SMD LED Amber 120-Degree Viewing Angle - AlInGaP Technology - 2.05-2.5V @ 50mA - 175mW Power Dissipation - English Datasheet

1. Product Overview

This document details the specifications for a high-brightness, surface-mount device (SMD) LED utilizing Aluminum Indium Gallium Phosphide (AlInGaP) technology to produce amber light. The component is designed for automated printed circuit board (PCB) assembly processes and is suitable for space-constrained applications. It features a diffused lens which contributes to its wide 120-degree viewing angle, making it ideal for applications requiring broad illumination or visibility from multiple angles.

The LED is qualified according to AEC-Q101 standards, making it suitable for use in automotive accessory applications, among others. Its construction and materials comply with ROHS directives. The device is supplied in industry-standard packaging on 8mm tape wound onto 7-inch reels, facilitating high-speed pick-and-place assembly.

2. Technical Parameters Deep Dive

2.1 Absolute Maximum Ratings

The device is rated for operation within specific environmental and electrical limits to ensure reliability and prevent damage. The absolute maximum ratings are specified at an ambient temperature (Ta) of 25°C.

• Power Dissipation (Pd): 175 mW. This is the maximum amount of power the device can dissipate as heat without exceeding its thermal limits.
• DC Forward Current (IF): 70 mA. The maximum continuous forward current that can be applied.
• Peak Forward Current: 100 mA. This is permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) and should not be exceeded.
• Operating Temperature Range: -40°C to +100°C. The ambient temperature range within which the device is designed to function.
• Storage Temperature Range: -40°C to +100°C. The temperature range for non-operational storage.

2.2 Thermal Characteristics

Effective thermal management is critical for LED performance and longevity. The thermal resistance values indicate how easily heat can travel from the semiconductor junction to the surrounding environment or the solder point.

• Thermal Resistance, Junction to Ambient (RθJA): 280 °C/W (typical). Measured on an FR4 substrate (1.6mm thick) with a 16mm² copper pad. A lower value indicates better heat dissipation.
• Thermal Resistance, Junction to Solder Point (RθJS): 130 °C/W (typical). This is often a more relevant metric for board-level thermal design.
• Maximum Junction Temperature (Tj): 125 °C. The temperature at the semiconductor junction must not exceed this limit.

Designers must calculate the expected junction temperature (Tj = Ta + (Pd * RθJA)) to ensure it remains below 125°C under worst-case operating conditions.

2.3 Electro-Optical Characteristics

These parameters define the light output and electrical behavior of the LED under standard test conditions (Ta=25°C, IF=50mA).

• Luminous Intensity (Iv): 2240 - 4500 mcd (millicandela). This is the perceived brightness as measured by a sensor filtered to match the human eye's photopic response (CIE curve). The wide range is managed through a binning system.
• Viewing Angle (2θ½): 120 degrees (typical). Defined as the full angle where luminous intensity drops to half of its on-axis (0°) value.
• Peak Emission Wavelength (λP): 621 nm (typical). The wavelength at which the spectral power distribution is highest.
• Dominant Wavelength (λd): 612 - 621 nm. This single wavelength best represents the perceived color of the LED, derived from its chromaticity coordinates. Tolerance is ±1 nm.
• Spectral Line Half-Width (Δλ): 20 nm (typical). The spectral bandwidth measured at half the maximum intensity, indicating color purity.
• Forward Voltage (VF): 2.05 - 2.5 V at 50mA. The voltage drop across the LED when conducting current. Tolerance is ±0.1 V.
• Reverse Current (IR): 10 μA (maximum) at VR=10V. The device is not designed for reverse-bias operation; this parameter is for test purposes only.

3. Binning System Explanation

To ensure consistency in production runs, LEDs are sorted into bins based on key parameters. The batch label indicates the specific bin codes for Forward Voltage (Vf), Luminous Intensity (Iv), and Dominant Wavelength (Wd).

3.1 Forward Voltage (Vf) Binning

Binned at IF=50mA to aid in current regulation circuit design.

