LED Datasheet - Ceramic 9292 Series 10W White LED - Size 9.2x9.2mm - Voltage 9.3V - Power 10W - English Technical Document

1. Product Overview

The Ceramic 9292 Series represents a high-power, surface-mount LED solution designed for applications demanding high luminous flux output and robust thermal performance. The ceramic substrate provides excellent thermal conductivity, which is critical for maintaining LED performance and longevity at high drive currents. This series is particularly suitable for general lighting, high-bay lighting, outdoor area lighting, and other illumination applications where reliability and light output are paramount.

The core advantage of this series lies in its combination of a high-power rating (10W) with the thermal stability offered by the ceramic package. This allows designers to push the LEDs to their specified limits while managing junction temperature effectively. The product is offered in a range of white color temperatures (Warm White, Neutral White, Cool White) to suit various lighting atmospheres and requirements.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The following parameters define the operational limits of the LED. Exceeding these values may cause permanent damage.

• Forward Current (IF): 1500 mA (Continuous)
• Forward Pulse Current (IFP): 3000 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (PD): 15000 mW
• Operating Temperature (Topr): -40°C to +100°C
• Storage Temperature (Tstg): -40°C to +100°C
• Junction Temperature (Tj): 125°C
• Soldering Temperature (Tsld): 230°C or 260°C for 10 seconds (reflow soldering)

2.2 Electro-Optical Characteristics (Ts=25°C)

These are the typical performance parameters measured under standard test conditions.

• Forward Voltage (VF): 9.3 V (Typical), 10 V (Maximum) @ IF=1050mA
• Reverse Voltage (VR): 5 V
• Reverse Current (IR): 100 μA (Maximum)
• Viewing Angle (2θ1/2): 130°

3. Binning System Explanation

3.1 Color Temperature Binning

The LEDs are binned into standard Correlated Color Temperature (CCT) groups. Each group corresponds to a specific range on the CIE chromaticity diagram, ensuring color consistency within a batch. The standard ordering bins are:

• 2700K (8A, 8B, 8C, 8D)
• 3000K (7A, 7B, 7C, 7D)
• 3500K (6A, 6B, 6C, 6D)
• 4000K (5A, 5B, 5C, 5D)
• 4500K (4A, 4B, 4C, 4D, 4R, 4S, 4T, 4U)
• 5000K (3A, 3B, 3C, 3D, 3R, 3S, 3T, 3U)
• 5700K (2A, 2B, 2C, 2D, 2R, 2S, 2T, 2U)
• 6500K (1A, 1B, 1C, 1D, 1R, 1S, 1T, 1U)

Note: The product is ordered specifying a minimum luminous flux bin, not a maximum. Shipments will always adhere to the ordered CCT chromaticity region.

3.2 Luminous Flux Binning

Luminous flux is categorized into bins defined by a minimum value. The typical test current is 1050mA.

• Warm White / Neutral White (70 CRI):
  • Code 3K: Min 800 lm, Typ 900 lm
  • Code 3L: Min 900 lm, Typ 1000 lm
• Cool White (70 CRI):
  • Code 3L: Min 900 lm, Typ 1000 lm
  • Code 3M: Min 1000 lm, Typ 1100 lm

Tolerances: Luminous Flux ±7%, CRI ±2, Chromaticity Coordinates ±0.005.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (IV Curve)

The IV curve shows the relationship between the forward voltage (Vf) and the forward current (If). For this LED, the typical Vf is 9.3V at 1050mA. The curve is relatively linear in the operating range but exhibits the characteristic exponential rise at very low currents and a more resistive linear behavior at higher currents. Designers must ensure the driver can provide the necessary voltage headroom, especially considering the maximum Vf of 10V.

4.2 Relative Luminous Flux vs. Forward Current

This curve illustrates how light output increases with current. While output rises with current, the relationship is not perfectly linear due to efficiency droop—a phenomenon where the LED's internal quantum efficiency decreases at higher current densities. Operating at the recommended 1050mA provides a good balance between output and efficiency/lifetime. Exceeding the maximum continuous current (1500mA) will accelerate lumen depreciation and reduce lifespan.

4.3 Relative Spectral Power vs. Junction Temperature

As the junction temperature (Tj) increases, the spectral power distribution of a white LED (typically a blue chip + phosphor) can shift. Often, the peak wavelength may experience a slight red-shift, and the overall radiant power may decrease. This graph is crucial for understanding color stability under different thermal conditions. Effective heat sinking is essential to minimize Tj rise and maintain consistent color and light output.

5. Mechanical & Packaging Information

5.1 Physical Dimensions

The LED package follows the 9292 footprint, meaning it is approximately 9.2mm x 9.2mm in size. The exact dimensional drawing should be referenced for PCB layout. The ceramic body provides the primary thermal path from the LED chip to the PCB.

5.2 Recommended Pad Layout & Stencil Design

A recommended footprint (pad layout) and stencil design are provided to ensure reliable soldering and optimal thermal performance. The pad design typically includes large thermal pads to facilitate heat transfer from the LED's underside to the PCB's copper plane. The stencil aperture design controls solder paste volume. Adherence to these recommendations with a tolerance of ±0.10mm is critical for achieving a proper solder joint and minimizing voids under the thermal pad.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Parameters

The LED is rated for standard lead-free reflow profiles. The maximum body temperature during soldering should not exceed 230°C or 260°C for more than 10 seconds, depending on the chosen profile. It is vital to follow a controlled temperature ramp to prevent thermal shock to the ceramic package and internal components. Pre-baking may be required if the LEDs have been exposed to moisture, following the relevant IPC/JEDEC standards.

