ELCS14G-NB5060J6J8293910-F3X LED Datasheet - High-Efficiency Cool White - 245lm @ 1A - 3.95V Max - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, cool white light-emitting diode (LED) designed for applications requiring high luminous output in a compact form factor. The device utilizes InGaN chip technology to produce cool white light with a correlated color temperature (CCT) typically between 5000K and 6000K. Its primary advantages include a high typical luminous flux of 245 lumens at a forward current of 1 Ampere, resulting in an optical efficiency of approximately 72 lumens per watt. The LED is compliant with RoHS, REACH, and halogen-free standards, making it suitable for environmentally conscious designs and global markets.

1.1 Target Applications

The LED is engineered for a diverse range of applications where bright, efficient illumination is critical. Key target markets include mobile electronics, general lighting, and automotive sectors. Specific applications include camera flash and torch light functions for mobile phones and digital video cameras, TFT-LCD backlighting units, indoor and outdoor general lighting fixtures, decorative and entertainment lighting, as well as both interior and exterior automotive lighting such as orientation markers, step lights, and signal luminaries.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters that define the LED's performance and operational limits.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions. The maximum continuous DC forward current for torch mode operation is 350 mA. For pulsed operation, a peak current of 1000 mA is allowed under a specific duty cycle (400 ms on, 3600 ms off for 30,000 cycles). The device can withstand an electrostatic discharge (ESD) of up to 2 kV (Human Body Model, JEDEC 3b). The maximum allowable junction temperature is 145°C, with an operating ambient temperature range of -40°C to +85°C. The LED is not designed for reverse bias operation. The thermal resistance from junction to solder pad is specified as 8.5 °C/W, which is a critical parameter for thermal management design.

2.2 Electro-Optical Characteristics

The electro-optical characteristics are specified at a standard test condition of a solder pad temperature (Ts) of 25°C. The typical luminous flux (Iv) is 245 lm at a forward current (IF) of 1000 mA, with a minimum guaranteed value of 220 lm. The forward voltage (VF) at this current ranges from a minimum of 2.95V to a maximum of 3.95V, with the typical value depending on the voltage bin. The correlated color temperature (CCT) for this cool white variant is specified between 5000K and 6000K. It is important to note that all electrical and optical data is tested under a 50 ms pulse condition to minimize self-heating effects during measurement, ensuring the data represents the intrinsic performance of the LED chip.

2.3 Thermal and Reliability Considerations

Proper thermal management is paramount for achieving stated performance and long-term reliability. The specified thermal resistance of 8.5°C/W indicates the temperature rise per watt of power dissipated. For example, at 1A and a typical VF of ~3.5V (3.5W), the junction temperature rise above the solder pad would be approximately 30°C. The datasheet explicitly warns against operating at the maximum junction temperature for more than one hour. All reliability specifications, including less than 30% IV degradation over 1000 hours, are assured under conditions of good thermal management using a 1.0 cm² Metal Core Printed Circuit Board (MCPCB).

3. Binning System Explanation

The LED is sorted into bins based on three key parameters: luminous flux, forward voltage, and chromaticity (color coordinates). This binning ensures consistency within a production lot and allows designers to select parts that meet specific application requirements.

3.1 Luminous Flux Binning

Luminous flux bins are designated by alphanumeric codes (J6, J7, J8). For the J6 bin, the luminous flux ranges from 220 lm to 250 lm at IF=1000mA. The J7 bin covers 250 lm to 300 lm, and the J8 bin covers 300 lm to 330 lm. The specific part number indicates the device belongs to the J6 flux bin.

3.2 Forward Voltage Binning

Forward voltage bins are defined by four-digit codes (2932, 3235, 3539). The code indicates the voltage range in tenths of a volt. For instance, bin 2932 covers VF from 2.95V to 3.25V, bin 3235 from 3.25V to 3.55V, and bin 3539 from 3.55V to 3.95V. The part number specifies the 2932 voltage bin.

3.3 Chromaticity (Color) Binning

The chromaticity is defined by a bin code (5060 in this case) which corresponds to a specific quadrilateral area on the CIE 1931 chromaticity diagram. The coordinates for the 5060 bin vertices are provided, defining the allowable color variation for devices within this bin, corresponding to a CCT range of 5000K to 6000K. The color coordinates are measured at IF=1000mA.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions, which is crucial for circuit design and system integration.

4.1 Forward Voltage vs. Forward Current (IV Curve)

The IV curve shows the relationship between forward voltage and forward current. It is non-linear, typical of a diode. At low currents, the voltage is lower, rising as current increases. This curve is essential for designing the current-limiting driver circuit to ensure the LED operates within its specified voltage range for a given current.