• Bin D: 2.05V - 2.20V
• Bin E: 2.20V - 2.35V
• Bin F: 2.35V - 2.50V

Tolerance within each bin is ±0.1V.

3.2 Luminous Intensity (Iv) Binning

Binned at IF=50mA to control brightness variation.

• Bin X2: 2240 mcd - 2800 mcd
• Bin Y1: 2800 mcd - 3550 mcd
• Bin Y2: 3550 mcd - 4500 mcd

Tolerance within each bin is ±11%.

3.3 Dominant Wavelength (Wd) Binning

Binned at IF=50mA to ensure color consistency.

• Bin 3: 612 nm - 615 nm
• Bin 4: 615 nm - 618 nm
• Bin 5: 618 nm - 621 nm

Tolerance within each bin is ±1 nm.

4. Performance Curve Analysis

While the provided excerpt mentions typical curves, standard LED performance is characterized by several key relationships.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve for an AlInGaP LED is exponential in nature, similar to a standard diode. At the typical operating current of 50mA, the forward voltage falls within the 2.05V to 2.5V range as specified. Designers should use a current-limiting resistor or constant-current driver to ensure stable operation and prevent thermal runaway, as the forward voltage decreases with increasing temperature for LEDs.

4.2 Luminous Intensity vs. Forward Current

The light output (luminous intensity) is approximately proportional to the forward current over a significant range. Operating above the recommended DC current (70mA) will increase light output but will also generate more heat, potentially reducing efficiency (luminous efficacy) and shortening the device's lifespan due to accelerated thermal degradation.

4.3 Temperature Dependence

LED performance is highly temperature-sensitive. As junction temperature increases:

• Luminous Output Decreases: Light output typically drops. The exact coefficient varies but is a critical factor for high-reliability applications.
• Forward Voltage Decreases: This can lead to increased current if driven by a voltage source, creating a positive feedback loop for heat generation.
• Dominant Wavelength Shifts: For AlInGaP LEDs, the wavelength generally shifts slightly with temperature, which may affect color perception in tight-tolerance applications.

Effective heat sinking and thermal design on the PCB are therefore essential to maintain consistent optical performance.

4.4 Spatial Distribution (Viewing Angle)

The spatial radiation pattern is defined by the LED chip architecture and the diffused lens. The 120-degree viewing angle (2θ½) indicates a very wide, Lambertian-like distribution. This pattern is ideal for applications requiring even, wide-area illumination or indicators that need to be visible from a broad range of angles, such as panel lights or status indicators.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The LED conforms to an EIA standard SMD package outline. All critical dimensions for PCB footprint design, such as pad spacing, component height, and lens size, are provided in the detailed package drawing with a general tolerance of ±0.2mm unless otherwise specified. This standardization ensures compatibility with automated assembly equipment.

5.2 Recommended PCB Pad Design

A land pattern (footprint) is provided for both infrared and vapor phase reflow soldering processes. Adhering to this recommended pad geometry is crucial for achieving reliable solder joints, ensuring proper self-alignment during reflow, and facilitating effective heat transfer from the LED's thermal pad (if present) to the PCB.

5.3 Polarity Identification

SMD LEDs typically have a marking on the package to indicate the cathode (negative) side. This is often a green marking, a notch, or a cut corner on the lens or package body. Correct polarity orientation during placement is essential for the device to function.

6. Soldering & Assembly Guidelines

6.1 IR Reflow Soldering Profile

The device is compatible with infrared (IR) reflow soldering processes using lead-free (Pb-free) solder. The recommended profile conforms to J-STD-020 standards. Key parameters include:

• Pre-heat: 150-200°C maximum.
• Pre-heat Time: Maximum 120 seconds.
• Peak Temperature: 260°C maximum.
• Time Above Liquidus: Adheres to profile limits to ensure proper solder joint formation without exposing the LED to excessive thermal stress.

The LED should only be subjected to a maximum of two reflow cycles.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:

• Iron Temperature: Maximum 300°C.
• Soldering Time: Maximum 3 seconds per lead.
• Limit: Only one hand-soldering cycle is permitted to prevent thermal damage to the plastic package and the internal wire bonds.

