ELCH07-NB5060J6J8283910-F3H LED Datasheet - High-Efficiency White LED - English Technical Document

1. Product Overview

This document details the specifications for a high-efficiency white light-emitting diode (LED) component. The device is characterized by its compact package and superior luminous efficacy, making it suitable for a wide range of illumination applications where space and energy efficiency are critical. The core technology is based on InGaN (Indium Gallium Nitride) semiconductor material, which is standard for producing white light in modern LEDs, often utilizing a phosphor conversion layer.

1.1 Core Advantages and Target Market

The primary advantage of this LED is its high optical efficiency of 76.4 lumens per watt at a drive current of 1 Ampere, yielding a typical luminous flux of 260 lumens. This performance is achieved within a small form factor package. The device incorporates robust ESD (Electrostatic Discharge) protection, rated up to 8KV according to the JEDEC JS-001-2017 (Human Body Model) standard, enhancing its reliability during handling and assembly. It is fully compliant with environmental regulations including RoHS (Restriction of Hazardous Substances), EU REACH, and is manufactured as halogen-free. The target applications are diverse, focusing primarily on portable electronics and general lighting. Key markets include mobile device camera flashes, digital video camera torch lights, TFT display backlighting, automotive interior/exterior lighting, and various decorative and architectural illumination projects such as exit signs and step lights.

2. Technical Parameter Deep-Dive

This section provides an objective interpretation of the key electrical, optical, and thermal parameters defined in the absolute maximum ratings and characteristic tables. Operating the device beyond these limits may cause permanent damage or degrade performance.

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which the device's functional integrity cannot be guaranteed. The DC forward current for continuous (torch mode) operation is rated at 350 mA. For pulsed operation, such as in camera flash applications, a peak pulse current of 1200 mA is permissible under specific conditions: a maximum pulse duration of 400 milliseconds and a maximum duty cycle of 10%. The maximum allowable junction temperature (Tj) is 125°C, with an operating ambient temperature range of -40°C to +85°C. The device can withstand a soldering temperature (reflow) of 260°C for a maximum of two reflow cycles. The power dissipation in pulse mode is specified as 4.74 Watts. It is critical to note that these ratings should not be applied simultaneously for extended periods, as this can lead to reliability issues. Proper thermal management, such as using a Metal Core Printed Circuit Board (MCPCB), is essential for maintaining performance and longevity.

2.2 Electro-Optical Characteristics

The electro-optical characteristics are measured under controlled conditions: a solder pad temperature (Ts) of 25°C and typically using a 50-millisecond current pulse to minimize self-heating effects. The key parameters include:

• Luminous Flux (Iv): The total visible light output. The typical value is 260 lm at IF=1000mA, with a minimum of 220 lm. Measurement tolerance is ±10%.
• Forward Voltage (VF): The voltage drop across the LED when conducting current. The range is from 2.85V (min) to 3.95V (max) at 1000mA, with a measurement tolerance of ±0.1V.
• Correlated Color Temperature (CCT): Defines the white light shade. The specified range is 5000K to 6000K, which corresponds to a neutral to cool white appearance.
• Viewing Angle (2θ1/2): The full angle at which the luminous intensity is half of the peak value. It is 120 degrees with a tolerance of ±5 degrees, indicating a wide, near-Lambertian emission pattern suitable for area lighting.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key performance parameters. This allows designers to select components that meet specific application requirements for brightness, color, and voltage.

3.1 Luminous Flux Binning

The luminous flux is binned using alphanumeric codes (J6, J7, J8). For example, bin J6 covers a flux range from 220 lm to 250 lm at 1000mA, while bin J7 covers 250 lm to 300 lm. This allows selection for different brightness needs within the same product family.

3.2 Forward Voltage Binning

The forward voltage is binned using four-digit codes (2832, 3235, 3539). These codes represent the minimum and maximum voltage in tenths of a volt. For instance, bin 2832 covers VF from 2.85V to 3.25V. Matching voltage bins can be important for current balancing in multi-LED arrays.

3.3 Chromaticity (Color) Binning

The white color point is defined on the CIE 1931 chromaticity diagram. The provided bin, labeled 5060, targets a color temperature between 5000K and 6000K. The bin structure is defined by specific (x, y) coordinate corners, and the measurement allowance is ±0.01 in both x and y coordinates. This ensures the emitted white light falls within a predictable and acceptable color range.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions. These are essential for circuit design and thermal management.

