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LTP-1057AHR LED Display Datasheet - 1.24 Inch (31.5mm) Matrix Height - 5x7 Dot Matrix - Red Orange Color - English Technical Document

Complete technical datasheet for the LTP-1057AHR, a 1.24-inch (31.5mm) matrix height, 5x7 dot matrix LED display utilizing red-orange LED chips. Includes specifications, ratings, characteristics, pinout, dimensions, and application guidelines.
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PDF Document Cover - LTP-1057AHR LED Display Datasheet - 1.24 Inch (31.5mm) Matrix Height - 5x7 Dot Matrix - Red Orange Color - English Technical Document

1. Product Overview

The LTP-1057AHR is a single-digit, alphanumeric display module designed for applications requiring clear, legible character output. Its core function is to visually represent data, typically ASCII or EBCDIC coded characters, through an array of individually addressable light-emitting diodes (LEDs).

1.1 Core Features and Advantages

The device offers several key advantages for integration into electronic systems:

1.2 Target Applications and Market

This display is intended for use in ordinary electronic equipment across various sectors. Typical application areas include, but are not limited to:

It is crucial to note that this display is not designed for applications where failure could directly jeopardize life or health (e.g., aviation, medical life-support, critical transportation controls) without prior consultation and specific qualification.

2. Technical Specifications and Objective Interpretation

This section provides a detailed, objective analysis of the device's electrical and optical performance parameters.

2.1 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions, even momentarily. Operation beyond these limits may cause permanent damage.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured under specified test conditions at an ambient temperature (T_a) of 25°C.

Important Note on Luminous Intensity Measurement: The intensity is measured using a sensor and filter combination that approximates the CIE photopic eye-response curve, ensuring the value correlates with human brightness perception.

3. Binning System Explanation

The datasheet indicates that devices are \"categorized for luminous intensity.\" This refers to a binning or sorting process.

4. Performance Curve Analysis

The datasheet references \"Typical Electrical/Optical Characteristics Curves.\" These graphical representations are essential for understanding device behavior under non-standard conditions. Although the specific curves are not provided in the text, they typically include:

5. Mechanical and Package Information

5.1 Package Dimensions

The device has a defined physical outline. All dimensions are in millimeters, with standard tolerances of ±0.25 mm (0.01 inch) unless otherwise specified. The exact dimensional drawing is referenced in the datasheet.

5.2 Pin Connection and Internal Circuit

The display has a 14-pin configuration, with pins 11 and 12 being \"No Pin\" (NC). The internal circuit diagram shows a common-cathode architecture for the rows and individual anodes for the columns, forming the 5x7 matrix. The pinout is as follows:

This pin arrangement must be carefully followed for proper display operation. The common-cathode design means to illuminate a specific dot, its corresponding column anode must be driven high (with current limiting), while its row cathode must be pulled low.

6. Soldering, Assembly, and Storage Guidelines

6.1 Soldering Process

The absolute maximum rating specifies a solder temperature profile: maximum 260°C for a maximum of 3 seconds, measured at a point 1.6mm below the package body. This is a standard rating for through-hole components for wave soldering. For reflow soldering of SMD variants (referenced in storage), a specific profile adhering to the package's Moisture Sensitivity Level (MSL) would be required.

6.2 Storage Conditions

Proper storage is essential to prevent pin oxidation and ensure solderability.

7. Application Design Recommendations and Cautions

The datasheet provides critical guidance for reliable circuit design and use.

8. Operational Principle

The LTP-1057AHR is a dot-matrix LED display. It consists of 35 individual LED elements (5 columns x 7 rows) arranged in a rectangular grid. Each LED (dot) is a semiconductor p-n junction that emits red-orange light when forward biased—a phenomenon called electroluminescence. The specific color is determined by the bandgap energy of the semiconductor material used (GaAsP/GaP or AlInGaP/GaAs as noted). The display is multiplexed: by sequentially activating (sinking current to ground) one row cathode at a time while applying forward current to the appropriate column anodes for that row, an entire character can be displayed. This scan happens faster than the human eye can perceive, creating a stable image while significantly reducing the number of required driver pins compared to individually driving each of the 35 LEDs.

9. Common Design Questions and Answers

Q: What is the purpose of the 1/16 duty cycle rating for luminous intensity?
A: The display is designed for multiplexed operation. The 80mA pulsed current at a low duty cycle (e.g., 1/16) delivers a high instantaneous brightness. When averaged over time and combined with persistence of vision, this creates the perception of a bright, stable display while keeping the average power and heat dissipation per LED within safe limits.

Q: Why is reverse bias so dangerous for this LED display?
A: Applying a reverse voltage beyond the very low maximum (implied by the I_R test at 5V) can cause breakdown of the semiconductor junction. More insidiously, even lower reverse voltages over time can cause electromigration of metal atoms within the chip, leading to increased leakage current or a direct short circuit, permanently damaging the segment.

Q: How do I calculate the required current-limiting resistor for a segment?
A: Use the worst-case forward voltage (V_F max = 2.6V) from the datasheet. For a constant voltage supply (V_supply), the resistor value R = (V_supply - V_F) / I_F. Choose I_F based on desired brightness, ensuring it is below the derated continuous current limit for your operating temperature. For example, with a 5V supply, V_F=2.6V, and I_F=15mA: R = (5 - 2.6) / 0.015 = 160 Ohms. A constant current driver circuit is a more robust solution.

Q: Can I use this display outdoors?
A: The operating temperature range (-35°C to +85°C) allows for many outdoor conditions. However, the device is not inherently waterproof or sealed against dust and moisture. For outdoor use, it must be housed in a properly rated enclosure that protects it from the elements, manages condensation, and possibly includes a sunshield to maintain contrast in direct sunlight.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.