL, cUL, VDE, and others.
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PDF Document Cover - ELM4XXA Series Solid State Relay Datasheet - 4-Pin SOP Package - 400V/600V Load Voltage - 120mA/50mA Load Current - English Technical Document

1. Product Overview

The ELM4XXA series represents a family of single-channel, normally open (1 Form A) solid-state relays (SSRs) packaged in a compact 4-pin Small Outline Package (SOP). These devices are designed to replace electromechanical relays (EMRs) in space-constrained applications requiring high reliability, fast switching, and low power consumption. The core technology involves an AlGaAs infrared LED optically coupled to a photovoltaic diode array which drives the output MOSFETs, providing galvanic isolation between the low-voltage control circuit and the high-voltage load circuit.

1.1 Core Advantages and Target Market

The primary advantages of the ELM4XXA series stem from its solid-state construction. Key benefits include silent operation, absence of contact bounce, long operational life, and resistance to shock and vibration. The low LED operating current minimizes the burden on control circuits like microcontrollers or logic gates. The series is particularly suited for modern electronic equipment where miniaturization, energy efficiency, and reliability are paramount.

Target Applications: This relay series is engineered for use in telecommunications exchange equipment, measurement and testing instruments, factory automation (FA) and office automation (OA) equipment, industrial control systems, and security systems.

2. In-Depth Technical Parameter Analysis

The performance of the ELM4XXA series is defined by a comprehensive set of electrical, optical, and thermal parameters. Understanding these specifications is crucial for proper circuit design and reliable operation.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electro-Optical Characteristics

These parameters, specified at TA = 25°C, define the device's operational behavior under normal conditions.

3. Performance Curve Analysis

The datasheet provides several graphs illustrating how key parameters vary with operating conditions, which is essential for derating and robust design.

3.1 Thermal Derating

Figure 1: Load Current vs. Ambient Temperature shows the necessary derating of the maximum continuous load current as ambient temperature increases. Both the ELM440A and ELM460A must have their load current reduced linearly from their rated values at 25°C down to zero at approximately 100-120°C. This curve is critical for ensuring the device's total power dissipation (IL2 * Rd(ON)) does not exceed limits at high temperatures.

3.2 On-Resistance and Switching Time Variation

Figure 2: On-Resistance vs. Ambient Temperature indicates that Rd(ON) increases with temperature. For the ELM460A, Rd(ON) can increase by over 50% from 25°C to 100°C. This must be factored into voltage drop calculations at elevated temperatures.

Figure 3: Switching Time vs. Ambient Temperature demonstrates that both Ton and Toff increase moderately with decreasing temperature, particularly below 0°C. Designers of circuits operating in cold environments must account for slightly slower switching.

3.3 Input/Output Relationship

Figures 4 & 5: Switching Time vs. LED Forward Current show that increasing the LED drive current (IF) significantly reduces the turn-on and turn-off times. This allows designers to trade off switching speed against input power consumption. Driving the LED with 20-30 mA instead of 10 mA can cut switching times by more than half.

Figures 6 & 7: Normalized LED Operate Current vs. Temperature reveal that the required IF(on) to turn the output on decreases with rising temperature, while the IF(off) (the point where it turns off) increases. This narrowing of the operating window at high temperatures must be considered in margin design.

4. Mechanical and Package Information

4.1 Pin Configuration and Schematic

The device uses a standard 4-pin SOP footprint.

The schematic confirms the architecture: an infrared LED drives a photovoltaic cell array, which generates a voltage to bias the gates of the output MOSFETs, turning them on.

4.2 Package Dimensions and Marking

The package has a body size of approximately 4.59mm x 3.81mm with a height of 1.73mm (max). The lead pitch is 2.54mm. A recommended PCB land pattern (pad layout) is provided to ensure reliable soldering and mechanical stability. The device is marked on the top with a code indicating the manufacturer logo, part number (e.g., M440A), year/week of manufacture, and an optional 'V' for VDE-approved versions.

5. Soldering and Assembly Guidelines

The device is designed for surface-mount assembly using reflow soldering processes. The absolute maximum rating for soldering temperature is 260°C for 10 seconds. This aligns with typical lead-free (Pb-free) reflow profiles. Designers should follow the recommended pad layout to prevent tombstoning and ensure proper solder joint formation. The device is compliant with halogen-free, Pb-free, and RoHS directives, making it suitable for environmentally conscious manufacturing.

