Ceramic LED 9292 Series 10W White Light Specification - Dimensions 9.2x9.2x1.6mm - Voltage 9.3V - Power 10W - English Technical Document

1. Product Overview

The 9292 Ceramic Series represents a high-power, surface-mount LED designed for demanding lighting applications requiring robust thermal performance and high luminous output. Utilizing a ceramic substrate, this package offers superior heat dissipation compared to traditional plastic packages, enabling reliable operation at higher drive currents and in elevated ambient temperatures. The series is available in a range of white color temperatures from 2700K to 6500K, with a typical luminous flux output of up to 1100 lumens at 350mA. Its primary target markets include commercial lighting, high-bay lighting, outdoor area lighting, and any application where long-term reliability and consistent light output are critical.

1.1 Core Advantages

• Superior Thermal Management: The ceramic package provides excellent thermal conductivity, effectively transferring heat from the LED junction to the PCB and heatsink, thereby extending operational lifespan and maintaining color stability.
• High Power Capability: Rated for up to 10W power dissipation, suitable for high-lumen-output designs.
• Robust Construction: Ceramic material offers high mechanical strength and resistance to thermal stress and humidity.
• Consistent Optical Performance: Tight binning standards for color temperature and luminous flux ensure uniformity in multi-LED arrays.
• Wide Viewing Angle: A typical 130-degree viewing angle provides broad, even illumination.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Absolute Maximum Ratings (Ts=25\u00b0C)

These values represent the limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for normal use.

• Forward Current (IF): 700 mA (DC)
• Forward Pulse Current (IFP): 700 mA (Pulse width \u2264 10ms, Duty cycle \u2264 1/10)
• Power Dissipation (PD): 20300 mW (20.3W)
• Operating Temperature (Topr): -40\u00b0C to +100\u00b0C
• Storage Temperature (Tstg): -40\u00b0C to +100\u00b0C
• Junction Temperature (Tj): 125\u00b0C (Maximum permissible temperature at the semiconductor junction)
• Soldering Temperature (Tsld): Reflow soldering at 230\u00b0C or 260\u00b0C for a maximum of 10 seconds.

2.2 Electro-Optical Characteristics (Ts=25\u00b0C)

These are typical operating parameters under specified test conditions.

• Forward Voltage (VF): Typical 9.3V, Maximum 29V at IF = 350mA. The wide maximum range indicates potential variation between production lots; circuit design should accommodate the upper limit.
• Reverse Voltage (VR): 5V. LEDs are not designed to withstand significant reverse bias. Exceeding this voltage can cause immediate failure.
• Reverse Current (IR): Maximum 100 \u00b5A at VR = 5V.
• Viewing Angle (2\u03b81/2): 130 degrees (typical). This is the full angle at which luminous intensity is half of the peak intensity.

2.3 Thermal Characteristics

The ceramic package's primary benefit is thermal. The high maximum power dissipation rating (20.3W) and operating temperature range (-40 to +100\u00b0C) underscore its capability. However, maintaining the junction temperature (Tj) below 125\u00b0C is paramount for reliability. This requires effective thermal path design from the LED's thermal pad to the system heatsink.

3. Binning System Explanation

A precise binning system is essential for ensuring color and brightness consistency in lighting products.

3.1 Correlated Color Temperature (CCT) Binning

The LED is available in standard CCTs, each mapped to specific chromaticity regions on the CIE 1931 diagram. The ordering code specifies the target region, guaranteeing the emitted white light falls within a defined color space.

• 2700K (Regions: 8A, 8B, 8C, 8D)
• 3000K (Regions: 7A, 7B, 7C, 7D)
• 3500K (Regions: 6A, 6B, 6C, 6D)
• 4000K (Regions: 5A, 5B, 5C, 5D)
• 4500K (Regions: 4A, 4B, 4C, 4D, 4R, 4S, 4T, 4U)
• 5000K (Regions: 3A, 3B, 3C, 3D, 3R, 3S, 3T, 3U)
• 5700K (Regions: 2A, 2B, 2C, 2D, 2R, 2S, 2T, 2U)
• 6500K (Regions: 1A, 1B, 1C, 1D, 1R, 1S, 1T, 1U)

Note: The datasheet specifies that the luminous flux bin represents a minimum value. Shipments may exceed the ordered minimum flux but will always adhere to the ordered CCT chromaticity region.

3.2 Luminous Flux Binning

Flux is binned at a test current of 350mA. Tolerances are clearly defined.