6.2 Handling & Storage

LEDs are sensitive to electrostatic discharge (ESD). Proper ESD precautions (wrist straps, grounded workstations) should be used during handling. Store components in a dry, controlled environment. Avoid mechanical stress on the lens or wire bonds.

7. Part Numbering System

The model number follows a structured format: T12019L(C,W)A. A general decoding of the naming convention is provided, which includes codes for:

• Luminous Flux: A code representing the light output bin.
• Color Temperature: L (Warm White <3700K), C (Neutral White 3700-5000K), W (Cool White >5000K).
• Chip Count: Indicates the number and type of LED chips inside (e.g., P for single high-power chip).
• Optics Code: 00 for no primary lens, 01 with lens.
• Package Code: 12 specifically denotes the Ceramic 9292 form factor.

Understanding this system is essential for correct ordering and specification.

8. Application Suggestions

8.1 Typical Application Scenarios

• High-Bay & Industrial Lighting: Leveraging high lumen output and robust construction.
• Outdoor Area Lighting: Street lights, parking lot lights, stadium lighting.
• High-Flux General Lighting: Commercial downlights, track lighting, retrofit modules.
• Specialty Lighting: Grow lights, projectors (where specific bins are selected).

8.2 Design Considerations

• Thermal Management: This is the most critical aspect. Use a PCB with a thick copper layer (e.g., 2oz) and connect the thermal pad to large copper planes or an external heatsink. The goal is to keep the junction temperature (Tj) as low as possible, ideally below 85°C for maximum lifetime.
• Electrical Drive: Use a constant-current LED driver rated for the forward voltage range (approx. 9-10V per LED) and the desired current (e.g., 1050mA). Consider dimming requirements.
• Optical Design: The wide 130-degree viewing angle may require secondary optics (reflectors, lenses) to achieve the desired beam pattern for the application.

9. Technical Comparison & Differentiation

Compared to plastic-packaged high-power LEDs, the Ceramic 9292's primary differentiator is its superior thermal performance. The ceramic material has a lower thermal resistance than plastic, allowing heat to be conducted away from the LED junction more efficiently. This translates to:

• Higher maximum drive currents for greater light output.
• Better lumen maintenance (less light output depreciation over time).
• Improved color stability over temperature and lifetime.
• Generally higher reliability and longer lifespan under equivalent operating conditions.

The trade-off is often a slightly higher unit cost compared to plastic packages.

10. Frequently Asked Questions (FAQs)

10.1 What is the actual power consumption?

At the typical operating point of 1050mA and 9.3V, the electrical power input is approximately 9.8 Watts. The "10W" designation refers to the nominal power class.

10.2 How do I achieve the rated lifetime?

LED lifetime (often L70 or L90, meaning time to 70% or 90% of initial lumens) is highly dependent on junction temperature. To achieve the rated lifetime (typically 50,000 hours or more), you must design an effective thermal management system to keep Tj within the recommended limits. Derating the drive current below the maximum also significantly extends life.

10.3 Can I drive this LED with a constant voltage source?

No. LEDs are current-driven devices. Their forward voltage has a tolerance and varies with temperature. A constant voltage source could lead to thermal runaway, where increasing current causes heating, which lowers Vf, causing more current, leading to failure. Always use a constant-current driver.

11. Practical Design Case Study

Scenario: Designing a 50W high-bay light fixture. Implementation: Use 5 of these Ceramic 9292 LEDs connected in series. The total forward voltage will be approximately 46.5V (5 * 9.3V). Select a constant-current driver with an output of 1050mA and a voltage range covering ~45V to 50V. Mount the LEDs on a metal-core PCB (MCPCB) with a high-performance thermal interface material attaching the MCPCB to a large aluminum heatsink. This design efficiently manages the ~49W of total heat dissipation, ensuring long-term reliability and stable light output.

12. Technical Principle Introduction

This LED generates white light using the prevalent phosphor-converted method. A high-efficiency blue indium gallium nitride (InGaN) semiconductor chip emits blue light. This blue light partially passes through and partially excites a yellow (or a mix of red and green) phosphor layer deposited on or near the chip. The combination of the remaining blue light and the broad-spectrum yellow light from the phosphor mixes to produce white light. The specific ratio of blue to phosphor-converted light, and the phosphor composition, determines the Correlated Color Temperature (CCT) and Color Rendering Index (CRI). The ceramic package primarily serves as a mechanically robust and thermally conductive platform for mounting the chip, wire bonds, and phosphor.

13. Technology Trends

The high-power LED market continues to evolve towards higher efficacy (more lumens per watt), improved color quality (higher CRI and R9 values), and greater reliability. Ceramic packages are becoming more prevalent for high-end applications due to their thermal advantages. Trends include:

• Increased Efficacy: Ongoing improvements in chip epitaxy and phosphor technology.
• Color Tuning: Products enabling dynamic CCT adjustment.
• Miniaturization with High Output: Packing more light into smaller packages.
• Integrated Solutions: LEDs combined with drivers, optics, and sensors into modular "light engines."
• Sustainability: Focus on materials and processes that reduce environmental impact.

The Ceramic 9292 series sits within this trend, offering a balance of high output and thermal performance for demanding lighting solutions.