T3B Series Blue LED Datasheet - 3.0x1.4x0.8mm - 3.0V - 102mW - English Technical Document

1. Product Overview

The T3B series is a high-performance blue Surface-Mount Device (SMD) LED designed for modern lighting applications. This series utilizes a compact 3014 package footprint, offering a balance of luminous output, efficiency, and reliability. It is engineered for applications requiring consistent blue light emission, such as backlighting, indicator lights, decorative lighting, and as a component in RGB or white light systems.

The core advantage of this series lies in its standardized binning system for key parameters like luminous flux, wavelength, and forward voltage, ensuring predictable performance and color consistency in volume production. Its wide 110-degree viewing angle makes it suitable for applications requiring broad illumination.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings (T_s=25°C)

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 60 mA (Continuous)
• Forward Pulse Current (I_FP): 80 mA (Pulse Width ≤10ms, Duty Cycle ≤1/10)
• Power Dissipation (P_D): 102 mW
• Operating Temperature (T_opr): -40°C to +80°C
• Storage Temperature (T_stg): -40°C to +80°C
• Junction Temperature (T_j): 125°C
• Soldering Temperature (T_sld): 230°C or 260°C for 10 seconds (Reflow)

2.2 Electro-Optical Characteristics (T_s=25°C, I_F=40mA)

These parameters define the typical performance under standard test conditions.

• Forward Voltage (V_F): 3.0 V (Typical), 3.4 V (Maximum)
• Reverse Voltage (V_R): 5 V
• Peak Wavelength (λ_d): 455 nm (Typical)
• Reverse Current (I_R): 10 µA (Maximum) at V_R=5V
• Viewing Angle (2θ_1/2): 110° (Typical)

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on measured parameters.

3.1 Luminous Flux Binning (at 40mA)

Bins are defined by a minimum and maximum luminous output.

• Code A3: 1.0 lm (Min) to 1.5 lm (Max)
• Code A4: 1.5 lm (Min) to 2.0 lm (Max)
• Code A5: 2.0 lm (Min) to 2.5 lm (Max)

Note: Luminous flux measurement tolerance is ±7%.

3.2 Wavelength Binning

This defines the dominant wavelength range of the emitted blue light.

• Code B1: 445 nm to 450 nm
• Code B2: 450 nm to 455 nm
• Code B3: 455 nm to 460 nm
• Code B4: 460 nm to 465 nm

3.3 Forward Voltage Binning

Sorting by voltage helps in designing efficient driver circuits.

• Code 1: 2.8 V to 3.0 V
• Code 2: 3.0 V to 3.2 V
• Code 3: 3.2 V to 3.4 V

Note: Forward voltage measurement tolerance is ±0.08V.

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve shows the relationship between the current flowing through the LED and the voltage across it. It is non-linear, characteristic of a diode. The typical forward voltage (V_F) is specified at a test current of 40mA. Designers must ensure the driver circuit provides adequate voltage to reach the desired operating current while managing power dissipation.

4.2 Forward Current vs. Relative Luminous Flux

This curve illustrates how light output increases with current. While output rises with current, efficiency typically decreases at higher currents due to increased thermal effects. Operating at or below the recommended continuous current (60mA) ensures optimal efficacy and longevity.

4.3 Junction Temperature vs. Relative Spectral Power

LED performance is temperature-dependent. As the junction temperature (T_j) increases, the luminous flux generally decreases, and the peak wavelength may shift slightly (typically towards longer wavelengths for blue LEDs). Effective thermal management in the application is crucial to maintain stable optical performance and lifetime.

4.4 Spectral Power Distribution

The spectral curve depicts the intensity of light emitted across different wavelengths. For a blue LED, this is a relatively narrow peak centered around the dominant wavelength (e.g., 455nm). The full width at half maximum (FWHM) of this peak determines the color purity.

5. Mechanical and Package Information

5.1 Package Dimensions: 3014 (3.0mm x 1.4mm x 0.8mm)

The LED is housed in a standard 3014 SMD package. Key dimensions include a body length of 3.0mm, a width of 1.4mm, and a height of 0.8mm. Tolerances are specified as ±0.10mm for .X dimensions and ±0.05mm for .XX dimensions.

5.2 Pad Layout and Stencil Design

The recommended footprint for PCB design includes two anode and two cathode pads to ensure stable mechanical attachment and good solder joint formation. A corresponding solder paste stencil pattern is provided to control the volume of solder paste deposited during assembly, which is critical for achieving reliable solder joints without bridging or insufficient solder.

5.3 Polarity Identification

The component typically has a marking or a notch on the package to indicate the cathode side. The PCB footprint should also be clearly marked to prevent reverse installation during assembly.

6. Soldering, Assembly, and Handling Guidelines

6.1 Moisture Sensitivity and Baking

The 3014 package is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020C). If the original moisture barrier bag is opened and the components are exposed to ambient humidity beyond specified limits (indicated by the humidity indicator card inside the bag), they must be baked before reflow soldering to prevent popcorn cracking or other moisture-induced damage.