• Warm White / Neutral White (2700K-5000K, CRI 70):
  • Code 3K: Min 800 lm, Typ 900 lm
  • Code 3L: Min 900 lm, Typ 1000 lm
• Cool White (5000K-10000K, CRI 70):
  • Code 3L: Min 900 lm, Typ 1000 lm
  • Code 3M: Min 1000 lm, Typ 1100 lm

Tolerances: Luminous Flux: \u00b17%; CRI: \u00b12; Chromaticity Coordinates: \u00b10.005.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve is characteristic of a diode. The typical Vf of 9.3V at 350mA indicates this is a high-voltage LED, likely featuring multiple diode junctions in series within the package. Designers must ensure the driver can provide sufficient voltage, especially considering the maximum Vf of 29V. The curve shows a non-linear relationship; a small increase in voltage leads to a large increase in current, highlighting the need for constant-current drive.

4.2 Forward Current vs. Relative Luminous Flux

This curve demonstrates the dependency of light output on drive current. Light output increases with current but not linearly. At higher currents, efficiency typically drops due to increased thermal effects and droop. Operating at the recommended 350mA likely represents a balance between output and efficiency/lifetime.

4.3 Relative Spectral Power Distribution

The spectral curve for a white LED shows a primary blue peak (from the InGaN chip) and a broader yellow phosphor emission. The shape and ratio of these peaks determine the CCT and CRI. Cool white LEDs have a more dominant blue peak, while warm whites have stronger phosphor emission. The curve is essential for understanding color rendering properties.

4.4 Junction Temperature vs. Relative Spectral Energy

This graph is critical for understanding color shift. As junction temperature rises, the spectral output of the LED chip and the conversion efficiency of the phosphor can change, leading to shifts in CCT and chromaticity. The ceramic package helps minimize the temperature rise, thereby reducing the magnitude of this shift.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a 9.2mm x 9.2mm ceramic surface-mount package. The exact height is typically around 1.6mm. The dimensional drawing provides critical measurements for PCB footprint design and clearance checks.

5.2 Recommended Pad Layout and Stencil Design

A detailed pad layout diagram is provided to ensure proper solder joint formation and thermal connection. The design typically features a large central thermal pad for heat transfer and smaller pads for electrical connections (anode and cathode). The accompanying stencil design recommends the solder paste aperture geometry and thickness to achieve the correct solder volume. A tolerance of \u00b10.10mm is specified for these layouts.

5.3 Polarity Identification

The datasheet should indicate polarity marking on the device (e.g., a dot, notch, or chamfered corner) and correlate it to the pad layout. Correct polarity is essential for operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The LED is compatible with standard lead-free (Pb-free) reflow processes. The maximum body temperature during soldering must not exceed 260\u00b0C, and the time above 230\u00b0C should be limited to 10 seconds. It is crucial to follow the recommended temperature profile (ramp-up, soak, reflow peak, cooling) to prevent thermal shock, solder joint defects, or damage to the LED's internal materials and phosphor.

6.2 Handling and Storage Precautions

• Store in a dry, anti-static environment within the specified temperature range (-40 to +100\u00b0C).
• Handle with ESD precautions to protect the semiconductor junction.
• Avoid mechanical stress on the ceramic body or the wire bonds.
• Use within the shelf life recommended by the manufacturer, typically 12 months from date of shipment when stored under proper conditions.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are typically supplied on tape and reel for automated pick-and-place assembly. The reel size, tape width, pocket dimensions, and device orientation follow standard EIA-481 guidelines. The quantity per reel is a standard value like 100 or 500 pieces.

7.2 Model Numbering Rule

The model number T12019L(C/W)A encodes key product attributes:
- T: Series identifier.
- 12: Package code for Ceramic 9292.
- L/C/W: Color code (L=Warm White, C=Neutral White, W=Cool White).
- Other digits specify internal codes, flux bin, and other options as per the detailed naming rule chart.

8. Application Recommendations

8.1 Typical Application Scenarios

• High-Bay and Industrial Lighting: Where high lumen output and robust construction are needed.
• Outdoor Area Lighting: Street lights, parking lot lights, stadium lighting benefiting from the wide viewing angle and thermal robustness.
• High-Output Downlights and Track Lights: For commercial and retail spaces.
• Specialty Lighting: Grow lights, where specific spectra and high intensity are required.

8.2 Critical Design Considerations

• Thermal Management: This is the most critical factor. Use a PCB with adequate thermal vias under the pad, connected to a sufficiently sized metal-core PCB (MCPCB) or heatsink. Thermal interface material (TIM) quality is important.
• Drive Current: Use a constant-current LED driver. The current should be set based on the desired light output and thermal design margin. Do not exceed the absolute maximum rating.
• Optical Design: The 130-degree viewing angle may require secondary optics (lenses, reflectors) to achieve the desired beam pattern.
• Electrical Layout: Ensure low-inductance, low-resistance traces from the driver to the LED to minimize power loss and voltage spikes.

