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LTP-3786JD-03 LED Display Datasheet - 0.54-inch Digit Height - Hyper Red - 2.6V Forward Voltage - English Technical Document

Complete technical datasheet for the LTP-3786JD-03, a 0.54-inch dual-digit 14-segment AlInGaP Hyper Red alphanumeric LED display. Includes specifications, ratings, pinout, dimensions, and application cautions.
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PDF Document Cover - LTP-3786JD-03 LED Display Datasheet - 0.54-inch Digit Height - Hyper Red - 2.6V Forward Voltage - English Technical Document

1. Product Overview

The LTP-3786JD-03 is a dual-digit, 14-segment alphanumeric display designed for applications requiring clear character representation. It features a digit height of 0.54 inches (13.8 mm), making it suitable for medium-sized readouts in various electronic equipment. The device utilizes AlInGaP (Aluminum Indium Gallium Phosphide) Hyper Red LED chips fabricated on a GaAs substrate, offering a specific spectral output. The display has a light gray face with white segments, enhancing contrast and readability.

1.1 Core Features and Advantages

1.2 Target Applications

This display is intended for use in ordinary electronic equipment. This includes, but is not limited to, office automation equipment, communication devices, household appliances, instrumentation panels, and consumer electronics where clear numeric and limited alphabetic readouts are needed.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation should be maintained within these limits.

2.2 Electrical & Optical Characteristics (Ta=25°C)

These are the typical performance parameters under specified test conditions.

3. Mechanical and Package Information

3.1 Package Dimensions

The display is provided in a standard dual-digit package with 18 pins. Key dimensional notes include:

3.2 Pin Configuration and Internal Circuit

The device features a common anode configuration. There are two common anode pins: one for Character 1 (pin 16) and one for Character 2 (pin 11). All other pins (except pin 3, which is No Connection) are cathodes for individual segments (A through P, and D.P. for the decimal point). The internal circuit diagram shows the independent LED chips for each segment, connected to their respective common anodes. This structure allows multiplexing for driving the two digits.

4. Application Guidelines and Cautions

4.1 Design and Usage Considerations

4.2 Storage and Handling Conditions

5. Performance Curves and Characteristics Analysis

The datasheet references typical performance curves (though not displayed in the provided text). These curves are crucial for design and typically include:

Designers should consult the full datasheet graphs to understand these relationships quantitatively for their specific operating conditions.

6. Technical Comparison and Differentiation

The LTP-3786JD-03 differentiates itself through several key aspects:

7. Frequently Asked Questions (FAQs)

7.1 How do I drive this display?

Use a multiplexing technique. Sequentially enable one common anode (digit) at a time while applying the correct cathode pattern for the desired segments on that digit. The cycle must be fast enough to avoid flicker (typically >60 Hz). A constant current driver per segment or a current-limited supply is recommended.

7.2 What is the purpose of the intensity BIN code?

The BIN code groups displays based on their measured luminous intensity at a standard test current. Using displays from the same BIN in a multi-unit application ensures uniform brightness across all digits, preventing a patchy appearance.

7.3 Can I use a simple resistor to limit current?

Yes, for simple applications. Calculate the resistor value using R = (Vsupply - VF) / IF. Use the maximum VF from the datasheet (2.6V) to ensure the minimum current is met under worst-case conditions. However, for best consistency across segments and temperatures, a constant current circuit is superior.

7.4 Why is reverse voltage protection important?

Applying a reverse bias beyond the absolute maximum rating (5V) can cause immediate damage. Even smaller reverse voltages, if sustained or repetitive (e.g., from inductive kickback in a circuit), can degrade the LED over time through electromigration, leading to increased leakage or failure.

8. Practical Application Example

Scenario: Designing a simple two-digit counter.

  1. Microcontroller Interface: Connect the two common anode pins (11, 16) to two GPIO pins configured as current-sourcing outputs. Connect the 16 segment cathode pins to GPIO pins configured as current-sinking outputs, possibly through transistors or a driver IC for higher current.
  2. Current Limiting: Implement constant current sinks for each cathode line, set to 10-15 mA for a good balance of brightness and longevity, staying well below the 25 mA continuous rating.
  3. Software: Create a look-up table mapping numbers 0-9 to the appropriate segment patterns (A-G). In the main loop, enable Digit 1, output the pattern for the tens place, wait 1-5 ms, disable Digit 1, enable Digit 2, output the pattern for the ones place, wait 1-5 ms, and repeat. This creates a stable, flicker-free display.
  4. Thermal Consideration: If the enclosure might get hot (e.g., >50°C), consider reducing the drive current slightly using the derating factor (0.33 mA/°C above 25°C) to ensure reliability.

9. Operating Principle and Technology Trends

9.1 Basic Operating Principle

An LED is a semiconductor diode. When a forward voltage exceeding its bandgap is applied, electrons and holes recombine in the active region (the AlInGaP layer in this case), releasing energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy and thus the wavelength (color) of the emitted light, which is in the hyper-red spectrum for this device. The 14-segment layout allows the formation of numerals and a limited set of alphabetic characters by selectively illuminating combinations of the segments.

9.2 Industry Trends

While through-hole displays like the LTP-3786JD-03 remain relevant for prototyping, repair, and certain industrial applications, the broader trend in display technology is towards surface-mount device (SMD) packages for automated assembly and miniaturization. Additionally, there is a continuous drive for higher efficiency (more lumens per watt), which for red LEDs involves optimizing the AlInGaP epitaxial structure and improving light extraction from the chip. For alphanumeric displays, dot-matrix panels are increasingly common as they offer full alphanumeric and graphic capability, though segmented displays retain advantages in cost, simplicity, and clarity for dedicated numeric readouts.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.