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334-15/T2C5-1PSB LED Lamp Datasheet - T-1 3/4 Package - 2.8-3.6V - 20mA - White Light - English Technical Document

Technical datasheet for a high-intensity white LED lamp in a T-1 3/4 package. Details include electro-optical characteristics, absolute maximum ratings, binning information, package dimensions, and application guidelines.
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PDF Document Cover - 334-15/T2C5-1PSB LED Lamp Datasheet - T-1 3/4 Package - 2.8-3.6V - 20mA - White Light - English Technical Document

1. Product Overview

This document details the specifications for a high-luminosity white LED lamp. The device is designed for applications demanding significant light output from a compact, industry-standard package. Its core advantage lies in the combination of a high-performance InGaN semiconductor chip with a phosphor conversion system to produce white light, all housed in a robust and widely adopted form factor.

2. Key Features and Description

2.1 Features

2.2 Description

The LED series is engineered specifically for scenarios requiring high luminous intensity. White light is generated through a phosphor-converted method: the blue light emitted from the indium gallium nitride (InGaN) chip is absorbed by a phosphor material filled in the reflector cup, which then re-emits a broader spectrum of light, resulting in the perception of white light. The water-clear resin lens aids in maximizing light extraction.

3. Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

ParameterSymbolRatingUnit
Continuous Forward CurrentIF30mA
Peak Forward Current (Duty 1/10 @ 1kHz)IFP100mA
Reverse VoltageVR5V
Power DissipationPd110mW
Operating TemperatureTopr-40 to +85°C
Storage TemperatureTstg-40 to +100°C
ESD (HBM)ESD4000V
Zener Reverse CurrentIz100mA
Soldering Temperature (5 sec max)Tsol260°C

4. Electro-Optical Characteristics

These parameters are measured at an ambient temperature (Ta) of 25°C and represent typical device performance under specified test conditions.

ParameterSymbolMin.Typ.Max.UnitCondition
Forward VoltageVF2.8--3.6VIF = 20mA
Zener Reverse VoltageVz5.2----VIz = 5mA
Reverse CurrentIR----50µAVR = 5V
Luminous IntensityIV2850--7150mcdIF = 20mA
Viewing Angle (2θ1/2)----50--degIF = 20mA
Chromaticity Coordinate xx--0.29----IF = 20mA
Chromaticity Coordinate yy--0.28----IF = 20mA

5. Binning System Explanation

To ensure consistency in applications, LEDs are sorted (binned) based on key performance parameters.

5.1 Luminous Intensity Bins

LEDs are categorized into bins defining a minimum and maximum luminous intensity measured at 20mA. The tolerance is ±10%.

Bin CodeMin. (mcd)Max. (mcd)
P28503600
Q36004500
R45005650
S56507150

5.2 Forward Voltage Bins

LEDs are also binned according to their forward voltage drop at 20mA, with a measurement uncertainty of ±0.1V.

Bin CodeMin. (V)Max. (V)
02.83.0
13.03.2
23.23.4
33.43.6

5.3 Color (Chromaticity) Bins

The white light color is defined within specific regions on the CIE 1931 chromaticity diagram. The provided color ranks (A1, A0, B3, B4, B5, B6, C0) specify the quadrilateral boundaries for the x and y coordinates, ensuring the emitted white light falls within a controlled color space. The measurement uncertainty for coordinates is ±0.01. A group code (e.g., \"1\") may combine several adjacent color bins for broader selection.

6. Performance Curve Analysis

Graphical data provides insight into device behavior under varying conditions.

6.1 Relative Intensity vs. Wavelength

The spectral power distribution curve shows a broad peak characteristic of phosphor-converted white LEDs, typically centered in the blue region (from the chip) with a broader yellow-green emission from the phosphor.

6.2 Directivity Pattern

The radiation pattern illustrates the 50-degree viewing angle (full width at half maximum), showing the angular distribution of light intensity.

6.3 Forward Current vs. Forward Voltage (I-V Curve)

This curve demonstrates the exponential relationship typical of a diode. The forward voltage increases with current, and designers must ensure the driving circuit provides adequate voltage, especially considering the voltage bin spread.

6.4 Relative Intensity vs. Forward Current

Luminous output increases with forward current but not linearly. Operating above the recommended continuous current (20mA typ.) may yield higher light output but will reduce efficiency and potentially affect long-term reliability due to increased junction temperature.

6.5 Chromaticity Coordinate vs. Forward Current

The color coordinates (x, y) may shift slightly with changes in drive current, which is an important consideration for applications requiring stable color perception across dimming levels.