4.1 Forward Voltage vs. Forward Current (IV Curve)

The IV curve shows the relationship between the forward current and the forward voltage. It is non-linear, typical of a diode. At 25°C, the voltage increases with current. Designers use this curve to determine the necessary drive voltage for a target current, which is crucial for designing constant-current drivers.

4.2 Relative Luminous Flux vs. Forward Current

This curve demonstrates the light output's dependence on drive current. The luminous flux generally increases with current but may exhibit sub-linear growth at higher currents due to efficiency droop and increased junction temperature. It highlights the importance of operating at an optimal current point for the best efficacy.

4.3 Correlated Color Temperature (CCT) vs. Forward Current

This graph shows how the white point's color temperature shifts with drive current. Some variation is normal, and understanding this trend is vital for applications requiring consistent color quality across different brightness levels.

4.4 Relative Spectral Distribution

The spectral power distribution plot shows the intensity of light emitted at each wavelength. For a white LED, this typically consists of a blue peak from the InGaN chip and a broader yellow-green peak from the phosphor. The shape of this curve determines the Color Rendering Index (CRI), though CRI is not explicitly specified in this datasheet.

4.5 Typical Radiation Patterns

The polar radiation pattern plots illustrate the spatial distribution of light intensity. The provided pattern shows a wide, smooth distribution consistent with a Lambertian emitter (where intensity is proportional to the cosine of the viewing angle), which is ideal for even, wide-area illumination.

5. Mechanical and Package Information

The physical dimensions and construction of the LED package are critical for PCB layout, optical design, and thermal management.

5.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the LED package. Key dimensions include the overall length, width, and height, as well as the solder pad locations and sizes. Tolerances are typically ±0.1mm unless otherwise specified. This drawing must be referenced for creating accurate PCB footprints.

5.2 Polarity Identification

The package features a polarity marker. Correct identification of the anode and cathode is essential to prevent reverse bias connection, which can damage the LED. The polarity is also indicated on the carrier tape for automated assembly.

6. Soldering and Assembly Guidelines

Proper handling and assembly are crucial for reliability.

6.1 Moisture Sensitivity Level (MSL)

The device is rated MSL Level 1. This means it has an unlimited floor life at conditions ≤30°C / 85% relative humidity. If the device is exposed to higher humidity, it may require baking before reflow soldering to prevent popcorn cracking during the high-temperature process.

6.2 Reflow Soldering Parameters

The maximum soldering temperature is 260°C, and the component can withstand a maximum of two reflow cycles. Standard lead-free reflow profiles with a peak temperature not exceeding 260°C should be followed. The substrate temperature during operation should not exceed 70°C when driven at 1000mA, emphasizing the need for effective thermal path design on the PCB.

6.3 Storage Conditions

The storage temperature range is -40°C to +100°C. Devices should be stored in a dry, controlled environment to maintain solderability and prevent moisture absorption.

7. Packaging and Ordering Information

The product is supplied in industry-standard packaging for automated assembly.

7.1 Carrier Tape and Reel

The LEDs are packaged on embossed carrier tape wound onto reels. Each reel contains 2000 pieces, with a minimum order quantity of 1000 pieces. The carrier tape dimensions and pocket design ensure secure holding and proper orientation for pick-and-place machines.

7.2 Product Labeling

The reel label contains critical information for traceability and verification: Part Number (P/N), Lot Number, Packing Quantity (QTY), and the specific Binning Codes for Luminous Flux (CAT), Chromaticity (HUE), and Forward Voltage (REF). The Moisture Sensitivity Level (MSL) is also indicated.

8. Application Suggestions and Design Considerations

Based on the technical parameters, here are key considerations for implementing this LED.

8.1 Driver Circuit Design

Always drive LEDs with a constant current source, not a constant voltage. The driver should be designed to supply the required current (e.g., 350mA for continuous, up to 1200mA pulsed) while accounting for the forward voltage bin of the LEDs used. For series connections, ensure the driver's compliance voltage exceeds the sum of the maximum VF of all LEDs in the string. For parallel connections, individual current balancing resistors or separate drivers are recommended to prevent current hogging.