9. Technical Comparison and Differentiation

Compared to standard mid-power plastic SMD LEDs (e.g., 3030, 5050), the 9292 Ceramic Series offers:
- Higher Power Handling: 10W+ vs. typically 1-3W for plastic packages.
- Superior Thermal Resistance (Rth j-s): The ceramic substrate has much lower thermal resistance than plastic, leading to a lower junction temperature at the same power, which directly translates to longer lifetime (L70, L90).
- Better Color Stability: Lower thermal resistance minimizes color shift over time and temperature.
- Higher Cost: Ceramic packaging is more expensive than plastic molding.
Compared to other ceramic packages (e.g., 3535, 5050 ceramic), the 9292's larger footprint allows for a bigger thermal pad and potentially higher total light output from multiple chips or a larger single chip.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What driver voltage is required?

The driver must supply a voltage higher than the maximum forward voltage (Vf max) of the LED string. For a single 9292 LED, the driver output must exceed 29V. In practice, a safety margin is added. For multiple LEDs in series, multiply the maximum Vf by the number of LEDs.

10.2 How do I achieve the rated lifetime?

LED lifetime (e.g., L70 - time to 70% of initial lumen output) is heavily dependent on junction temperature (Tj). To achieve the rated lifetime, you must design the system to keep Tj well below the maximum of 125\u00b0C, ideally below 85-105\u00b0C during operation. This requires excellent thermal management as described in section 8.2.

10.3 Can I drive it at 700mA continuously?

The Absolute Maximum Rating for DC forward current is 700mA. However, continuous operation at this maximum rating will generate significant heat and likely push Tj to its limit, severely compromising lifetime and reliability. The typical operating condition specified is 350mA. Operation above this should only be considered with exceptional thermal design and an understanding of the reduced lifetime.

10.4 What is the difference between the 3K, 3L, and 3M flux bins?

These are luminous flux output bins measured at 350mA. 3K is the lowest output bin (min 800lm), 3L is middle (min 900lm), and 3M is the highest for cool white (min 1000lm). Selecting a higher bin yields more light per device but may come at a higher cost.

11. Design and Usage Case Study

Scenario: Designing a 100W High-Bay Light Fixture.
A designer aims to create a fixture with approximately 15,000 lumens. Using 9292 LEDs in the 3M flux bin (1000lm typ each), they would need 15 LEDs. They arrange them in a 3-series x 5-parallel configuration. Each series string has a max Vf of 3 * 29V = 87V. They select a constant-current driver with an output of 1050mA (350mA x 3 parallel strings) and a voltage range covering up to ~90V. The PCB is a metal-core board with a thick aluminum base. Thermal simulations are run to ensure the heatsink can dissipate the ~150W of total heat (100W electrical, plus driver losses) while keeping the LED junction temperature below 105\u00b0C in a 40\u00b0C ambient environment. Secondary optics are used to create a 120-degree beam pattern suitable for high-bay illumination.

12. Operating Principle

A white LED operates on the principle of electroluminescence in a semiconductor and phosphor conversion. Electrical current is driven through a forward-biased InGaN (Indium Gallium Nitride) semiconductor junction, causing electrons and holes to recombine and emit photons in the blue spectrum (typically around 450-455nm). This blue light then strikes a layer of yellow (YAG:Ce) phosphor coating on or near the chip. The phosphor absorbs a portion of the blue photons and re-emits light across a broad spectrum in the yellow region. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The ratio of blue to yellow light determines the correlated color temperature (CCT).

13. Technology Trends

The high-power ceramic LED market is driven by several key trends:
- Increased Efficacy (lm/W): Ongoing improvements in chip epitaxy, phosphor technology, and package design aim to extract more light per watt of electrical input.
- Improved Color Quality: Development of phosphor blends (multi-phosphor or violet-pump systems) to achieve higher Color Rendering Index (CRI), especially R9 (saturated red), and more consistent color across batches.
- Miniaturization with High Flux: Efforts to pack more lumens into smaller ceramic packages (e.g., moving from 9292 to more compact but equally powerful footprints) to enable smaller, more discreet luminaires.
- Smart and Tunable Lighting: Integration of ceramic LEDs with control electronics to enable dimming, CCT tuning, and color-changing capabilities for human-centric lighting applications.
- Reliability and Lifetime: Continued focus on materials and packaging to further reduce thermal resistance and slow lumen depreciation, pushing L90 lifetimes beyond 100,000 hours.