6.3 Cleaning

Post-assembly cleaning must be performed with care. Only specified alcohol-based solvents like ethyl alcohol or isopropyl alcohol should be used. The LED should be immersed at normal temperature for less than one minute. Harsh or unspecified chemicals can damage the epoxy lens and package material, leading to discoloration or cracking.

7. Storage & Handling Cautions

7.1 Moisture Sensitivity

This product is classified as Moisture Sensitivity Level (MSL) 2a per JEDEC J-STD-020. This means the package can be exposed to factory floor conditions (≤30°C/60%RH) for up to 4 weeks before requiring a bake-out prior to reflow.

• Sealed Bag: Store at ≤30°C and ≤70% RH. Use within one year of the bag seal date.
• Opened Bag: Store at ≤30°C and ≤60% RH. Complete IR reflow within 4 weeks of opening.
• Extended Storage (Out of Bag): Store in a sealed container with desiccant or in a nitrogen desiccator.
• Bake-Out: If exposed for more than 4 weeks, bake at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent "popcorning" during reflow.

7.2 Application Notes

This LED is designed for general-purpose electronic equipment. For applications requiring exceptional reliability where failure could jeopardize safety (e.g., aviation, medical, critical transportation systems), a dedicated technical consultation is mandatory to assess suitability and potential derating requirements.

8. Packaging & Ordering Information

8.1 Tape and Reel Specifications

The device is supplied in embossed carrier tape with a protective cover tape, wound onto 7-inch (178mm) diameter reels. Standard reel quantities are 2000 pieces per reel. The packaging conforms to ANSI/EIA-481 specifications to ensure compatibility with automated feeders. The tape dimensions (pocket size, pitch, etc.) are provided for feeder setup.

9. Application Suggestions

9.1 Typical Application Scenarios

• Automotive Accessories: Interior ambient lighting, dashboard backlighting, switch illumination, and non-critical status indicators.
• Consumer Electronics: Status indicators for routers, modems, printers, and audio/video equipment.
• Portable Devices: Power/battery status indicators in devices where space is at a premium.
• General Signaling: Panel lights, exit signs, and decorative lighting where amber color and wide viewing angle are beneficial.

9.2 Design Considerations

• Current Drive: Always use a constant current source or a current-limiting resistor in series with the LED. Calculate the resistor value using R = (Vsupply - VF) / IF, where VF should be chosen from the maximum value in its bin for a conservative design.
• Thermal Management: For continuous operation at or near maximum current, provide adequate copper area on the PCB connected to the LED's thermal pad (if applicable) or adjacent pads to act as a heat sink. Monitor junction temperature calculations.
• ESD Protection: While not explicitly stated as sensitive, implementing basic ESD precautions during handling and assembly is good practice for all semiconductor devices.

10. Technology Introduction & Trends

10.1 AlInGaP Technology Principle

Aluminum Indium Gallium Phosphide (AlInGaP) is a III-V semiconductor material used primarily for producing high-efficiency LEDs in the red, orange, amber, and yellow wavelength regions (approximately 590-650 nm). By adjusting the ratios of aluminum, indium, and gallium in the active quantum well region, the bandgap of the material can be precisely tuned, which directly determines the peak wavelength of the emitted light. AlInGaP LEDs are known for their high luminous efficacy and good temperature stability compared to older technologies like Gallium Arsenide Phosphide (GaAsP). The diffused lens is typically made of epoxy or silicone and contains scattering particles to widen the beam angle and soften the appearance of the light source.

10.2 Development Trends

The general trend in SMD LED technology is towards higher efficiency (more lumens per watt), increased power density, improved color consistency through tighter binning, and enhanced reliability under harsh conditions (higher temperature, humidity). For amber LEDs, there is ongoing research into alternative materials like phosphor-converted blue LEDs to achieve specific amber shades, though direct-emitting AlInGaP remains dominant for pure spectral colors due to its efficiency. Packaging trends include smaller form factors, improved thermal paths, and lenses designed for specific beam patterns. The drive for automotive interior and exterior lighting, along with general indicator applications, continues to push for components that meet stringent quality standards like AEC-Q101.