4.2 Relative Luminous Flux vs. Forward Current

This curve illustrates how light output changes with drive current. Luminous flux generally increases with current but exhibits a sub-linear relationship at higher currents due to efficiency droop and increased junction temperature. Understanding this relationship helps optimize the trade-off between brightness and efficiency/power consumption.

4.3 CCT vs. Forward Current

The correlated color temperature may shift slightly with changes in drive current. This curve shows the stability or variation of CCT across the operating current range, which is important for color-critical applications where consistent white point is required.

4.4 Relative Spectral Distribution

The spectral power distribution graph shows the intensity of light emitted at each wavelength. For a cool white LED based on a blue chip with a phosphor coating, the spectrum typically shows a dominant blue peak from the chip and a broader yellow/green/red emission band from the phosphor. The peak wavelength (λp) and the spectral width influence the Color Rendering Index (CRI) and the perceived color of the light.

4.5 Typical Radiation Pattern

The polar radiation pattern depicts the spatial distribution of light intensity. This LED features a Lambertian emission pattern, where the luminous intensity is proportional to the cosine of the viewing angle. The viewing angle (2θ1/2) is specified as 120 degrees, meaning the angle at which intensity drops to half of its peak value is ±60 degrees from the center axis.

5. Mechanical and Package Information

The physical dimensions and package design are critical for PCB layout, optical design, and thermal management.

5.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the LED package. All dimensions are provided in millimeters. This drawing includes key features such as the overall length, width, and height, the location and size of the solder pads, and any mechanical references or tolerances. Designers must refer to this drawing for accurate PCB footprint creation.

5.2 Polarity Identification

The package drawing or associated notes should clearly indicate the anode and cathode terminals. Correct polarity connection is essential for device operation. Typically, the cathode may be marked by a notch, a dot, a shorter lead, or a different pad shape on the PCB footprint.

6. Soldering and Assembly Guidelines

Proper handling and soldering are required to maintain device integrity and reliability.

6.1 Reflow Soldering Profile

The LED is rated for a maximum soldering temperature of 260°C and can withstand a maximum of 2 reflow cycles. A standard lead-free reflow profile should be followed, with careful control of peak temperature and time above liquidus to prevent damage to the plastic package and the internal wire bonds.

6.2 Moisture Sensitivity and Storage

The device has a Moisture Sensitivity Level (MSL) rating. The datasheet specifies a Level 1 rating, which means the device can be stored indefinitely at ≤30°C/85% RH before the bag is opened. However, specific storage conditions are recommended: before opening, store at ≤30°C/≤90% RH; after opening, store at ≤30°C/≤85% RH. If the specified floor life is exceeded or the desiccant indicator shows moisture ingress, a baking pre-treatment at 60±5°C for 24 hours is required before reflow soldering.

6.3 Thermal Management in Application

For reliable operation and to maintain high light output, the LED must be mounted on a Metal Core PCB (MCPCB) or another substrate with excellent thermal conductivity. The thermal path from the solder pad to the heatsink must be designed to keep the junction temperature well below the maximum rating during continuous operation. The use of thermal interface materials and adequate heatsinking is strongly recommended.

6.4 Electrical Protection

Although the device may have some integrated ESD protection, it is not designed for reverse bias operation. External protection, such as series current-limiting resistors and/or parallel transient voltage suppression diodes, should be considered in the circuit design to prevent damage from voltage spikes, reverse connection, or other electrical overstress conditions.

7. Packaging and Ordering Information

The LEDs are supplied in moisture-resistant packing for automated assembly.

7.1 Carrier Tape and Reel Specifications

The devices are packaged in embossed carrier tape wound onto reels. The standard loaded quantity is 2000 pieces per reel, with a minimum order quantity of 1000 pieces. Detailed dimensions for the carrier tape pockets, cover tape, and the reel itself are provided in the datasheet to ensure compatibility with pick-and-place equipment.

7.2 Product Labeling

The reel label contains critical information for traceability and correct application: Customer Part Number (CPN), Manufacturer Part Number (P/N), Lot Number, Packing Quantity (QTY), and the specific bin codes for Luminous Flux (CAT), Color (HUE), and Forward Voltage (REF). The Moisture Sensitivity Level (MSL-X) is also indicated.