6.6 Forward Current vs. Ambient Temperature

This derating curve is critical for thermal management. It indicates the maximum allowable forward current as the ambient temperature rises, preventing overheating and ensuring longevity.

7. Mechanical and Package Information

7.1 Package Dimensions

The LED uses a standard T-1 3/4 radial leaded package. Key dimensions include the body diameter (approximately 5mm), lead spacing (measured where leads exit the package), and overall height. A detailed dimensioned drawing is essential for PCB footprint design, ensuring proper fit and alignment. Notes specify a maximum resin protrusion under the flange of 1.5mm and standard dimensional tolerances.

7.2 Polarity Identification

The cathode is typically identified by a flat spot on the rim of the LED lens or by the shorter lead. Correct polarity must be observed during installation.

8. Soldering and Assembly Guidelines

8.1 Lead Forming

8.2 Storage Conditions

8.3 Soldering Recommendations

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

A recommended soldering temperature profile is provided to minimize thermal shock.

9. Packaging and Ordering Information

9.1 Packing Specification

LEDs are packed in anti-static bags to protect against ESD. Packing quantities are flexible: typically 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per master (outside) carton.

9.2 Label Explanation

Labels on packaging include codes for: Customer Part Number (CPN), Part Number (P/N), Quantity (QTY), combined ranks for Luminous Intensity and Forward Voltage (CAT), Color Rank (HUE), Reference (REF), and Lot Number (LOT No).

9.3 Model Number Designation

The part number 334-15/T2C5-1PSB follows a specific coding system where segments likely indicate the series, color (white), luminous intensity bin, forward voltage bin, and other attributes like packing style. The exact breakdown should be confirmed with the supplier for precise ordering.

10. Application Suggestions

10.1 Typical Applications

10.2 Design Considerations

11. Technical Comparison and Differentiation

Compared to standard 5mm LEDs, this device emphasizes high luminous intensity. Its key differentiators are the specific InGaN chip technology and phosphor system optimized for brightness. The inclusion of detailed binning for intensity, voltage, and color provides designers with tighter control over application consistency compared to unbinned or broadly binned alternatives. The 4KV ESD rating offers better handling robustness than many basic LEDs.

12. Frequently Asked Questions (Based on Technical Parameters)

12.1 What is the recommended operating current?

The electro-optical characteristics are specified at 20mA, which is the typical recommended operating point for balancing brightness, efficiency, and longevity. It can be driven up to the absolute maximum of 30mA continuous, but with reduced efficacy and increased thermal stress.

12.2 How do I interpret the luminous intensity bins?

If your design requires a minimum brightness, select a bin where the \"Min.\" value meets your requirement. For example, choosing bin \"R\" guarantees an intensity between 4500 and 5650 mcd at 20mA. Using a higher bin (like \"S\") will generally yield brighter LEDs but may come at a higher cost.

12.3 Why is there a Zener Reverse Voltage parameter?

Some LED designs incorporate a reverse-protection Zener diode integrated into the package. The Vz parameter indicates the typical breakdown voltage of this protection device if present. It helps in understanding the reverse characteristics of the component.

12.4 How critical is the 3mm soldering distance rule?

This is very important. Soldering closer than 3mm to the epoxy body can transfer excessive heat, potentially cracking the epoxy lens, degrading the internal phosphor, damaging the wire bonds, or delaminating the chip. This directly impacts reliability and light output.

13. Operational Principle

This is a phosphor-converted white LED. An InGaN semiconductor chip emits blue light when forward biased (electroluminescence). This blue light strikes a layer of yellow (or yellow and red) phosphor particles embedded in the encapsulant. The phosphor absorbs some of the blue photons and re-emits light at longer wavelengths (yellow, red). The combination of the remaining blue light and the broad-spectrum phosphor emission is perceived by the human eye as white light. The exact shade (correlated color temperature) is determined by the ratio of blue to phosphor-converted light, controlled by the phosphor composition and concentration.

14. Technology Trends

The industry trend for discrete indicator LEDs like this one continues towards higher efficiency (more lumens per watt), improved color rendering index (CRI) for better color fidelity, and tighter binning tolerances for greater application consistency. There is also a drive towards more robust packaging to withstand higher temperature reflow soldering processes used in surface-mount assembly, although this particular device is a through-hole component. The underlying InGaN chip technology remains the industry standard for blue and white LEDs due to its high efficiency and reliability.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.