6. Ordering Information and Packaging

The part number follows the structure: ELM4XXA(X)-VG.

Standard SMD versions (tube pack) contain 100 units. Tape and reel options contain 3000 units per reel.

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

The ELM4XXA is ideal for switching moderate-voltage, low-current signals or loads. Examples include:

7.2 Critical Design Considerations

8. Technical Comparison and Differentiation

Compared to traditional electromechanical relays (EMRs), the ELM4XXA offers superior life expectancy (billions of cycles vs. millions), faster switching, silent operation, and better resistance to shock/vibration. Compared to other SSRs or optocouplers with transistor outputs, its MOSFET output provides lower on-resistance and can switch both AC and DC loads with minimal offset voltage. The 4-pin SOP package is among the smallest available for SSRs with these voltage and current ratings, offering significant space savings. The inclusion of approvals from major international safety agencies (UL, cUL, VDE, etc.) simplifies end-product certification for global markets.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can this relay switch AC loads?

The output MOSFETs have a body diode. In the standard configuration, the device is primarily intended for DC load switching. For AC switching, two devices can be connected back-to-back (source-to-source), or an external circuit must manage current flow in both directions. The voltage rating applies to the peak voltage of the AC waveform.

9.2 Why is the load current for the 600V version (ELM460A) lower than the 400V version (ELM440A)?

Higher voltage MOSFETs typically have a higher specific on-resistance (Rds(on) * Area). To fit within the same small package, the 600V-rated MOSFET die will have a higher Rd(ON) (40-70 Ω vs. 20-30 Ω). For a given current, the power dissipation (I2R) is higher in the 600V part. To keep the junction temperature within safe limits and maintain reliability, the maximum continuous current must be reduced.

9.3 How do I ensure the relay turns off completely?

Ensure the control circuit reduces the current through the input LED below the maximum IF(off) specification (0.6 mA typical). In practice, this means driving the LED cathode to a voltage very close to its anode voltage, or using a series resistor large enough to limit any residual voltage difference to a current below this threshold. Avoid floating inputs.

10. Practical Design Case Study

Scenario: Designing a low-side switch for a 24V DC, 80mA solenoid valve in an industrial controller with a maximum ambient temperature of 60°C. The control signal is 3.3V from a microcontroller.

Device Selection: The ELM440A (400V rating) is chosen due to its higher current capability. The 24V load is well within its voltage rating.

Thermal Derating: From Figure 1, at 60°C, the ELM440A can handle approximately 90-95% of its 120mA rating. 80mA is ~67% of rating, which is acceptable.

Input Circuit Design: Assuming VF = 1.2V. To provide a drive current of 10mA for fast switching, the series resistor R = (3.3V - 1.2V) / 0.01A = 210 Ω. A standard 200 Ω resistor can be used. A GPIO pin can source this current directly.

Output Analysis: At 60°C, from Figure 2, Rd(ON) is ~22-23 Ω. Power dissipation P = (0.08A)2 * 23Ω = 0.147W. This is well below the Pout rating of 500mW. Voltage drop across the relay = 0.08A * 23Ω = 1.84V, leaving 22.16V for the solenoid.

Layout: Follow the recommended pad layout, and connect the drain/source pins (3 & 4) to generous copper pours to aid heat dissipation.

11. Operating Principle

The ELM4XXA operates on the principle of optical isolation. When a forward current is applied to the input AlGaAs infrared LED, it emits light. This light is detected by a photovoltaic diode array on the isolated output side. This array generates an open-circuit voltage sufficient to fully enhance the gates of the N-channel power MOSFETs that form the output switch. When the LED current is removed, the photovoltaic voltage decays, and the MOSFET gates discharge through internal paths, turning the output switch off. This mechanism provides several kilovolts of galvanic isolation between the input and output circuits, protecting sensitive control electronics from high-voltage transients on the load side.

12. Technology Trends

The solid-state relay market continues to evolve towards higher power density, lower on-resistance, and smaller packages. Advances in semiconductor materials, such as the use of silicon carbide (SiC) or gallium nitride (GaN) for the output switches, could enable future SSRs in similar packages to handle higher voltages and currents with lower losses. Integration of protection features like over-current detection, thermal shutdown, and state feedback directly into the SSR package is another growing trend, simplifying system design and improving robustness. The demand for miniaturization and high reliability in automotive, industrial IoT, and renewable energy applications will continue to drive innovation in this component category.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.