8.2 Thermal Management

Heat is the primary cause of LED degradation and failure. The junction temperature must be kept below 125°C. Use a PCB with adequate thermal vias and, if necessary, a metal core (MCPCB) to conduct heat away from the LED solder pads. The datasheet notes that all reliability tests are performed with good thermal management using a 1.0 x 1.0 cm² MCPCB. For high-current or continuous operation, consider adding an external heatsink. Monitor the substrate temperature, which should not exceed 70°C at 1000mA.

8.3 Optical Design

The 120-degree viewing angle provides wide illumination. For applications requiring beam shaping (e.g., a spotlight), secondary optics such as reflectors or lenses will be necessary. The Lambertian-like emission pattern is generally forgiving and works well with many optical systems.

8.4 ESD Protection

While the LED has built-in ESD protection, it is still good practice to implement additional board-level protection, especially in environments prone to static discharge, such as during handheld device assembly or use.

9. Reliability and Lifetime

The datasheet references reliability testing. Key points include: all specifications are assured by a 1000-hour reliability test, with forward voltage degradation specified to be less than 30% under those test conditions (which include good thermal management). Operating at or near maximum ratings for extended periods will accelerate aging and may cause permanent damage. The lifetime (often defined as L70 or L50, the time until lumen output degrades to 70% or 50% of initial) is highly dependent on operating junction temperature and drive current. Derating the operating current and maintaining a low junction temperature are the most effective ways to maximize operational lifetime.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with a 3.3V power supply?
A: Possibly, but not directly. The forward voltage (VF) ranges from 2.85V to 3.95V at 1000mA. If your LED is in a lower VF bin (e.g., 2832), 3.3V might be sufficient, but any variation or temperature change could cause large current swings. A constant-current driver is always recommended for stable and safe operation.

Q: What is the difference between torch mode and pulse mode current ratings?
A: Torch mode (350mA DC) is for continuous, lower-power illumination. Pulse mode (1200mA peak) is for short, high-brightness bursts like a camera flash, with strict limits on pulse width (≤400ms) and duty cycle (≤10%) to prevent overheating.

Q: How do I interpret the bin codes in the part number (e.g., J6J8283910)?
A: The part number embeds the binning information. Based on the datasheet tables, \"J6\" likely refers to the luminous flux bin (220-250 lm), \"828\" may relate to the chromaticity bin (5060), and \"3910\" could indicate the forward voltage bin (e.g., part of the 3539 bin). Always verify the specific bin definitions from the full datasheet or supplier.

Q: Is a heatsink required?
A: For operation at the maximum continuous current (350mA) or any pulsed operation, effective thermal management is required. Whether this necessitates an external heatsink depends on your PCB design, ambient temperature, and required lifetime. Using an MCPCB is a common and effective solution.

11. Design and Use Case Examples

Case 1: Mobile Phone Camera Flash: The LED is ideal for this application due to its high pulse current capability (1200mA) and small size. A driver circuit would be designed to deliver a short, high-current pulse synchronized with the camera shutter. Thermal management is still important, as the flash may be used repeatedly. The neutral-white color temperature (5000-6000K) provides good color rendering for photos.

Case 2: Portable Work Light/Torch: For a battery-powered torch, efficiency is key. Operating the LED at a lower continuous current (e.g., 200-300mA) would maximize runtime while providing ample light. A driver with multiple brightness modes could be implemented. The wide 120-degree beam angle is perfect for area illumination.

Case 3: Architectural Step Lighting: For low-level illumination marking steps, multiple LEDs would be used at a low drive current for long life and minimal power consumption. The consistent color binning ensures uniform white light across all steps. The device's compliance with halogen-free and RoHS standards is important for building and environmental regulations.

12. Technology Background and Trends

Principle of Operation: This is a phosphor-converted white LED. A semiconductor chip made of InGaN emits blue light when current passes through it. This blue light excites a yellow (or red/green) phosphor coating on or near the chip. The combination of the remaining blue light and the converted yellow light is perceived by the human eye as white. The exact mix determines the Correlated Color Temperature (CCT).

Industry Trends: The general trend in LED technology is toward higher efficacy (lumens per watt), improved color rendering (higher CRI and R9 values), and better color consistency (tighter binning). There is also a drive toward higher power density in smaller packages, which makes thermal management increasingly critical. The integration of driver electronics and control features (dimming, color tuning) directly into LED packages is another growing trend. This particular datasheet reflects a mature, high-volume product focused on delivering reliable performance and efficiency for cost-sensitive, high-volume applications.