• Baking Condition: 60°C for 24 hours.
• Post-Baking: Components should be soldered within 1 hour or stored in a dry environment (<20% RH).
• Do not bake at temperatures exceeding 60°C.

6.2 Storage Conditions

• Unopened Bag: Store at 5°C to 30°C, humidity below 85%.
• After Opening: Store at 5°C to 30°C, humidity below 60%. For best practice, store in a sealed container with desiccant or a nitrogen cabinet.
• Floor Life: Use within 12 hours after opening the bag under factory floor conditions.

6.3 Electrostatic Discharge (ESD) Protection

Blue LEDs are sensitive to electrostatic discharge. ESD can cause immediate failure (catastrophic) or latent damage leading to reduced lifetime and performance degradation.

Prevention Measures:

• Use grounded anti-static workstations and floors.
• Operators must wear grounded wrist straps, anti-static smocks, and gloves.
• Use ionizers to neutralize static charges in the work area.
• Use ESD-safe packaging and handling materials.
• Ensure all tools (e.g., soldering irons) are properly grounded.

6.4 Application Circuit Design

Proper circuit design is essential for reliable operation.

• Current Limiting: Always use a series current-limiting resistor or, preferably, a constant-current driver. A constant-current source provides stable light output regardless of minor variations in forward voltage.
• Circuit Configuration: When connecting multiple LEDs, a series configuration with a single current-limiting element per string is recommended over pure parallel connections to ensure even current distribution.
• Power Sequencing: When connecting the LED module to a power supply, first connect the driver output to the LED, then connect the driver input to the power source to avoid voltage transients.

6.5 Component Handling

Avoid direct handling of the LED lens with fingers, as skin oils can contaminate the silicone surface, potentially reducing light output or causing discoloration. Use vacuum pick-up tools or tweezers. Avoid applying excessive mechanical pressure to the silicone dome, as this can damage the wire bonds or the chip inside, leading to failure.

7. Model Numbering Rule

The product code follows a structured format: T □□ □□ □ □ □ – □□□ □□

This code includes information on:

• Package Outline: e.g., '3B' for 3014.
• Lens/Optics: e.g., '00' for no lens.
• Chip Configuration: e.g., 'S' for single small-power chip.
• Color: e.g., 'B' for Blue.
• Internal Code
• Correlated Color Temperature (CCT) Code: For white LEDs.
• Luminous Flux Bin Code: e.g., 'A3', 'A4', etc.

8. Application Notes and Design Considerations

8.1 Typical Application Scenarios

• Backlighting: For LCD displays, keypads, or signage.
• Decorative Lighting: Accent lighting, mood lighting.
• Indicator Lights: Status indicators on consumer electronics or industrial equipment.
• RGB Systems: As the blue element in color-mixing applications.

8.2 Thermal Management

Although the power is relatively low (102mW max), effective heat sinking is still important for maintaining performance and longevity, especially in enclosed fixtures or high ambient temperatures. Ensure the PCB has adequate thermal relief and, if necessary, use a metal-core PCB (MCPCB) for better heat dissipation.

8.3 Optical Design

The wide 110-degree viewing angle provides diffuse illumination. For applications requiring a more focused beam, secondary optics (lenses or reflectors) can be placed over the LED. The silicone lens material should be compatible with secondary optical components.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between the luminous flux bins A3, A4, and A5?

These bins represent different minimum and maximum light output levels at the standard test current of 40mA. A5 is the brightest bin, followed by A4, then A3. Selecting a specific bin allows for tighter brightness control in your application.

9.2 Why is baking necessary before soldering?

The plastic package can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can vaporize rapidly, creating internal pressure that can crack the package or delaminate internal interfaces, leading to failure. Baking removes this absorbed moisture.

9.3 Can I drive this LED at its maximum pulse current (80mA) continuously?

No. The 80mA rating is for pulsed operation only (≤10ms pulse width, ≤10% duty cycle). Continuous operation at this current would exceed the maximum power dissipation rating and likely cause rapid degradation or failure due to overheating.

9.4 How do I interpret the wavelength bin code (e.g., B2)?

The code B2 indicates that the dominant wavelength of the LED is between 450nm and 455nm. This allows designers to select LEDs with a specific hue of blue for color-critical applications.

10. Technical Comparison and Trends

10.1 Comparison with Similar Packages

The 3014 package offers a smaller footprint than the older 3528 package while often providing comparable or superior light output and thermal performance. Compared to the 2835 package, the 3014 may have a slightly different spatial radiation pattern and thermal resistance, making the choice application-dependent.

10.2 Industry Trends

The general trend in SMD LEDs is towards higher efficacy (more lumens per watt), improved color consistency through tighter binning, and enhanced reliability. Packaging technologies continue to evolve to better manage heat from the semiconductor chip, which is the primary factor limiting LED lifetime and performance. The principles of moisture sensitivity handling (MSL) and ESD protection remain critically important across all modern LED packages.