8. Application Design Considerations

8.1 Driver Circuit Design

Select an appropriate constant-current LED driver IC or circuit capable of delivering up to 1A. The driver must account for the forward voltage range (2.95V-3.95V) and include necessary protections (over-current, over-temperature, open/short circuit). For flash applications, ensure the driver can handle the high peak pulse current.

8.2 Optical Design

The 120-degree Lambertian emission pattern is suitable for many general lighting applications. For focused beams (e.g., torch lights), secondary optics such as reflectors or lenses will be required. The small package size facilitates compact optical system design.

8.3 Thermal Design

Calculate the expected power dissipation (IF * VF) and use the thermal resistance (Rth) to estimate the junction temperature rise above the PCB's thermal reference point. Ensure the system's heatsinking is sufficient to keep Tj within safe limits, especially in high ambient temperature environments or enclosed fixtures. Active cooling (fans) may be necessary for high-power continuous operation.

9. Technical Comparison and Positioning

This LED positions itself in the market through its combination of high luminous flux (245 lm) and high efficiency (72 lm/W) in a presumably compact SMD package. Its key differentiators include a wide 120-degree viewing angle suitable for area lighting, a well-defined binning structure for color and flux consistency, and compliance with stringent environmental standards (RoHS, REACH, Halogen-Free). Compared to standard mid-power LEDs, it offers higher single-point brightness, making it suitable for applications requiring a concentrated light source like camera flashes. Compared to dedicated flash LEDs, it may offer better efficiency and a wider viewing angle for general illumination tasks.

10. Frequently Asked Questions (FAQ)

10.1 What is the difference between torch mode and pulse mode current ratings?

Torch mode (350 mA max) refers to continuous DC operation. Pulse mode (1000 mA max) refers to short-duration, high-current bursts as used in camera flashes, with strict limits on pulse width, duty cycle, and number of cycles to prevent overheating.

10.2 Why is thermal management so critical for this LED?

High power dissipation (up to ~4W at 1A) in a small package leads to high heat flux. Excessive junction temperature accelerates lumen depreciation (light output decrease over time) and can shift color coordinates. It can also ultimately cause catastrophic failure. Proper heatsinking is non-negotiable for reliability.

10.3 Can I drive this LED directly from a lithium-ion battery?

No. A lithium-ion battery's voltage (typically 3.0V-4.2V) is unregulated and can exceed the LED's maximum forward voltage or cause excessive current. A constant-current driver circuit is mandatory to ensure stable, safe, and consistent performance.

10.4 How do I interpret the part number ELCS14G-NB5060J6J8293910-F3X?

The part number encodes key bin information: 'NB5060' indicates the 5060 color bin (5000-6000K CCT). 'J6' indicates the luminous flux bin (220-250 lm). '2932' (implied from context in the spec table for this part) indicates the forward voltage bin (2.95-3.25V). The 'F3X' may refer to a specific optical or package variant.

11. Design and Usage Case Studies

11.1 Mobile Phone Camera Flash Module

In this application, the LED is driven by a dedicated flash driver IC. The design focuses on delivering a very high instantaneous current (up to 1A pulse) for a short duration (e.g., 400ms) to produce a bright flash. Key challenges include managing the high peak power dissipation thermally within the confined space of a mobile phone and ensuring the driver can source the required current from the battery. The LED's high efficiency helps maximize flash brightness while minimizing battery drain.

11.2 Portable Work Light or Torch

For a handheld torch, multiple LEDs might be used on an MCPCB. A buck or boost constant-current driver (depending on battery configuration) provides adjustable brightness levels. The design emphasizes robust thermal management—the MCPCB is attached to a substantial aluminum housing that acts as a heatsink. The wide 120-degree beam angle provides good area coverage, potentially reducing the need for complex optics.

12. Operational Principle

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN) that emits blue light when forward biased (electroluminescence). This blue light is partially absorbed by a layer of cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor coating the chip. The phosphor down-converts some of the blue photons to longer wavelengths in the yellow/green spectrum. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow emission, controlled by the phosphor composition and thickness, determines the correlated color temperature (CCT)—in this case, cool white (5000-6000K).

13. Technology Trends and Context

The device reflects ongoing trends in solid-state lighting: increasing luminous efficacy (lumens per watt), improved color consistency through tighter binning, and adherence to environmental regulations. The drive for higher flux from smaller packages pushes the limits of thermal management and phosphor technology. Future evolution may involve new phosphor materials for higher CRI and better color stability over temperature and time, as well as chip-scale package (CSP) designs that further reduce package size and thermal resistance. The integration of these high-brightness LEDs into intelligent, connected lighting systems for IoT applications is also a significant trend.